Reply to the Technical Query from Via Systems
that I received Monday  20-Mar-2017.



Issue 1.  We have moved the via hole at R958 up by 30 mil to
          avoid being cut by milling on solder side.

          We changed the milling to stop 7.5 mm from the left
          side board edge as shown in the image.  It would pass
          the breakoff tab with your suggested 20 mm distance.

          Please advise if this is acceptable or not.  Image

  Answer:  Thank you,  Both are acceptable.



Issue 2.  Attached please find the edited gerber files for
          your review and approval.

  Answer:  I have visually studied these 45 gerber plots.
           I have no software to do any kind of design rule
           checks on them.

           I believe that I understand most of the filenames
           used  in this set of plots and thus could verify
           for example that the 9 back-drill files match what
           is in the design  and  that the 3 ground plane
           plots that I supplied have been correctly expanded
           out into the 10 pcb ground layers.

           I don't fully understand the  dbe.grb  and
           drl.grb  files.  These files are clearly the
           drill holes but these two files do not exactly
           match with which holes were requested as plated
           and which holes were requested as un-plated.
           But, I think that I understand what's being
           done and it makes sense.

           I approve these plots.