//
//   File:  x2y2_power_via_array
//
//   Date:  12-Aug-2015   original version for the Hub Module
//
//          15-Jun-2016   Add the "Component_not_in_bom" attribute to
//                        Remove all instances of this component from the BOM.
//
//          12-Sept-2016   Move the backside copper to layer Sheet_Dielectric_2.
//                         Remove the Silkscreen from the component.
//                         Remove the Silkscreen Reference Designator.
//
//
//
//   This component is a rectangular array of  2 vias in X  by
//   2 vias in Y.   In this pattern the vias are in vertical columns.
//
//   These 4 vias are connected together by copper on the top
//   and bottom Breakout layers.   In this geometry this copper
//   is placed on the BREAKOUT 1 and 2 layers.
//
//   These vias are spaced out with 1.50 mm between them.
//
//   The intent of this "component" is that it is a ready made
//   way of getting multiple vias in a high current bus without
//   the need of placing multiple vias at  route  time.
//
//   This x2y2 geometry uses the pad-stack from the x3y1 geometry
//   that is named   term_x3_power_via_array
//
//
//   This component has the  Not in BOM  attribute.
//
//
//



$abort_enable = @false;
$$lock_windows(@on) ;
$$snap_diagonal(@off) ;
$$snap_orthogonal(@off) ;



$$create_component("X2Y2_Power_Via_Array");

$$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'CO$X2Y2_Power_Via_Array'] );

$$point_mode(@vertex);


$$attribute( "COMPONENT_HEIGHT", "", , @scale , , [1.0, 0.0]);

$$attribute( "COMPONENT_OUTLINE_OVERHANG", "no");

$$attribute( "COMPONENT_LAYOUT_SURFACE", "both");

$$attribute( "COMPONENT_NOT_IN_BOM" );



//
//  Component Outline
//

$$initial([    1.05,    1.1 ], , @nosnap );
$$terminal([  -1.05,    1.1 ]);
$$terminal([  -1.05,   -1.1 ]);
$$terminal([   1.05,   -1.1 ]);
$$terminal([   1.05,    1.1 ]);

$$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale );




//
//  Silkscreen Outline then Details
//

// //$$template_line_style( @Solid );

// //$$initial([    1.25,    1.25 ], , @nosnap );
// //$$terminal([  -1.25,    1.25 ]);
// //$$terminal([  -1.25,   -1.25 ]);
// //$$terminal([   1.25,   -1.25 ]);
// //$$terminal([   1.25,    1.25 ]);

// //$$path( "SILKSCREEN", 0.20 );


//    Silkscreen  End of




//
//  Reference Designator
//

// //$$text( "SILKSCREEN", "^$ref",  0.0,   0.0,  0.3, @CC, 0, 1.00, 0.10, "std", "None", 0.0, 0.0 );




//
//   Now put copper on both the top and bottom sides
//   of the PCB to tie these vias together and make
//   a high current connection between layers.
//

$$polygon( "BREAKOUT_1", ,         [ -1.55, -1.70,    1.55, -1.70,     1.55, 1.70,    -1.55, 1.70 ] );

$$polygon( "SHEET_DIELECTRIC_1", , [ -1.55, -1.70,    1.55, -1.70,     1.55, 1.70,    -1.55, 1.70 ] );




//
//  Now the pins on the Connector.    #1 through #4
//


$$attribute( "COMPONENT_PIN_DEFINITION",     "1", , @scale , ,          [  -0.75,  0.75 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "1, term_x3_power_via_array");

$$attribute( "COMPONENT_PIN_DEFINITION",     "2", , @scale , ,          [   0.75,  0.75 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "2, term_x3_power_via_array");



$$attribute( "COMPONENT_PIN_DEFINITION",     "3", , @scale , ,          [  -0.75, -0.75 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "3, term_x3_power_via_array");

$$attribute( "COMPONENT_PIN_DEFINITION",     "4", , @scale , ,          [   0.75, -0.75 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "4, term_x3_power_via_array");