//
//      These are the  Pin/Pad Stacks  for the
//
//        Broadcom BCM53128 Switch  Geometry.
//
//
//        2-Sept-2014   Original Date
//
//        10-Dec-2016   To the Pin/Pad Stack for the Center Thermal Pad Via
//                      geometry add a 0.23 mm diameter flash on PREPREG_5
//                      to indicate the location of a Via that needs to be
//                      Plugged from the Top.   This works because in the Hub
//                      design the  Switch Chip  package is only instanced
//                      on the top side of the card.
//
//        18-Jan-2017   Move the Thermal Vias from being based on a 0.25 mm
//                      drill to a more rational 0.30 mm drill.
//                      This is setup for the  New Version  of this design.
//
//


//
//   This section contains 2 SMD pads  (E-W and N-S)  and the Through Hole
//   stack for the Thermal Land rivets.
//


//
//   The SMD pads are based on a combination of what is specified in
//   Broadcom Solder Guidelines Packaging  AN200  and  what I see on
//   real PCB that have 0.40 mm pitch parts.  As such the Broadcom
//   SMD pads design is rather minimal size and all the real world
//   examples seem somewhat larger.  Broadcom does not specify
//   individual Solder Mask openings  (they use just one large opening
//   per side)  where as the real world examples have individual
//   Solder Mask openings per pin.
//


//
//   SMD Pad Design
//
//     Foot Width:   0.13 mm min   0.18 mm typ   0.23 mm max
//     Foot Length:  0.45 mm min   0.60 mm typ   0.75 mm max
//
//     Tip of Foot to Tip of Foot Distance:   30.00 mm   +- 0.15 mm
//
//        --> Set Pad Width  =  0.20 mm
//
//     Broadcom asks for an addition Pad Length:    0.05 mm inward
//                                                  0.10 mm outward
//
//     This is too little additional Pad Length.  It is not even
//     enough to take into consideration the  +- 0.15 mm  Foot Length
//     and the  0.15 mm  Tip to Tip tollerance.
//
//     Choose to have an additional Pad Length:   0.30 mm inward
//                                                0.40 mm outward
//
//        --> Set Pad Length  =  1.30 mm
//
//     The 0,0 to Center of Foot Distance is:  14.70 mm
//
//     But more of the 1.30 mm Pad Length faces outward than inward.
//     So the 0,0 to Center of Pad Length Distance is:   14.75 mm
//
//        --> Set the 0,0 to Center of Pad Distance  =  14.75 mm
//
//        --> Set the Pad edge to Solder Mask Clearance  =  0.05 mm
//            on all 4 sides.
//
//        --> Set Paste Mask equal to SMD Pad size.
//
//     Even with this  1.30 mm Pad Length, which is longer than the
//     Broadcom spec,  it is shorter than what I have typically used.
//


//
//----------------------------------------------------------------------------
//

//
//   SMD East-West Pad
//

$$create_pin("SWITCH_HORZ_PAD", @replace);

$$page(0.0,0.0,0.0, @mm, 0.0, 0.0, [0.0, 0.0, 'PI$SWITCH_HORZ_PAD']);

$$point_mode(@vertex);

$$polygon( "PAD", ,         [ 0.650, 0.100,   -0.650, 0.100,   -0.650, -0.100,   0.650, -0.100 ] );

$$polygon( "SOLDER_MASK", , [ 0.700, 0.150,   -0.700, 0.150,   -0.700, -0.150,   0.700, -0.150 ] );

$$polygon( "PASTE_MASK", ,  [ 0.650, 0.100,   -0.650, 0.100,   -0.650, -0.100,   0.650, -0.100 ] );

$$attribute( "TERMINAL_SURFACE_DEFINITION", "");


//
//----------------------------------------------------------------------------
//

//
//   SMD North-South Pad
//

$$create_pin("SWITCH_VERT_PAD", @replace);

$$page(0.0,0.0,0.0, @mm, 0.0, 0.0, [0.0, 0.0, 'PI$SWITCH_VERT_PAD']);

$$point_mode(@vertex);

$$polygon( "PAD", ,         [ 0.100, 0.650,   -0.100, 0.650,   -0.100, -0.650,   0.100, -0.650 ] );

$$polygon( "SOLDER_MASK", , [ 0.150, 0.700,   -0.150, 0.700,   -0.150, -0.700,   0.150, -0.700 ] );

$$polygon( "PASTE_MASK", ,  [ 0.100, 0.650,   -0.100, 0.650,   -0.100, -0.650,   0.100, -0.650 ] );

$$attribute( "TERMINAL_SURFACE_DEFINITION", "");


//
//----------------------------------------------------------------------------
//


//
//   Thermal/Ground  Plated Through Hole  Pin/Pad Stack
//
//   for connecting the PCB Thermal Land to its internal Ground Planes
//
//     0.30 mm  drill
//     0.60 mm  pad land
//     0.70 mm  soldermask opening
//     0.90 mm  plane relief
//     0.28 mm  PrePreg_5 flash to indicate a
//                via that is plugged from the Top
//
//
//     --> the thickness of the donut wall is       0.150 mm
//     --> the clearance from pad land to plane     0.150 mm
//     --> the clearance from drill hole to plane   0.300 mm
//     --> the thickness of the Gnd Plane web is    0.225 mm  for 1.125 mm spaced pins
//
//   Note that the design of this plated through hole tries to keep
//   the plane relief moderately small so that the webs in the planes
//   will be as thick as practical.   The Ground Planes in the area
//   under the Switch Chips will flood these Thermal/Ground Plated
//   Through Holes and will thus be as effective as possible in
//   carrying away the heat an providing a stiff electrical connection.
//   There is plenty of clearance between the drill hole wall and the
//   other planes  ( 0.300 mm).   There is only 0.150 mm clearance
//   between a pad and the other planes but this condition is not
//   exected to actually ever exist  ( i.e. pads are not flashed on
//   layers were no connection is made to these Plated Through Holes ).
//
//   Note that a smaller Solder Mask opening is used on the backside
//   where the only reason for a Solder Mask opening  is to un-tent
//   these through board vias.
//


$$create_pin("Swch_Thermal_PTH", @replace);

$$page(0.0,0.0,0.0, @mm, 0.0, 0.0, [0.0, 0.0, 'PI$Swch_Thermal_PTH']);

$$point_mode(@vertex);

$$attribute( "TERMINAL_THRUHOLE_DEFINITION", "");

$$attribute( "TERMINAL_DRILL_SIZE", "", , @scale , , [ 0.30,  0.0 ]);

$$circle( "PAD",                            0.0, 0.0,  0.60,  0.0);

$$circle( "SIGNAL",                         0.0, 0.0,  0.60,  0.0);

$$circle( "SOLDER_MASK_1",                  0.0, 0.0,  0.70,  0.0);

$$circle( "SOLDER_MASK_2",                  0.0, 0.0,  0.50,  0.0);

$$circle( "POWER",                          0.0, 0.0,  0.90,  0.0);

$$circle( "PREPREG_5",                      0.0, 0.0,  0.28,  0.0 );


//----------------------------------------------------------------------------