Good for Production


          HTM Card  Assembly Description
         --------------------------------


                                           Rev.  24-Apr-2018


The HTM card is a large circuit board with overall dimensions
of 280.0 mm in X  by  322.25 mm in Y.   There are about  335
components  to be mounted on each HTM circuit board by the
assembly company.  The assembly vendor will also take care
of obtaining the bare pcb cards.


Quantity and Schedule:

  This build is for 20 fully assembled HTM cards.

  No further builds of the HTM are planned at this time.



HTM Bare Circuit Board:

  We are requesting that the assembly vendor procure the
  bare circuit boards.  We are doing this so that the
  assembly vendor can be confident of the quality of the
  bare cards and to insure that the bare cards have the
  required rails and other features to fit with their
  assembly process.

  We encourage and are willing to pay for the assembly
  vendor to obtain high quality bare cards with the
  required surface treatment to insure an optimum SMD
  solder re-flow assembly.  We assume that this will
  be a gold finish.

  We are happy to be involved in discussions with the
  bare board vendor to verify that the bare HTM pcb
  will match our understanding of the requirements.

  We need to approve the stack up that will be used
  in the HTM bare pcb.

  A full description of the HTM pcb is given in a
  separate document in the HTM Card manufacturing
  web directory.   Please see the file:

      aaa_htm_bare_pcb_description.txt


  We assume that the assembly house will be purchasing
  21 bare HTM PCBs:  20 to build on  and  1 for Thermal
  Profile study.



Versions of the HTM Card:

  There is only one version of the HTM card.
  All 20 HTM card are to be built the same way.



HTM Card Components:

  The bulk of the components used on the HTM card are
  surface mount devices (SMD).   A small number of through
  hole devices (THD) are also used.   All of the THD
  components are either connectors or power supply modules.

  All of the components  (both SMD and THD)  that are used
  by the assembly vendor to build the HTM circuit boards
  are included in the following 2 files:

     htm_assembly_house_bill_of_materials.txt

     htm_component_descriptions.txt



SMD Components:

  In total 327 SMD components are placed on each HTM card.

     On the top side of the card there are  217  SMD
     components of  32  different component types.

     On the bottom side of the card there are  110  SMD
     components of  14  different component types.

  Files that describe the location and counts of the
  the HTM Card's SMD components are:

     htm_smd_xy_placement_data_top.txt
     htm_smd_xy_placement_data_bottom.txt

     htm_smd_component_counts_top.txt
     htm_smd_component_counts_bottom.txt



Through Hole Components:

  Each HTM card has a total of 8 THD components.
  These THD components are a mix of Solder-In and
  Press-In types.

     There are 4 Press-In THD components.  These are
     3 different types of press-in connectors.

     There are 4 Solder-In THD components.  These are
     2 types of connectors and 1 type of power supply
     module.

  Details about the THD components used on the HTM
  card are given in the file:

     htm_thd_components.txt



Not Installed Components:

  There are about  29  locations on the HTM Card that
  include silkscreen reference designators where the
  assembly vendor will  not  be placing components during
  the HTM Card build.  All of the Not Installed components
  are listed in the file:

     htm_not_installed_components.txt



Kit Build:

  This is a kit build.  We will provide all of the SMD
  components on tape and reel or in trays.  We understand
  that there could be a charge for any components that are
  not provided in appropriate packaging for automatic
  assembly machines.  A full inventory of the kit will be
  provided.



RoHS:

  I assume that it will be a no-lead build.

  I believe that all of the components have a
  no-lead finish.



Testing:

  We do not expect the assembly vendor to do any testing
  of these cards.  We expect only the normal assembly,
  inspection, and cleaning of these cards.



First Article:

  We do not require a "first article" card for this build
  but we are prepared to immediately examine a first article
  card if the assembly vendor prefers to make one.  We could
  examine a first article card either at MSU or at the
  assembly vendor's location.



Assembly Data:

  The assembly data files for the HTM Cards are available
  in the web directory:

  https://web.pa.msu.edu/hep/atlas/l1calo/htm/hardware/manufacturing/release_2/


  All assembly data is in mm and the files have a current date
  in April 2018.   Please let me know if you need any other
  technical data about the HTM card.



Technical Contact for the HTM Module:

  Dan Edmunds

  Phone: (517) 884-5521
  Email: edmunds@pa.msu.edu


  Physics Department  Rm 2150
  Bio-Medical Physical Sciences Bldg.
  567 Wilson Road
  Michigan State University
  East Lansing, MI  48824-2320