//
//   File:  x3y1_power_via_array
//
//   Date:  29-July-2015   original version for the Hub Module
//
//          10-June-2016   move from 0.45mm to 0.46mm drill to match other comps.
//
//          15-June-2016   Add the "Component_not_in_bom" attribute to
//                         Remove all instances of this component from the BOM.
//
//          12-Sept-2016   Move the backside copper to layer Sheet_Dielectric_2.
//                         Remove the Silkscreen from the component.
//                         Remove the Silkscreen Reference Designator.
//
//
//
//   This component is a linear array of 3 vias that use the
//   0.45 mm drill  (samilar drill as the Zone 2 connectors).
//   These 3 vias are connected together by copper on the top
//   and bottom Breakout layers.   In this geometry this copper
//   is placed on the BREAKOUT 1 and 2 layers.
//
//   These 3 vias are spaced out with 1.50 mm between them.
//
//   The intent of this "component" is that it is a ready made
//   way of getting multiple vias in a high current bus without
//   the need of placing multiple vias at  route  time.
//
//   The "pins" on this component are similar to the setup for
//   the Zone 2 connector pad stacks.
//
//
//  This component has the  Not in BOM  attribute.
//
//
//



$abort_enable = @false;
$$lock_windows(@on) ;
$$snap_diagonal(@off) ;
$$snap_orthogonal(@off) ;



//----------------------------------------------------------------------------

//   Padstack for the  X3_Power_Via_Array
//
//       0.46 mm  finished hole diameter
//       0.92 mm  land pad diameter
//       0.80 mm  solder mask opening diameter
//       1.20 mm  plane relief diameter
//
//       --> ring width                 0.23 mm
//
//       --> plane isolation Air Gap    0.14 mm
//           from the pad
//
//       NOT "Tented"   i.e. there IS solder mask relief
//

$$create_pin("term_x3_power_via_array", @replace);

$$page(0.0,0.0,0.0, @mm, 0.0, 0.0, [0.0, 0.0, 'PI$term_x3_power_via_array']);

$$point_mode(@vertex);

$$attribute( "TERMINAL_THRUHOLE_DEFINITION", "");

$$attribute( "TERMINAL_DRILL_SIZE", "", , @scale , , [ 0.46,  0.0 ]);

$$circle( "SIGNAL",                         0.0, 0.0,  0.92,  0.0 );

$$circle( "PAD",                            0.0, 0.0,  0.92,  0.0 );

$$circle( "POWER",                          0.0, 0.0,  1.20,  0.0 );

$$circle( "SOLDER_MASK",                    0.0, 0.0,  0.80,  0.0 );

//----------------------------------------------------------------------------



$$create_component("X3Y1_Power_Via_Array");

$$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'CO$X3Y1_Power_Via_Array'] );

$$point_mode(@vertex);


$$attribute( "COMPONENT_HEIGHT", "", , @scale , , [1.0, 0.0]);

$$attribute( "COMPONENT_OUTLINE_OVERHANG", "no");

$$attribute( "COMPONENT_LAYOUT_SURFACE", "both");

$$attribute( "COMPONENT_NOT_IN_BOM" );



//
//  Component Outline
//

$$initial([    1.2,    0.2 ], , @nosnap );
$$terminal([  -1.2,    0.2 ]);
$$terminal([  -1.2,   -0.2 ]);
$$terminal([   1.2,   -0.2 ]);
$$terminal([   1.2,    0.2 ]);

$$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale );




//
//  Silkscreen Outline then Details
//

// //$$template_line_style( @Solid );

// //$$initial([    1.9,    0.5 ], , @nosnap );
// //$$terminal([  -1.9,    0.5 ]);
// //$$terminal([  -1.9,   -0.5 ]);
// //$$terminal([   1.9,   -0.5 ]);
// //$$terminal([   1.9,    0.5 ]);

// //$$path( "SILKSCREEN_1", 0.20 );


//    Silkscreen  End of




//
//  Reference Designator
//

// //$$text( "SILKSCREEN", "^$ref",  0.0,   0.0,  0.3, @CC, 0, 1.00, 0.10, "std", "None", 0.0, 0.0 );




//
//   Now put copper on both the top and bottom sides
//   of the PCB to tie these vias together and make
//   a high current connection between layers.
//

$$polygon( "BREAKOUT_1", ,         [ -2.30, -0.90,    2.30, -0.90,     2.30, 0.90,    -2.30, 0.90 ] );

$$polygon( "SHEET_DIELECTRIC_1", , [ -2.30, -0.90,    2.30, -0.90,     2.30, 0.90,    -2.30, 0.90 ] );




//
//  Now the pins on the Connector.    #1 through #3
//


$$attribute( "COMPONENT_PIN_DEFINITION",     "1", , @scale , ,          [  -1.50,  0.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "1, term_x3_power_via_array");

$$attribute( "COMPONENT_PIN_DEFINITION",     "2", , @scale , ,          [   0.00,  0.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "2, term_x3_power_via_array");

$$attribute( "COMPONENT_PIN_DEFINITION",     "3", , @scale , ,          [   1.50,  0.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "3, term_x3_power_via_array");