// // File: x3y3_power_via_array // // Date: 30-July-2015 original version for the Hub Module // // 15-June-2016 Add the "Component_not_in_bom" attribute to // Remove all instances of this component from the BOM. // // 12-Sept-2016 Move the backside copper to layer Sheet_Dielectric_2. // Remove the Silkscreen from the component. // Remove the Silkscreen Reference Designator. // // // // This component is a rectangular array of 3 vias in X by // 3 vias in Y. // // These 9 vias are connected together by copper on the top // and bottom Breakout layers. In this geometry this copper // is placed on the BREAKOUT 1 and 2 layers. // // These vias are spaced out with 1.00 mm between them. // // The intent of this "component" is that it is a ready made // way of getting multiple vias in a high current bus without // the need of placing multiple vias at route time. // // This x3y3 geometry uses the pad-stack from the x3 geometry // that is named term_x3_power_via_array // // // This component has the Not in BOM attribute. // // // $abort_enable = @false; $$lock_windows(@on) ; $$snap_diagonal(@off) ; $$snap_orthogonal(@off) ; $$create_component("X3Y3_Power_Via_Array"); $$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [0.0,0.0,'CO$X3Y3_Power_Via_Array'] ); $$point_mode(@vertex); $$attribute( "COMPONENT_HEIGHT", "", , @scale , , [1.0, 0.0]); $$attribute( "COMPONENT_OUTLINE_OVERHANG", "no"); $$attribute( "COMPONENT_LAYOUT_SURFACE", "both"); $$attribute( "COMPONENT_NOT_IN_BOM" ); // // Component Outline // $$initial([ 1.3, 1.1 ], , @nosnap ); $$terminal([ -1.3, 1.1 ]); $$terminal([ -1.3, -1.1 ]); $$terminal([ 1.3, -1.1 ]); $$terminal([ 1.3, 1.1 ]); $$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale ); // // Silkscreen Outline then Details // // //$$template_line_style( @Solid ); // //$$initial([ 1.5, 1.3 ], , @nosnap ); // //$$terminal([ -1.5, 1.3 ]); // //$$terminal([ -1.5, -1.3 ]); // //$$terminal([ 1.5, -1.3 ]); // //$$terminal([ 1.5, 1.3 ]); // //$$path( "SILKSCREEN", 0.20 ); // Silkscreen End of // // Reference Designator // // //$$text( "SILKSCREEN", "^$ref", 0.0, 0.0, 0.3, @CC, 0, 1.00, 0.10, "std", "None", 0.0, 0.0 ); // // Now put copper on both the top and bottom sides // of the PCB to tie these vias together and make // a high current connection between layers. // $$polygon( "BREAKOUT_1", , [ -1.90, -1.80, 1.90, -1.80, 1.90, 1.80, -1.90, 1.80 ] ); $$polygon( "SHEET_DIELECTRIC_1", , [ -1.90, -1.80, 1.90, -1.80, 1.90, 1.80, -1.90, 1.80 ] ); // // Now the pins on the Connector. #1 through #6 // $$attribute( "COMPONENT_PIN_DEFINITION", "1", , @scale , , [ -0.75, 1.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "1, term_x3_power_via_array"); $$attribute( "COMPONENT_PIN_DEFINITION", "2", , @scale , , [ 0.25, 1.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "2, term_x3_power_via_array"); $$attribute( "COMPONENT_PIN_DEFINITION", "3", , @scale , , [ 1.25, 1.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "3, term_x3_power_via_array"); $$attribute( "COMPONENT_PIN_DEFINITION", "4", , @scale , , [ -1.25, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "4, term_x3_power_via_array"); $$attribute( "COMPONENT_PIN_DEFINITION", "5", , @scale , , [ -0.25, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "5, term_x3_power_via_array"); $$attribute( "COMPONENT_PIN_DEFINITION", "6", , @scale , , [ 0.75, 0.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "6, term_x3_power_via_array"); $$attribute( "COMPONENT_PIN_DEFINITION", "7", , @scale , , [ -0.75, -1.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "7, term_x3_power_via_array"); $$attribute( "COMPONENT_PIN_DEFINITION", "8", , @scale , , [ 0.25, -1.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "8, term_x3_power_via_array"); $$attribute( "COMPONENT_PIN_DEFINITION", "9", , @scale , , [ 1.25, -1.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "9, term_x3_power_via_array");