CMX Assembly Changes - Prototype to Production:
  -------------------------------------------------

                                                  5-May-2014



 1. The 7 power supplies across the top of the card
    will remain THD components.


 2. You have added board fiducial marks to the bottom and
    top side of the pcb; around outside edge, all 4 corners.


 3. Changed the J13 and J14 components from Molex 87832-4020
    to  3M  957240-2000-AR-TP.


 4. Issue of soldering J9 and J12:
       J9 is heavy high current rear power connector
      J12 is front panel low current signal connector


 5. Must keep the 0201 size capacitors by MP3, MP4, MP5.


 6. Please rotate  U353  and  U354  by 180 degrees  from
    the orientation specified in the SMD placement data
    that was released for the prototype build.

    On the production cards, when correctly placed, the pin
    number 1 dot on components U353 and U354  will NOT match
    the pin number 1 designator shown in the silkscreen.


 7. The CMX production build is for a total of 20 cards:
      All 20 cards have U1 installed
       On 18 cards U2 is NOT installed
       On  2 cards U2 is installed.


 8. Please do  not  install the following 12 resistors
    on the production cards:

      R455,  R456
      R459,  R460,  R461,  R462
      R463,  R464,  R465,  R466
      R469,  R470


 9. The 4 components SFP1 through SFP4 consist of a SMD
    reflow soldered connector  and  a press fit metal cage.

      Please do  not install the metal CAGES for SFP
      components SFP3 and SFP4 on the production cards.

      Please install the SMD reflow soldered connector
      on all 4 SFP components.


10. Concern about the full insertion and flatness of
    the backplane press-in connectors  J1 through J8.