//
//  file:  cap_1206_THD
//
//  Original Rev.  18-May-2016    made for the Hub Module
//
//
//  Geometry for the  1206  THD  Kemet Capacitor    Through Hole Device
//                   ----------------------------
//
//  This  1206 Capacitor geometry comes from the Kemet Specification.
//  I do not know how close this is to an IPC 1206 capacitor.
//
//    The 1206 courtyard is  4.70 mm in X  by  2.30 mm in Y.
//    The center to center distance between pads is  3.00 mm
//    The pad  width  (our X dimension)  is  1.15 mm.
//    The pad height  (our Y dimension)  is  1.80 mm.
//
//  Thus we (not IPC) call this pad  1.15 mm in X  by  1.80 mm in Y.
//
//
//
//   This is a geometry for the  cap_1206  ceramic capacitor
//   that includes its own Through Hole Device pins.
//
//     - Each SMD pad on this geom has a THD terminal pin.
//
//     - THD pin #1 is connected to the  left-hand SMD pad.
//     - THD pin #2 is connected to the right-hand SMD pad.
//
//     - Each THD Pin is a 1.2 mm wide trace on the Breakout
//       layer  that connects the SMD pad to a 1.1 mm
//       diameter land pin-stack.
//
//     - The pin-stacks contain only the THD pin definition.
//       The "traces" and SMD pads are on the Breakout layer and
//       are in a separate section of this overall geometry.
//
//
//   This geometry is being made for the array of  10 uFd  25 Volt
//   ceramic capacitors at the input to the DCDC Converters on the
//   Hub Module.
//
//   The long axis of this geometry is Horizontal.
//
//



$abort_enable = @false;
$$lock_windows(@on) ;
$$snap_diagonal(@off) ;
$$snap_orthogonal(@off) ;


//----------------------------------------------------------------------------

//   1.10 mm Land diameter padstack for the  Cap_1206_THD
//
//     0.60 mm  drill
//     1.10 mm  pad land
//     1.60 mm  plane relief
//     0.90 mm  soldermask opening
//
//     --> the thickness of the donut wall is           0.25 mm
//     --> the plane isolation air gap to the pad is    0.25 mm


$$create_pin("Term_Cap_1206_THD", @replace);

$$page(0.0,0.0,0.0, @mm, 0.0, 0.0, [0.0, 0.0, 'PI$Term_Cap_1206_THD']);

$$point_mode(@vertex);

$$attribute( "TERMINAL_THRUHOLE_DEFINITION", "");

$$attribute( "TERMINAL_DRILL_SIZE", "", , @scale , , [ 0.60,  0.0 ]);

$$circle( "PAD",         0.0, 0.0,  1.10,  0.0);

$$circle( "SIGNAL",      0.0, 0.0,  1.10,  0.0);

$$circle( "POWER",       0.0, 0.0,  1.60, 0.0);

$$circle( "SOLDER_MASK", 0.0, 0.0,  0.90,  0.0);

//----------------------------------------------------------------------------


//
//   Now the actual geometry for the  Cap_1206_THD
//


$$create_component("Cap_1206_THD", @replace);

$$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'CO$Cap_1206_THD'] );

$$point_mode(@vertex); 

$$attribute( "COMPONENT_LAYOUT_TYPE", "surface");

$$attribute( "COMPONENT_LAYOUT_SURFACE", "both");

$$attribute( "COMPONENT_HEIGHT", "", , @scale , , [0.028, 0.0]);




//
//  Component Placement Outline for the  Cap_1206_THD
//

$$initial([  -2.40,  -1.20 ], , @nosnap );
$$terminal([ -2.40,   1.20 ] );
$$terminal([  2.40,   1.20 ] );
$$terminal([  2.40,  -1.20 ] );

$$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale );




//
//   Silkscreen Pattern
//

$$template_line_style( @Solid );

$$path( "SILKSCREEN", 0.20, , [ -2.10,  1.20,    2.10,  1.20 ]);
$$path( "SILKSCREEN", 0.20, , [ -2.10, -1.20,    2.10, -1.20 ]);




//
// Reference Designator is on the SILKSCREEN layer.
//

$$text( "SILKSCREEN", "^$ref", 0.0, 0.0, 1.5, @CC, 0, 0.7, 0.20, "std", "None", 0.0, 0.0 );




//
//   Now add the two SMD Pads on Breakout layer.
//

//     Left Positive SMD Pad

$$polygon( "BREAKOUT", ,    [ -0.92, -0.90,   -2.08, -0.90,   -2.08, 0.90,   -0.92, 0.90 ]);

$$polygon( "SOLDER_MASK", , [ -0.87, -0.95,   -2.13, -0.95,   -2.13, 0.95,   -0.87, 0.95 ]);

$$polygon( "PASTE_MASK", ,  [ -0.92, -0.90,   -2.08, -0.90,   -2.08, 0.90,   -0.92, 0.90 ]);


//     Right Negative SMD Pad

$$polygon( "BREAKOUT", ,    [  0.92, -0.90,    2.08, -0.90,    2.08, 0.90,    0.92, 0.90 ]);

$$polygon( "SOLDER_MASK", , [  0.87, -0.95,    2.13, -0.95,    2.13, 0.95,    0.87, 0.95 ]);

$$polygon( "PASTE_MASK", ,  [  0.92, -0.90,    2.08, -0.90,    2.08, 0.90,    0.92, 0.90 ]);




//
//   Now add the "traces" on the Breakout layer
//   that connect the SMD Pads to the THD pins.
//

//     "Trace" for the Left side

$$path(   "BREAKOUT", 1.20, , [ -1.500,  0.000,   -1.500,  1.700 ] );


//     "Trace" for the Right side

$$path(   "BREAKOUT", 1.20, , [  1.500,  0.000,    1.500,  1.700 ] );




//
//  Define the two pins on the  Cap_1206_THD:
//    pin #1 is to the left,  pin #2 to the right,  the axis is horizontal
//

$$attribute( "COMPONENT_PIN_DEFINITION",    "1", , @scale , , [ -1.50,  1.70 ]);

$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "1,  Term_Cap_1206_THD");


$$attribute( "COMPONENT_PIN_DEFINITION",    "2", , @scale , , [  1.50,  1.70 ]);

$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "2,  Term_Cap_1206_THD");