// // File: diff_pair_through // // Date: 10-Jun-2015 original version - made for Hub Module // // 4-Jun-2016 Adjust Solder Mask openings for normal // "Un-Tenting" of all Pin/Pad Stack Via Lands. // 0.125 mm edge of Solder Mask to edge of Drill Hole. // Relieve Solder Mask on Both Sides. // // 10-Jun-2016 Remove the Reference Designator in SilkScreen. // // 14-Jun-2016 Add the "Component_not_in_bom" attribute to // Remove all instances of this component from the BOM. // // 27-Aug-2016 Remove the Silkscreen component outline. // // 12-Jan-2017 Finnal change to a 0.52 mm pad and 0.25 mm Drill // for just the High-Speed differential pin pair. // // // // // Geometry for a high-speed through board differential via pair // with return vias on either side. // // // This is not a component that the assembly house installs on the // card so its Reference Designator is not shown on SilkScreen. // // This component has the Not in BOM attribute. // // This Diff_Pair_Through board geometry includes a cutout of // the Gerber negative data Ground Plane. This cutout is provided // by a "path" on layer PREPREG_3. // // The long axis of this part is horizontal with pin #1 to the left. // // Pins #1 and #4 need to be tied to Gnd in the net list. // // Pins #2 and #3 are the differential pair. // // $abort_enable = @false; $$lock_windows(@on) ; $$snap_diagonal(@off) ; $$snap_orthogonal(@off) ; //---------------------------------------------------------------------------- // // Diff_Pair_Through Ground Pin Geometry (same as 0mm60 Via) // // Special Small 0.60mm Land Diameter routing via for the CMX card. // // // 0.30 mm finished hole diameter // 0.60 mm land pad // 0.87 mm plane relief // 0.55 mm soldermask opening // // --> ring width 0.150 mm // // --> plane isolation Air Gap 0.135 mm // from the pad // // --> plane isolation Air Gap 0.285 mm // from edge of drill hole // // // "NOT Tented" via, i.e. there IS an opening in the solder mask // $$lock_windows(@on); $$create_pin("DIFF_PAIR_THRU_GND_PAD"); $$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'PI$DIFF_PAIR_THRU_GND_PAD'] ); $$point_mode(@vertex); $$attribute( "TERMINAL_THRUHOLE_DEFINITION", "default"); $$attribute( "TERMINAL_DRILL_SIZE", "", , @scale , , [ 0.30, 0.0 ]); $$circle( "SIGNAL", 0.0, 0.0, 0.60, 0.0 ); $$circle( "PAD", 0.0, 0.0, 0.60, 0.0 ); $$circle( "POWER", 0.0, 0.0, 0.87, 0.0 ); $$circle( "SOLDER_MASK", 0.0, 0.0, 0.55, 0.0 ); //---------------------------------------------------------------------------- // Special Small 0.52 mm Land Diameter pin pad-stack for the Hub Module. // // This "via" is used for the High Speed Differential GTH signals that // run the whole way (or most of the way) through the card stackup. // // Note: This is NOT a "BURIED_VIA" although there may be some // similar components that transverse only part of the PCB // stackup and are implemented as Buried pins. // // // 0.25 mm finished hole diameter // 0.52 mm land pad // 1.00 mm plane relief // 0.46 mm soldermask opening // // // --> ring width 0.135 mm // // --> plane isolation Air Gap 0.240 mm // from the pad // // --> plane isolation Air Gap 0.375 mm // from edge of drill hole // // // This pad-stack is NOT "Tented", i.e. it does have an // openingno solder mask. // $$lock_windows(@on); $$create_pin("DIFF_PAIR_THRU_SIG_PAD"); $$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'PI$DIFF_PAIR_THRU_SIG_PAD'] ); $$point_mode(@vertex); $$attribute( "TERMINAL_THRUHOLE_DEFINITION", "default"); $$attribute( "TERMINAL_DRILL_SIZE", "", , @scale , , [ 0.25, 0.0 ]); $$circle( "SIGNAL", 0.0, 0.0, 0.52, 0.0 ); $$circle( "POWER", 0.0, 0.0, 1.00, 0.0 ); $$circle( "SOLDER_MASK", 0.0, 0.0, 0.46, 0.0 ); //---------------------------------------------------------------------------- // // Now the actual DIFF PAIR THROUGH Geometry // $$create_component("DIFF_PAIR_THRU"); $$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'CO$DIFF_PAIR_THRU'] ); $$point_mode(@vertex); $$attribute( "COMPONENT_HEIGHT", "", , @scale , , [ 1.0, 0.0 ]); $$attribute( "COMPONENT_OUTLINE_OVERHANG", "yes"); $$attribute( "COMPONENT_LAYOUT_SURFACE", "both"); $$attribute( "COMPONENT_NOT_IN_BOM" ); // // Component Outline of the square body part of the connector // $$initial([ 2.00, 0.30 ], , @nosnap ); $$terminal([ -2.00, 0.30 ]); $$terminal([ -2.00, -0.30 ]); $$terminal([ 2.00, -0.30 ]); $$terminal([ 2.00, 0.30 ]); $$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale ); // // Silkscreen Outline of the square body part of the connector // $$template_line_style( @Solid ); // //$$initial([ 2.00, 0.40 ], , @nosnap ); // //$$terminal([ -2.00, 0.40 ]); // //$$terminal([ -2.00, -0.40 ]); // //$$terminal([ 2.00, -0.40 ]); // //$$terminal([ 2.00, 0.40 ]); // //$$path( "SILKSCREEN", 0.10 ); // Silkscreen End of // // Reference Designator - NOT shown in SilkScreen // // //$$text( "SILKSCREEN", "^$ref", 0.0, 0.0, 0.3, @CC, 0, 1.00, 0.10, "std", "None", 0.0, 0.0 ); // This Diff_Pair_Through board geometry includes a cutout of // the Gerber negative data Ground Plane. This cutout is provided // by a "path" on layer PREPREG_3. $$path( "PREPREG_3", 1.00, , [ -0.50, 0.00, 0.50, 0.00 ]); // // Ground and Signal Pins in the Diff_Pair-Through // ------------------------------------------------- // // // Pin #1 Pin #2 Pin #3 Pin #4 // Ground Signal Signal Ground // $$attribute( "COMPONENT_PIN_DEFINITION", "1", , @scale , , [ -1.70, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "1, DIFF_PAIR_THRU_GND_PAD"); $$attribute( "COMPONENT_PIN_DEFINITION", "2", , @scale , , [ -0.50, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "2, DIFF_PAIR_THRU_SIG_PAD"); $$attribute( "COMPONENT_PIN_DEFINITION", "3", , @scale , , [ 0.50, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "3, DIFF_PAIR_THRU_SIG_PAD"); $$attribute( "COMPONENT_PIN_DEFINITION", "4", , @scale , , [ 1.70, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "4, DIFF_PAIR_THRU_GND_PAD");