//
//  =======================================================================
//
//
//        This is the   Thermal Land  PASTE Mask   for the
//
//               Broadcom BCM53128 Switch  Geometry.
//
//
//                                             Original Date:   2-Sept-2014
//                                              Current Date:   18-Jan-2017
//
//
//
//   This is the New Rational Geom for the Switch Chip.
//
//
//   There are 12 Solder Stencil Openings.
//
//    - In total they are about 80% of the area of the
//      IC's center thermal ground pad.
//
//    - All 12 of the solder stencil openings are within the
//      area covered by the IC's center thermal ground pad.
//
//    - The web between openings is 0.26 mm.
//
//    - Each opening is  1.95 in X  by  2.30 in Y.
//
//    - There are 4 columns spaced along in X.
//
//    - There are 3 rows spaced along in Y.
//
//    - Each  1.95 mm by 2.30 mm Solder Stencil openings is  4.485 sq mm.
//
//    - 12 of these Solder Stencil openings is a total of  53.82 sq mm.
//
//    - 53.82 sq mm is  80.4%  of the area of the IC's 8.79 mm by 7.62 mm Center Pad.
//
//    - 53.82 sq mm is  59.8%  of the area of the PCB's  10.0 mm by 9.0 mm Thermal Pad.
//
//    - All of the Solder Stencil's window openings are within the foot print
//      of the IC's Center Pad.
//
//    - In fact the outer most edge of the Solder Stencil's window openings
//      is about  0.10 mm  back from the perimeter of the IC's Center Pad.
//
//
//   Openings in the  Top Side  PASTE Mask  aka PASTE Stencil
//
//   for the Thermal Land:
//



$$polygon( "PASTE_MASK_1", ,  [ -2.34, -1.41,    -4.29, -1.41,    -4.29, -3.71,    -2.34, -3.71 ] );
$$polygon( "PASTE_MASK_1", ,  [ -0.13, -1.41,    -2.08, -1.41,    -2.08, -3.71,    -0.13, -3.71 ] );
$$polygon( "PASTE_MASK_1", ,  [  2.08, -1.41,     0.13, -1.41,     0.13, -3.71,     2.08, -3.71 ] );
$$polygon( "PASTE_MASK_1", ,  [  4.29, -1.41,     2.34, -1.41,     2.34, -3.71,     4.29, -3.71 ] );


$$polygon( "PASTE_MASK_1", ,  [ -2.34,  1.15,    -4.29,  1.15,    -4.29, -1.15,    -2.34, -1.15 ] );
$$polygon( "PASTE_MASK_1", ,  [ -0.13,  1.15,    -2.08,  1.15,    -2.08, -1.15,    -0.13, -1.15 ] );
$$polygon( "PASTE_MASK_1", ,  [  2.08,  1.15,     0.13,  1.15,     0.13, -1.15,     2.08, -1.15 ] );
$$polygon( "PASTE_MASK_1", ,  [  4.29,  1.15,     2.34,  1.15,     2.34, -1.15,     4.29, -1.15 ] );


$$polygon( "PASTE_MASK_1", ,  [ -2.34,  3.71,    -4.29,  3.71,    -4.29,  1.41,    -2.34,  1.41 ] );
$$polygon( "PASTE_MASK_1", ,  [ -0.13,  3.71,    -2.08,  3.71,    -2.08,  1.41,    -0.13,  1.41 ] );
$$polygon( "PASTE_MASK_1", ,  [  2.08,  3.71,     0.13,  3.71,     0.13,  1.41,     2.08,  1.41 ] );
$$polygon( "PASTE_MASK_1", ,  [  4.29,  3.71,     2.34,  3.71,     2.34,  1.41,     4.29,  1.41 ] );



//
//   End of the  Top Side  PASTE Mask  for the  Thermal Land.
//
//   There are  no openings  in the  Bottom Side
//   PASTE Mask for the Switch Chip's Thermal Land
//   except for those to "un-tent" the Thermal Gnd Vias.
//