CMX  Assembly Description  Request for Bids
        ---------------------------------------------

                                              Rev. 30-Aug-2013

                 ***  Good for Bid Only ****
                 *** Not for Production ****


This note is a description of the CMX circuit board assembly
work for which we are currently seeking bids.  The CMX is
a large card  400.0 mm by 366.7 mm  with about 1813 components
on it.  We are looking for an assembly vendor who will take
care of both obtaining the bare pcb cards and then assembling
the components onto these cards.  A draft version of the
design data for the CMX card is available on the web at:

   http://www.pa.msu.edu/hep/atlas/l1calo/cmx/hardware/

                           manufacturing/draft_for_bid_only/

This is only a draft version of the design data but we do
not expect any significant changes between this draft data
for bids and the data that we will release for the actual
build of the CMX circuit cards.


Quantity and Schedule:

  We expect to release the final version of the design data
  about September 23 of this year.

  We would like to build  4  prototype cards with a one
  month turn around from when the final design data, the
  Purchase Order, and the full parts kit are all in place.

  We then want to build 20 more cards starting sometime
  in early 2014.  We hope to use the exact same pcb layout
  for the production build of 20 cards as we used for the
  4 prototype cards.


CMX Bare Circuit Board:

  We are requesting that the selected assembly vendor
  procure the bare circuit boards.  We are doing this
  so that the assembly vendor can be confident of the
  quality of the bare cards and to insure that the bare
  cards have the required rails and other features to
  fit with their assembly process.

  We encourage and are willing to pay for the assembly
  vendor to obtain high quality bare cards with the
  required surface treatment to insure an optimum SMD
  solder re-flow assembly.  We assume that this will
  be a gold finish.

  A full description of the CMX pcb is given in a
  separate document in this set of design files.


Versions of the CMX Card:

  During the prototype build of 4 cards we would like 3
  versions of the card assembled.
    1 of the 4 cards will not have components U1 and U2 on it.
    1 of the 4 cards will not have component U2 on it
    2 of the 4 cards will have all components.

  During the production build of 20 cards none of them
  will have component U2 installed on them.


CMX Card Components:

  The bulk of the components used on the CMX card are surface
  mount devices.  A small number of through hole devices are
  also used - mostly connectors and power supply modules.

  All of the components that are used on the CMX circuit
  board are included in the following 2 files that are part
  of the technical data that was release for this bid:

    cmx_bill_of_materials.txt
    cmx_component_descriptions.txt


SMD Components:

  In total 1790 SMD components are used on each CMX card.
  In total there are 69 SMD component types used on CMX.

  On the top side of the card there are 942 SMD components
  of 67 different component types.

  On the bottom side of the card there are 848 SMD components
  of 14 different types.

  There are a number of files in this set of design data
  that describe the SMD components used on the CMX circuit
  board and their placement.  These files are:

     cmx_smd_placement_by_reference_number.txt
     cmx_smd_placement_by_reference_number.xlsx
     cmx_smd_placement_top_side.txt
     cmx_smd_placement_bottom_side.txt

  The file  cmx_smd_placement_by_reference_number.xlsx
  is a spreadsheet version of the data in the file
  cmx_smd_placement_by_reference_number.txt


Through Hole Components:

  In total 23 THD components are used on each CMX card.

  There are 9 different types of THD components on the
  CMX card.  Some of these THD components are solder type
  and some of them are press-fit type connectors.

  In this technical design data a full description of the
  THD components is given in the file:

     cmx_thd_components.txt

  If an assembly vendor does not have the correct press and
  tooling to install these Press-Fit components then they
  should go ahead and bid this assembly job and indicate
  that this part of the work will not be done.


RoHS:

  This card can be either a lead or no-lead build.

  Note:  I believe that some of the components will have
  a tin-lead finish and that most will have a matte tin
  finish.


Testing:

  We do not expect the assembly vendor to do any testing of
  these cards.  We expect only the normal assembly, inspection,
  and cleaning of these cards.


First Article:

  We do not require a "first article" card for this build
  but we are prepared to immediately examine and test a first
  article card if you prefer to make one.


Assembly Data:

  We will provide the normal assembly data, bill of materials,
  assembly drawings, and the component X,Y center and
  orientation data for all SMD components.  All data is in mm.

  The technical design data that was released for this bid
  process is very similar to the data that we will release for
  the actual build of the CMX cards.  Please let us know if
  you need this technical data in some other format.


Technical Contacts and Shipping Information:

  Dan Edmunds                    Philippe Laurens
  Phone: (517) 884-5521          phone: (517) 884-5522
  Email: edmunds@pa.msu.edu      Email: laurens@pa.msu.edu
  FAX:   (517) 355-6661          FAX:   (517) 355-6661


  Physics Department  Rm 2150
  Bio-Medical Physical Sciences Bldg.
  567 Wilson Road
  Michigan State University
  East Lansing, MI  48824-2320