Hello George,

The new plug plots are ready.  Please distribute
this note as appropriate.

Thank you all for your help in the call this morning.

Please let me know if there is anything that I need
to do to help keep this build moving along.

      Thanks,   Dan


This morning I have generated new  plug  plots so that
all of the BGA components now have the vias under them
plugged from the Top side.   All of these BGA components
are mounted on the Top side of the Hub pcb.

These new  plug  plots are in the Hub production release
web site:

   http://www.pa.msu.edu/hep/atlas/l1calo/hub/hardware/manufacturing/Production/Bare_Board/


The new  Plug  plots  (artwork 23 and 24)  have the date
15-Mar-2017 13:25    Note that you may need to "refresh"
your web browser display of these pages to get the new
version of these files.

The "new"  Solder Mask  plots  (artwork 19 and 20) that
were released yesterday have the date:  14-Mar-2017 17:48

All other released bare board manufacturing data
has the original release date:  16-Feb-2017 09:01


My crisp summary of the conference call this morning:


Issue #1  Please see an attached Gerber Data For Your Approval.

  Answer:  PCB Manufacturing will use the  new  Solder Mask
           and Plug plots from yesterday and today.

           All other gerber and drill files for pcb
           manufacturing are from the  16-Feb-2017 09:01
           web release.

           I'm happy to review any gerber and drill
           data that you would like me to.



Issue #2  We will Provide ENIG (Immersion Gold) Per IPC-4552,
          Which is 118 Micro-Inches of Minimum Nickel Followed
          by 2 Micro-Inches of Minimum Gold.Please Confirm.

  Answer:  Confirmed



Issue #3  We will Build this Part Per IPC 6012 Class 2 Per
          Quotation.Please Confirm.

  Answer:  Confirmed



Issue #4  The milling on bottom side is cutting 2 holes at R958
          and mounting hole on rail as shown in the image.
          Please advise if this is acceptable or not.   Image

  Answer:  Milling part of the via near the lower right
           hand corner next to  R958  is acceptable.
           It is my mistake to have placed this via where
           it is  but it is OK if this via is cut.

           Can you stop the milling,  along both the Top and
           Bottom edges,  20 mm  short of the left-hand edge
           of the card ?   This will leave the at risk holes
           adjacent to the left-hand edge fully intact  and
           will still let us insert the card into the card
           guides.



Issue #5  One 2.7 mm pth hole is tenting by solder mask on top
          side as shown in image. We have added a mask clearance
          the same as on bottom side to open it up.
          Please advise if this is acceptable.   Image

  Answer:  This is fixed in the new Solder Mask plots



Issue #6  As per drawing note there is no solder mask "tenting"
          of any of the vias or component pin holes. However in
          the data on top side the vias under BGA Meg_S1, Meg_s2,
          U1, U25, Trn_MP1, Rec_MP2, and all TRANS# are tented by
          solder mask. On bottom side the vias under U504, U507
          and DCDC9 are tented by mask too. For these via holes
          we have added a mask relief of drill +6 mil to the
          tented side.   As per via plug layers, the U504, U507
          and DCDC9  are to be plugged, please advise if via plug
          is required for the BGA devices or not.

  Answer:  The vias that were tented on the Top or Bottom
           have been fixed in the new Solder Mask plots.

           No vias / holes  should remain tented by Solder
           Mask in the new released Hub manufacturing files.

           The new Plug plots  now plug all vias under the
           BGA components from the Top side .



Issue #7  On outer layers under the back drilled locations we
          have changed the copper pads to drill + 4 mil so that
          the pads will be totally removed at final by back drill
          holes.  Please advise whether this is acceptable.

  Answer:  Yes, accepted, this makes good sense.



Issue #8  We are unable to plug the via holes from both sides.
          As per our process for via holes that are tented by
          solder mask on one side and opened on the other side,
          we will do the button print plugging from the tented
          side with a mask relief of drill + 6 mil.
          Please advise if this is acceptable or not.

  Answer:  I understand that Issue #8  is basically a
           description of how you manufacture the pcb
           to prevent solder from wicking into vias in
           situations where the via is in danger of
           wicking from both sides of the card.

           I do not fully understand the details but if
           this is OK with Debron then it is fine with me.