DATE: 22-NOV-2004 TO: ADCO Circuits Inc. FROM: Dan Edmunds Physics Department Michigan State University RE: Assembly of the ADF-2 circuit board ------------------------------- --- Good for Production --- ------------------------------- ADF-2 Circuit Board Rev A Assembly --------------------------------------- This bid request is for the assembly of the ADF-2 circuit board. This circuit board is in the final stage of design and we hope to be able to provide all of the design data by the first week of November. At this time we would like to have 10 ADF-2 circuit boards assembled on a fast turn around bases. Later in early January we would like 90 additional cards assembled with a standard turn around time. Description of the Assembly of the ADF-2 Circuit Boards ----------------------------------------------------------- The ADF-2 circuit board is 160 mm by 233.35 mm (VME 6U size). It has surface mount components on both sides. The components on the top surface include two BGA devices with 456 pads on 1.0 mm centers. There are a total of 1454 surface mount components on the ADF-2 card. In addition to the surface mount components each card has two through hole connectors (reference designators P1 and P2). Each of these connectors has 160 pins and is held in place with two metric screws. There is a third connector (P3) which is of the "press in" type. If the assembly vendor does not have the proper tooling to mount this connector then we will take care of mounting it ourselves. A drawing showing the general layout of the ADF-2 card is available on the web as either a pdf or ps file. The top side traces, pads, and silk screen can be seen in the file: www.pa.msu.edu/hep/d0/ftp/run2b/l1cal/hardware/adf_2/drawings/ adf_2_circuit_board_1.pdf adf_2_circuit_board_1.ps A file that, for each reference designator, describes the X,Y location, orientation, foot print, and that component's project part number is available on the web at: www.pa.msu.edu/hep/d0/ftp/run2b/l1cal/hardware/adf_2/manufacturing/ adf_2_component_placement_data.txt A file, in excel format, that describes each part that the assembly vendor must actually mount onto the circuit board is available on the web at: www.pa.msu.edu/hep/d0/ftp/run2b/l1cal/hardware/adf_2/manufacturing/ adf_2_assembly_parts_list.xls The columns in this spreadsheet are: Item#; Customer P/N; Description; Manufacturer Name; Manufacturer Part Number; Quantity per Card. A more general parts information file for the ADF-2 card that contains the above information plus suggested vendors for each part, and the reference designators for each part, plus some mechanical parts that will not be handled by the assembly house is available on the web at: www.pa.msu.edu/hep/d0/ftp/run2b/l1cal/hardware/adf_2/general/ adf_2_parts_information.txt We have purchased all of the components for this assembly work and will deliver then to the assembly vendor as a kit. We were able to obtain most of the components on tape and reel. Some of the IC's were only available in tubes and were purchased in that packaging. We are happy to either take care of having the raw pcb's manufactured ourselves or else also turn that task over to the assembly vendor. In any case we are interested in any specific recommendations or requirements that the assembly vendor has about pad geometries used for the high density SMD components. A description of the manufacturing of the ADF-2 raw pcb's is available on the web at: www.pa.msu.edu/hep/d0/ftp/run2b/l1cal/hardware/adf_2/manufacturing/ adf_2_pcb_manufacture.txt Data for the two solder paste masks will be provided to the assembly vendor in Gerber format. The assembly vendor is responsible for making the paste masks. We are happy to adjust the paste mask Gerber data to indicate any special pad opening sizes that the assembly vendor recommends. We are interested in working to get a purchase order in place for the assembly of the ADF-2 cards during the first week of November. Contact and Shipping Information: Daniel Edmunds Physics Department Rm 2150 Bio-Medical Physical Sciences Bldg. Michigan State University East Lansing, MI 48824-2320 Phone: (517) 355-9200 ext 2521 Email: edmunds@pa.msu.edu FAX: (517) 355-6661 Backup Contact: Jason Biel Phone: (517) 355-9200 ext 2520 Email: biel@pa.msu.edu