To:    Dean Lehocky
       ADCO Circuits
       1900 Northfield Drive
       Rochester Hills, MI  48309-3870
       Phone:  (810) 853-6620  ext 40
       FAX:    (810) 853-6698

FROM:  Steve Gross and Dan Edmunds
       Physics Department
       Michigan State University
       East Lansing, MI   48824-1116
       Phone: (517) 355-8525
       FAX:   (517) 355-6661

Subj:  Instructions for the assembly of the
       And-Or Network Module   Revision A Circuit Board
       MSU Purchase Order Number:   41226

Date:  27-JUNE-1997

Dean:

Below are the instructions for the assembly of the 30 "And-Or Network"
Module Rev. A circuit boards.  This 30 card build is divided into 2
portions:

    1. "first article" build of 2 units, scheduled for sometime in July.

       We then have 48 hours maximum to test these 2 units.

    2. The remaining 28 And-Or Network Modules within a month or so.

We have now shipped to ADCO the full kit for this build of 30 And-Or
Network Modules.  This kit includes the 30 raw circuit boards and the
Xilinx FPGA's for these 30 cards.  The kit also includes 99% of the parts
for the future builds of 60 and 30 cards in the And-Or series.

In general, we expect ADCO to perform this build to standard industry
best practices and ANSI/IPC-A-610B standards.  We have a few specific
points to address regarding component usage:

    1. Component U30, a through-hole component specified in the BOM as
       Company Part Number pn-XC17256L_8DIP (a PROM) should be replaced
       on the board with Company Part Number pn-dip_8_socket (a socket).

       Note that we have provided these sockets, but have not provided
       the PROMs, which we will install in-house.


    2. Components R146 through R155, through-hole components specified
       in the BOM as Company Part Number pn-106A560 (resistors), should
       be replaced on the board with Company Part Number pn-sip_6_socket
       (sockets).

       Note that we have provided "socket strip" from which appropriate
       length segments can be cut, but have not provided the resistors,
       which we will install in-house.



    3. Component P8, a through-hole component specified in the BOM as
       Company Part Number pn-FTC-1101 (a daughterboard) should be
       replaced on the board with Company Part Number pn-AMP_104078-6
       (a connector).

       Note that we have provided the connector, but have not provided
       the daughterboard, which we will install in-house.


    4. Connectors P1-P3 should be attached to the board using the
       supplied M2.5 hardware and the Schroff Stiffener Bar.  Please
       see the drawing for details about this assembly.  The curved
       washers are included with the Stiffener Bar.  These washers
       are installed with their convex side against the screw head.


    5. Connectors P4 and P5 are attached to the board in the normal
       manner using the supplied M2.5 x 12mm screws and M2.5 Hex Nuts.


We have a final special favor that we would like to ask of you.  During
the second half of this build, when you are assembling the 28 And-Or
Network Modules, we would like to substitute on just two of these cards
a different type of FPGA.  On two of these cards we would like to replace
all 18 of the Xilinx pn-XC4013L_240QFP  FPGA's that we have normally been
using with a newer version of this part called the pn-XC4013XL_240QFP.

We are still waiting to receive "engineering samples" of this newer "XL"
part.  If we can obtain them before you begin the build then we hope to
get them to ADCO in time to ask you to build two of the And-OR Modules
using this new "XL" type of Xilinx FPGA.


Please feel free to contact us regarding any assembly issues that arise
from these instructions.

                                Dan