// // File: lt1764_dd_pak_dcdc4.txt // // Date: 21-July-2015 original version // // 29-Oct-2016 Start the DCDC4 specific version // // // // Hub's DCDC4 version of the // ----- // // LT1764A Linear Regulator in the 5 lead DD Pak // // // This version of the LT1764 geometry has a large Thermal Pad // with no Thermal Vias. This part is mounted on the Top // side of the pcb directly over the mat of MGT differential // signals that run up to the ROD. Because this part is mounted // over this mat of high-speed signals the Thermal Ground pad // for this LT1764 can not have any vias to connect it to // the internal ground planes. Heat removal from this LT1764 // depends on the large size of its Thermal Ground pad. // // This geometry is layed out with the heat-sink tab on top and the // 5 leads under it. Pin #1 is to the left and pin #5 is to the right. // // This geometry comes directly from the Linear Technology // reccommended smd layout pattern. // // The center of this geometry is the center of its pin #3. // // This geometry includes its own pin pad stacks. // // This LT1764A regulator geometry was made for the Hub Module. // // The Reference Designator is on the SilkScreen Layer. // // Pin Numbers in this geometry: // // Pin // Num Function // --- -------- // 1 Shut_Down_B // 2 Vin // 3 GND // 4 Vout // 5 Sense_Adj // 6 GND point in Thermal pad // // // // This LT1764 DCDC4 geometry uses the LT1764_PIN_PAD pad stack // from the DCDC9 version of this geometry. // // This LT1764 DCDC4 geometry contains a pad stack for this // Thermal pad - but this is just a minimal size pad to fit // the LT1764 device. This LT1764_HS_PAD pad stack does not // contain any openings in the solder paste stencil. // // The large extent of the Thermal Ground pad for this device // comes from an over lay of the LT1764_HS_PAD that is on the // BREAKOUT_1 and SHEET_DIELECTRIC_1 layers just like in a // normal genter thermal pad QFN device. This section of this // geometry also contains 24 windows in the Solder Paste stencil. // Note that this extended Thermal Ground pad is a Solder Mask // Defined structure. // // $abort_enable = @false; $$lock_windows(@on) ; $$snap_diagonal(@off) ; $$snap_orthogonal(@off) ; //---------------------------------------------------------------------------- //---------------------------------------------------------------------------- $$create_pin("LT1764_HS_PAD", @replace); $$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'PI$LT1764_HS_PAD'] ); $$point_mode(@vertex); $$polygon( "PAD", , [ -5.35, -4.45, 5.35, -4.45, 5.35, 4.45, -5.35, 4.45 ] ); $$polygon( "SOLDER_MASK", , [ -5.40, -4.50, 5.40, -4.50, 5.40, 4.50, -5.40, 4.50 ] ); $$attribute( "TERMINAL_SURFACE_DEFINITION", ""); //---------------------------------------------------------------------------- //---------------------------------------------------------------------------- // // Now start the actual DCDC4 version of the LT1764A Geometry // $$create_component("LT1764A_REG_DCDC4", @replace); $$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'CO$LT1764A_REG_DCDC4'] ); $$point_mode(@vertex); $$attribute( "COMPONENT_LAYOUT_TYPE", "surface"); $$attribute( "COMPONENT_LAYOUT_SURFACE", "both"); $$attribute( "COMPONENT_HEIGHT", "", , @scale , , [0.028, 0.0]); // // Component Placement Outline for the LT1764 regulator // $$initial([ 5.60, 14.00 ], , @nosnap ); $$terminal([ -5.60, 14.00 ] ); $$terminal([ -5.60, 4.50 ] ); $$terminal([ -4.20, 4.50 ] ); $$terminal([ -4.20, -1.40 ] ); $$terminal([ 4.20, -1.40 ] ); $$terminal([ 4.20, 4.50 ] ); $$terminal([ 5.60, 4.50 ] ); $$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale ); // // Silkscreen // $$template_line_style( @Solid ); $$path( "SILKSCREEN", 0.20, , [ -5.60, 14.00, 5.60, 14.00 ]); $$path( "SILKSCREEN", 0.20, , [ -5.60, 4.50, -4.20, 4.50 ]); $$path( "SILKSCREEN", 0.20, , [ 5.60, 4.50, 4.20, 4.50 ]); $$path( "SILKSCREEN", 0.20, , [ -4.20, -1.40, 4.20, -1.40 ]); $$path( "SILKSCREEN", 0.20, , [ -5.60, 14.00, -5.60, 4.50 ]); $$path( "SILKSCREEN", 0.20, , [ -4.20, 4.50, -4.20, -1.40 ]); $$path( "SILKSCREEN", 0.20, , [ 5.60, 14.00, 5.60, 4.50 ]); $$path( "SILKSCREEN", 0.20, , [ 4.20, 4.50, 4.20, -1.40 ]); // Reference Designator is on the SILKSCREEN Layer. $$text( "SILKSCREEN", "^$ref", 0.0, 2.8, 1.4, @CC, 0, 0.7, 0.20, "std", "None", 0.0, 0.0 ); // // Now place the Extended center Thermal Pad // // - The actual Gerber plots depend on the Sheet_Dielectric_1 shape. // // I'm also keeping the same shape on Breakout_1 as that's were a // rational layout system would put it. // // - 24 Solder Paste Stencil Windows // $$polygon( "BREAKOUT_1", , [ 7.00, 25.00, -35.00, 25.00, -35.00, 4.80, 7.00, 4.80 ]); $$polygon( "BREAKOUT_1", , [ 12.00, 25.00, 6.00, 25.00, 6.00, 7.00, 12.00, 7.00 ]); $$polygon( "BREAKOUT_1", , [ -18.00, 5.00, -35.00, 5.00, -35.00, -7.00, -18.00, -7.00 ]); //$$polygon( "BREAKOUT_1", , [ 5.50, 13.80, -5.50, 13.80, -5.50, 4.80, 5.50, 4.80 ]); $$polygon( "PASTE_MASK_1", , [ -4.95, 5.45, -3.55, 5.45, -3.55, 7.15, -4.95, 7.15 ]); $$polygon( "PASTE_MASK_1", , [ -4.95, 7.45, -3.55, 7.45, -3.55, 9.15, -4.95, 9.15 ]); $$polygon( "PASTE_MASK_1", , [ -4.95, 9.45, -3.55, 9.45, -3.55, 11.15, -4.95, 11.15 ]); $$polygon( "PASTE_MASK_1", , [ -4.95, 11.45, -3.55, 11.45, -3.55, 13.15, -4.95, 13.15 ]); $$polygon( "PASTE_MASK_1", , [ -3.25, 5.45, -1.85, 5.45, -1.85, 7.15, -3.25, 7.15 ]); $$polygon( "PASTE_MASK_1", , [ -3.25, 7.45, -1.85, 7.45, -1.85, 9.15, -3.25, 9.15 ]); $$polygon( "PASTE_MASK_1", , [ -3.25, 9.45, -1.85, 9.45, -1.85, 11.15, -3.25, 11.15 ]); $$polygon( "PASTE_MASK_1", , [ -3.25, 11.45, -1.85, 11.45, -1.85, 13.15, -3.25, 13.15 ]); $$polygon( "PASTE_MASK_1", , [ -1.55, 5.45, -0.15, 5.45, -0.15, 7.15, -1.55, 7.15 ]); $$polygon( "PASTE_MASK_1", , [ -1.55, 7.45, -0.15, 7.45, -0.15, 9.15, -1.55, 9.15 ]); $$polygon( "PASTE_MASK_1", , [ -1.55, 9.45, -0.15, 9.45, -0.15, 11.15, -1.55, 11.15 ]); $$polygon( "PASTE_MASK_1", , [ -1.55, 11.45, -0.15, 11.45, -0.15, 13.15, -1.55, 13.15 ]); $$polygon( "PASTE_MASK_1", , [ 0.15, 5.45, 1.55, 5.45, 1.55, 7.15, 0.15, 7.15 ]); $$polygon( "PASTE_MASK_1", , [ 0.15, 7.45, 1.55, 7.45, 1.55, 9.15, 0.15, 9.15 ]); $$polygon( "PASTE_MASK_1", , [ 0.15, 9.45, 1.55, 9.45, 1.55, 11.15, 0.15, 11.15 ]); $$polygon( "PASTE_MASK_1", , [ 0.15, 11.45, 1.55, 11.45, 1.55, 13.15, 0.15, 13.15 ]); $$polygon( "PASTE_MASK_1", , [ 1.85, 5.45, 3.25, 5.45, 3.25, 7.15, 1.85, 7.15 ]); $$polygon( "PASTE_MASK_1", , [ 1.85, 7.45, 3.25, 7.45, 3.25, 9.15, 1.85, 9.15 ]); $$polygon( "PASTE_MASK_1", , [ 1.85, 9.45, 3.25, 9.45, 3.25, 11.15, 1.85, 11.15 ]); $$polygon( "PASTE_MASK_1", , [ 1.85, 11.45, 3.25, 11.45, 3.25, 13.15, 1.85, 13.15 ]); $$polygon( "PASTE_MASK_1", , [ 3.55, 5.45, 4.95, 5.45, 4.95, 7.15, 3.55, 7.15 ]); $$polygon( "PASTE_MASK_1", , [ 3.55, 7.45, 4.95, 7.45, 4.95, 9.15, 3.55, 9.15 ]); $$polygon( "PASTE_MASK_1", , [ 3.55, 9.45, 4.95, 9.45, 4.95, 11.15, 3.55, 11.15 ]); $$polygon( "PASTE_MASK_1", , [ 3.55, 11.45, 4.95, 11.45, 4.95, 13.15, 3.55, 13.15 ]); // // Define the six pins on the LT1764A_REG: // pin #1 is to the left, pin #5 to the right, heat-sink pin #6 on top. $$attribute( "COMPONENT_PIN_DEFINITION", "1", , @scale , , [ -3.40, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "1, LT1764_PIN_PAD"); $$attribute( "COMPONENT_PIN_DEFINITION", "2", , @scale , , [ -1.70, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "2, LT1764_PIN_PAD"); $$attribute( "COMPONENT_PIN_DEFINITION", "3", , @scale , , [ 0.00, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "3, LT1764_PIN_PAD"); $$attribute( "COMPONENT_PIN_DEFINITION", "4", , @scale , , [ 1.70, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "4, LT1764_PIN_PAD"); $$attribute( "COMPONENT_PIN_DEFINITION", "5", , @scale , , [ 3.40, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "5, LT1764_PIN_PAD"); $$attribute( "COMPONENT_PIN_DEFINITION", "6", , @scale , , [ 0.00, 9.27 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "6, LT1764_HS_PAD");