//
//   File:  diff_pair_thru_3p_top_mid_relief
//
//
//   Date:  14-Feb-2017   original version  -  made for Hub Module
//
//
//   This  3 hole Differential Via Pair  geometry
//
//     But it has an oval of ground plane relief on
//     only the Top and Middle thirds of the ground
//     planes.
//
//     The Bottom third of the ground planes has two
//     0.85 mm circles of ground plane relief.
//
//
//   This geometry was derived directly from the  27-Aug-2016
//   version of the  diff_pair_thru_3p  geometry.
//   
//
//
//
//        Three Pin Version of the Diff Piar Through PCB Stackup
//
//       with Oval Solder Mask Relief in on Top and Middle Thrids
//
//
//
//     Note:  The pin to pin spacing is  1.00 mm  center-to-center.
//            for  signal-to-signal   and   signal-to-ground
//
//
//   Geometry for a  high-speed  through board  differential via pair
//                   with return vias on  Only One  side.
//
//   This Diff_Pair_Through board geometry includes an Oval cutout of
//   the Gerber negative data Ground Plane.  This oval cutout is provided
//   by a "path" on layer  GLUE_MASK_1.
//
//   This is not a component that the assembly house installs on the
//   card so its Reference Designator is not shown in Silkscreen.
//
//   This component has the  Not in BOM  attribute.
//
//
//   The long axis of this part is horizontal with pin #1 to the left.
//
//   Pins #1  needs to be tied to Gnd in the net list.
//
//   Pins #2 and #3  are the differential pair.
//
//
//   This geometry provides a pin/pad stack for the high speed
//   differential pins  that has the standard  0.25 mm drill,
//   0.52 mm pad   but just a small  0.85 mm  plane relief.
//                 ---------------------------------------
//
//



$abort_enable = @false;
$$lock_windows(@on) ;
$$snap_diagonal(@off) ;
$$snap_orthogonal(@off) ;



//----------------------------------------------------------------------------
//
//  Diff_Pair_Through   Ground Pin Geometry   (same as  0mm60 Via)
//
//  Special Small 0.60mm Land Diameter routing via for the  CMX  card.
//
//  The pin-stack  DIFF_PAIR_THRU_GND_PAD  is defined in the
//  geometry for the component  Diff_Pair_Through.
//
//----------------------------------------------------------------------------


//----------------------------------------------------------------------------
//
//
//  Special Small 0.52 mm Land Diameter pin pad-stack for the Hub Module.
//                        with special small 0.85 mm plane relief
//                                     --------------------------
//
//  This "via" is used for the High Speed Differential GTH signals that
//  run the whole way through the card stackup and are then typically
//  Back-Drilled.
//
//
//
//       0.25 mm  finished hole diameter
//       0.52 mm  land pad
//       0.85 mm  plane relief
//       0.46 mm  soldermask opening
//
//
//       --> ring width                 0.135 mm
//
//       --> plane isolation Air Gap    0.165 mm
//           from the pad
//
//       --> plane isolation Air Gap    0.300 mm
//           from edge of drill hole
//
//
//   This pad-stack is NOT "Tented",  i.e. it does have an
//   openingno solder mask.
//


$$lock_windows(@on);

$$create_pin("DIFF_PAIR_THRU_SIG_PAD_SMALL_RELIEF");

$$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'PI$DIFF_PAIR_THRU_SIG_PAD_SMALL_RELIEF'] );

$$point_mode(@vertex); 

$$attribute( "TERMINAL_THRUHOLE_DEFINITION", "default");

$$attribute( "TERMINAL_DRILL_SIZE", "", , @scale , , [ 0.25,  0.0 ]);

$$circle( "SIGNAL",                         0.0, 0.0,  0.52,  0.0 );

$$circle( "POWER",                          0.0, 0.0,  0.85,  0.0 );

$$circle( "SOLDER_MASK",                    0.0, 0.0,  0.46,  0.0 );


//----------------------------------------------------------------------------




//
//  Now the actual  DIFF PAIR THROUGH  Geometry
//

$$create_component("DIFF_PAIR_THRU_3P_TOP_MID_RELIEF");

$$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'CO$DIFF_PAIR_THRU_3P_TOP_MID_RELIEF'] );

$$point_mode(@vertex);


$$attribute( "COMPONENT_HEIGHT", "", , @scale , , [ 1.0,  0.0 ]);

$$attribute( "COMPONENT_OUTLINE_OVERHANG", "yes");

$$attribute( "COMPONENT_LAYOUT_SURFACE", "both");

$$attribute( "COMPONENT_NOT_IN_BOM" );




//
//  Component Outline  of the square body part of the connector
//

$$initial([   0.80,   0.30 ], , @nosnap );
$$terminal([ -1.85,   0.30 ]);
$$terminal([ -1.85,  -0.30 ]);
$$terminal([  0.80,  -0.30 ]);
$$terminal([  0.80,   0.30 ]);

$$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale );





//
//  Reference Designator - Is NOT in SilkScreen
//

// //$$text( "SILKSCREEN", "^$ref",  0.0,   0.0,  0.3, @CC, 0, 1.00, 0.10, "std", "None", 0.0, 0.0 );




//  This Diff_Pair_Through board geometry includes a cutout of
//  the Gerber negative data Ground Plane.  This cutout is provided
//  by a "path" on layer  GLUE_MASK_1.

$$path( "GLUE_MASK_1",  1.00, , [ -0.50,  0.00,    0.50,  0.00 ]);





//
//       Ground and Signal Pins in the Diff_Pair-Through
//      -------------------------------------------------
//
//
//         Pin #1      Pin #2      Pin #3
//         Ground      Signal      Signal
//


$$attribute( "COMPONENT_PIN_DEFINITION",     "1", , @scale , ,     [  -1.50,   0.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "1, DIFF_PAIR_THRU_GND_PAD");

$$attribute( "COMPONENT_PIN_DEFINITION",     "2", , @scale , ,     [  -0.50,   0.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "2, DIFF_PAIR_THRU_SIG_PAD_SMALL_RELIEF");

$$attribute( "COMPONENT_PIN_DEFINITION",     "3", , @scale , ,     [   0.50,   0.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "3, DIFF_PAIR_THRU_SIG_PAD_SMALL_RELIEF");