CMX Circuit Board Request for Bids ------------------------------------- Rev. 13-Jan-2013 This note is a description of the CMX circuit board assembly work for which we are currently seeking bids. The CMX is a large card 400.0 mm by 366.7 mm with about 1502 components on it. We are looking for an assembly vendor who will take care of both obtaining the bare pcb cards and then assembling the components onto these cards. The design data to build the CMX cards should be available in the first quarter of 2013. Quantity and Schedule: We would like to build 4 prototype cards within the next few months and then build 18 production cards after we have tested the 4 prototypes. The production build of 18 card is expected to be in the summer of 2013. We hope to use the exact same pcb layout for the production build as we use for the 4 prototype cards. CMX Bare Circuit Board: We are requesting that the selected assembly vendor procure the bare circuit boards. We are doing this so that the assembly vendor can be confident of the quality of the bare cards and to insure that the bare cards have the required rails and other features to fit with their assembly process. We encourage and are willing to pay for the assembly vendor to obtain high quality bare cards with the required surface treatment to insure an optimum SMD solder re-flow assembly. A full description of the CMX pcb is at the end of this document. Versions of the CMX Card: During the prototype build of 4 cards we would like 3 versions of the card assembled. 1 of the 4 cards will not have components U1 and U2 on it. 1 of the 4 cards will not have component U2 on it 2 of the 4 cards will have all components. During the production build of 18 cards we would like 2 versions of the card assembled. 14 of the 18 cards will not have component U2 on it 4 of the 18 cards will have all components. Assembly Components: About 1502 components are to be assembled onto each CMX card. There are 69 component types to be assembled onto the CMX cards. The bulk of these components are SMD type. For the CMX card we are happy to either supply a complete kit of components or have the assembly vendor purchase the components. We realize that some assembly houses strongly prefer one method of building cards over the other so your company can bid this project as either "turn key" or "kit" (or bid it both ways) whichever way your company is most comfortable working. The list of components that are to be assembled onto each bare CMX pcb is show in the following 2 files: cmx_bill_of_materials.txt cmx_component_part_numbers.txt Note that in any case MSU will supply 7 of the component types. MSU will supply these 7 component types because they are either: a custom part, a specialized hard to obtain part, or they were already purchased for the CMX card assembly. These 7 MSU supplied component types are listed below and are so noted in the bill of materials and component part number files mentioned above. The 7 MSU supplied component types are: CMX Component Quantity Part Number per Card ----------------- --------- Conn_HM_6x19 6 Conn_HM_6x25 2 Conn_HM_1x3 1 IC_MAX1668 1 IC_Vectron_FX_40 1 IC_Vectron_FX_320 1 IC_XCCACE 1 SMD Components: There are SMD components on both the top and bottom of this card. The smallest package that is used is 0402 capacitors and resistors. The largest package is a 1760 pin FPGA. All of the bottom side components are resistors or bypass capacitors. On each card there is a total of 1479 SMD components. 916 capacitors, 14 sockets, 30 inductors, 410 resistors, and 109 semiconductors Through Hole Solder Components: There is a total of 15 THD Solder components on each CMX card. All of these components mount from the top side of the card. The highest pin count THD Solder components are 2 connectors with 68 pins each. 8 of these THD Solder components are connectors that are located on either the front or back edge of the card. The other 7 THD Solder components are Texas Instruments Power Trends power supply modules that are located along the top edge of the card. Through Hole Press Fit Components: The back edge of this card holds 8 Press-Fit connectors (a mix of 138 pin and 105 pin). These are Press-Fit installed no-solder connectors. If the assembly vendor can not install these Press-Fit components then they should bid this assembly job and indicate that this part of the work will not be done. RoHS: This card can be either a lead or no-lead build. Note: The 5 FCI type 55714 Meg-Array BGA Connectors have versions that are specific for lead or no-lead assembly process. Testing: We do not expect the assembly vendor to do any testing of these cards. We expect only the normal assembly, inspection, and cleaning of these cards. First Article: We do not require a "first article" card for this build but we are prepared to immediately examine and test a first article card if you prefer to make one. Assembly Data: We will provide the normal assembly data, bill of material, assembly drawings, and the component X,Y center data for all SMD components. All data is in mm. Because the CMX card needs to go through an engineering review process before being released for assembly there maybe some small changes between the data being presented for this bid and the final released data for assembly. We understand that any significant changes in the design may require an adjustment in the assembly costs. CMX Bare Circuit Board Specifications: Circuit Board Size: rectangular 400mm in X by 366.7mm in Y Layers: 22 Most of the card is alternating trace and ground plane layers. Controlled Impedance: Physical Layers 1, 3, 5, 7, 9, and 20 have both 50 Ohm and 65 Ohm single ended traces and 100 Ohm differential trace pairs. Layer Summary: Physical Layer Function -------- ----------------------------------------------- 1 Signal Layer #1 50 & 65 Ohm SE 100 Ohm Diff 2 Ground Plane 3 Signal Layer #2 50 & 65 Ohm SE 100 Ohm Diff 4 Ground Plane 5 Signal Layer #3 50 & 65 Ohm SE 100 Ohm Diff 6 Ground Plane 7 Signal Layer #4 50 & 65 Ohm SE 100 Ohm Diff 8 Ground Plane 9 Signal Layer #5 50 & 65 Ohm SE 100 Ohm Diff 10 Ground Plane 11 Power Fills 12 Power Fills 13 Ground Plane 14 Signal Layer #6 and Power Fills 15 Ground Plane 16 Signal Layer #7 and Power Fills 17 Ground Plane 18 Signal Layer #8 and Power Fills 19 Ground Plane 20 Signal Layer #9 50 & 65 Ohm SE 100 Ohm Diff 21 Ground Plane 22 Signal Layer #10 At this time there are only 2 copper patterns for the 10 Ground Planes layers. Material: The laminate dielectric material must be appropriate for carrying high frequency 6.5 GHz digital signals. We assume that this will be a quality high frequency low dielectric loss material that the bare pcb vendor is comfortable working with. Thickness: The nominal thickness will be in the range of 2.6 mm. A strip along the top edge and another strip along the bottom edge of the card must be milled from the back side to a thickness of 1.6 mm to allow insertion into card guides Copper Weight: 1/2 oz minimum on all Signal and Ground Plane layers. 1 oz minimum on all layers with Power Fills i.e. Physical Layers 11, 12, 14, 16, 18. Blind vias: This card has one type of blind via that connects only layers 1 through 6, blind via count about 250, nominal drill 0.20 mm. Total Drill Counts: Total Plated Hole Count: 10,201 Number of Plated Hole Sizes: 10 Total Un-Plated Hole Count: 95 Number of Un-Plated Hole Sizes: 9 The bulk of the Plated Holes are nominal 0.30 mm diameter for 0.60 mm land diameter vias in the BGA arrays or 0.65 mm land diameter vias for normal signal routing. Traces and Clearances: In the 1 mm pitch BGA breakout there are 0.13 mm traces with a minimum of 0.13 mm clearance to the nearest copper. Outside of the BGA breakout wider traces and clearances are used except where dictate for controlled impedance traces. Surface Finish: The surface finish should be selected to allow optimum SMD component assembly. I assume that this will be gold finish of some type. Bare card electrical test: All cards 100% tested for continuity