DATE: 13-AUG-1996 TO: Tom Bresnan and David Goecke Multek, Inc. 16 Hammond Irvine CA 92718 FROM: Steve Gross and Dan Edmunds Physics Department Michigan State University East Lansing, MI 48824-1116 Phone: (517) 355-8525 Email: Edmunds@pa.msu.edu FAX: (517) 355-6661 RE: Manufacture the quantity 20 of Printed Circuit Boards (FM Rev A.2) Michigan State University Purchase Order Number Pending ------------------------------- --- GOOD for Production --- ------------------------------- Foundation Module PCB Rev A.2 (FM Rev A.2) ----------------------------------------------- This bid request is for the manufacture of the quantity of 20 of a printed circuit board referred to as the Foundation Module (FM) printed circuit board. The FM printed circuit board has 14 layers. 8 of these layers are trace layers and 6 of the layers are internal power and ground plane layers. This circuit board uses both through hole and single sided surface mount components. The boards will use 1 oz copper on all layers. The cards have 5 different hole sizes. The size of each type of hole is specified below. A mechanical drawing with appropriate dimensions is provided in this bid package. These printed circuit boards have a solder mask on both sides and a silk screen pattern on only the component side. The minimum trace width on these boards is 7 mills, the minimum clearance between traces is 12 mills, the minimum trace to pad clearance is 5 mills, and the minimum pad to pad clearance (on the 240 pin PQFP) is 10 mills. The coordinates for the centers of the drill holes will be provided to the vendor as an Excellon format drill file using a separate T-Code for each hole size. The 18 Gerber files and the 1 Excellon files that describe this circuit board have been placed, via anonymous ftp, in a directory on the Multek Chopin host. These files are in the directory: /guests/msu/fm_a2/. ------------------------------- --- GOOD for Production --- ------------------------------- We would like the following delivery schedule: Deliver copies of the photoplots of each Gerber file for our approval within one week after receipt of the design data. Do not start the actual manufacturing of the printed circuit boards until you receive our approval of the photoplot copies. Deliver 20 printed circuit boards to us within 4 weeks of our approving the photoplots. The assembly description of the FM Rev. A.2 circuit card follows. ------------------------------- --- GOOD for Production --- ------------------------------- Data for the Manufacture of the 20 FM Rev A.2 Boards -------------------------------------------------------- There are 18 Gerber files: File Pos/Neg Number File Contents Data ------ ------------------------ ------- 1 Board Outline Test Plot POS 2 Component Side Traces 1 POS 3 Internal Traces 2 POS 4 VTT Plane NEG 5 Internal Traces 4 POS 6 Internal Traces 5 POS 7 GND Plane A NEG 8 VDD Plane NEG 9 VCC Plane NEG 10 GND Plane B NEG 11 Internal Traces 10 POS 12 Internal Traces 11 POS 13 VEE Plane NEG 14 Internal Traces 13 POS 15 Solder Side Traces 14 POS 16 Component Side Solder Mask NEG 17 Solder Side Solder Mask NEG 18 Component Side Silkscreen POS The following tables summarize the correspondence between the Gerber Draft Codes used and the apertures expected. The following is the Aperture Table for all artwork files EXCEPT: Component Side Solder Mask (artwork_16) and Solder Side Solder Mask (artwork_17). D Code Shape Type Width(X) Height(Y)/Diameter ------ ----- ---- -------- ------------------ 10 circle trace 0.000000 0.010000 11 circle trace 0.000000 0.007000 12 circle trace 0.000000 0.025000 13 circle trace 0.000000 0.012000 14 circle flash 0.000000 0.033000 15 circle flash 0.000000 0.060000 16 oval flash 0.035000 0.045000 17 rectangle flash 0.063000 0.063000 18 rectangle flash 0.110000 0.106000 19 rectangle flash 0.106000 0.110000 70 rectangle flash 0.085000 0.110000 71 rectangle flash 0.051200 0.009850 20 rectangle flash 0.032000 0.043000 21 rectangle flash 0.025000 0.080000 22 rectangle flash 0.080000 0.025000 23 rectangle flash 0.009850 0.051200 24 rectangle flash 0.014000 0.084000 25 rectangle flash 0.043000 0.032000 26 rectangle flash 0.126000 0.070000 27 rectangle flash 0.110000 0.085000 28 circle flash 0.000000 0.057000 29 circle thermal flash 0.000000 0.057000 72 circle flash 0.000000 0.084000 73 oval flash 0.045000 0.060000 125 oval thermal flash 0.045000 0.060000 126 circle thermal flash 0.000000 0.084000 127 circle flash 0.000000 0.150000 128 circle trace 0.000000 0.200000 130 circle trace 0.000000 0.020000 131 rectangle flash 0.275000 0.525000 132 circle trace 0.000000 0.015000 133 circle flash 0.000000 0.039350 134 circle flash 0.000000 0.195000 Thermal relief D29 Tie is 0.012 Air Gap is 0.012 Thermal relief D125 Tie is 0.012 Air Gap is 0.005 Thermal relief D126 Tie is 0.012 Air Gap is 0.012 ------------------------------- --- GOOD for Production --- ------------------------------- The following is the Aperture Table for: Component Side Solder Mask (artwork_16) and Solder Side Solder Mask (artwork_17). D code Shape Type Width(X) Height(Y)/Diameter ------ ----- ---- -------- ------------------ 10 circle trace 0.000000 0.010000 14 circle flash 0.000000 0.038000 15 circle flash 0.000000 0.065000 16 oval flash 0.040000 0.050000 17 rectangle flash 0.068000 0.068000 18 rectangle flash 0.115000 0.111000 19 rectangle flash 0.111000 0.115000 70 rectangle flash 0.090000 0.115000 71 rectangle flash 0.056200 0.014850 20 rectangle flash 0.037000 0.048000 21 rectangle flash 0.030000 0.085000 22 rectangle flash 0.085000 0.030000 23 rectangle flash 0.014850 0.056200 24 rectangle flash 0.019000 0.089000 25 rectangle flash 0.048000 0.037000 26 rectangle flash 0.131000 0.075000 27 rectangle flash 0.115000 0.090000 135 circle flash 0.000000 0.196850 136 circle flash 0.000000 0.118100 ------------------------------- --- GOOD for Production --- ------------------------------- This board uses 5 different hole sizes. These holes sizes are summarized in the following table: Description of the Hole Sizes Used on the FM Rev A.2 Card ----------------------------------------------------------- Finished Hole Size Function -------------- ------------------------------------------------------- 0.013" There will be 3,860 of the 0.013" diameter holes in this board. The tolerance of these holes is +/- 0.003". These holes are for vias and ALL of them should be plated through. This hole is T-Code T1 in the Excellon drill file. 0.022" There will be 60 of the 0.022" diameter holes in this board. The tolerance of these holes is +/- 0.003". These holes are for "pin-through-hole" component pins and ALL of them should be plated through. This hole is T-Code T2 in the Excellon drill file. 0.038" There will be 822 of the 0.038" diameter holes in this board. The tolerance of these holes is +/- 0.003". These holes are for "pin-through-hole" component pins and ALL of them should be plated through. This hole is T-Code T3 in the Excellon drill file. 0.106" There are 25 of the 0.106" diameter holes in this board. These holes are for the mechanical mounting of components and the front panel. These holes should NOT be plated through. This hole is T-Code T4 in the Excellon drill file. 0.125" There are 3 of the 0.125" diameter holes in this board. These holes are the "tooling holes" for the alignment of this card with equipment (e.g. the solder paste stencil) at the board assembly vendor. These holes should NOT be plated through. This hole is T-Code T5 in the Excellon drill file. -------------------------------------------------- ALL HOLE DIAMETERS ARE GIVEN AS THE FINISHED SIZE. -------------------------------------------------- ------------------------------- --- GOOD for Production --- ------------------------------- Data for Assembly of the FM Rev. A.2 Printed Circuit Boards --------------------------------------------------------------- Circuit board name: Foundation Module (FM) Rev A.2 Quantity: Twenty (20) Boards Circuit Board Material: G10 (FR4) Overall Circuit Board Thickness: This card is to be built with a dielectric that has a thickness in the range 0.006" to 0.008". This will yield a finished board with an approximate thickness in the range 0.090" to 0.115". The left and right edges must be milled to 0.070 mills thickness by removing material from the SOLDER side of the card. Material is to be removed in a strip 80 mills wide running the whole way from the top to the bottom of the card. This is to allow this card to fit in standard card guides. See the attached drawing. Copper thickness: 1 oz copper to be used on all 14 layers Overall Circuit Board Size: 15.748" x 14.437" rectangular board. The board outline, as indicated by the center of the line drawn in the Test Plot, indicates the real finished board size. Layers: 14: 2 external signal layers, 6 internal signal layers, and 6 internal power/ground planes Solder plating: Only the area of copper NOT covered by the solder mask should be solder plated. (i.e. Solder Mask over Bare Copper). The hot air leveling of this solder coating must be done accurately enough to facilitate the mounting of the high pin count 20 mil lead pitch SMD components. Solder Mask: BOTH SIDES (different on component and solder sides) Use a Liquid Photo Imagable solder mask. Silk Screen: On the component side only. Holes: There are 5 different hole sizes. ------------------------------- --- GOOD for Production --- ------------------------------- ASSEMBLY OF THE BOARD Order of the Layers: --------------------------------------------- Component Side Silk Screen File Number 18 Component Side Solder Mask File Number 16 Layer 1: Component Side Traces 1 File Number 2 Layer 2: Internal Traces 2 File Number 3 Layer 3: VTT Plane File Number 4 Layer 4: Internal Traces 4 File Number 5 Layer 5: Internal Traces 5 File Number 6 Layer 6: GND Plane A File Number 7 Layer 7: VDD Plane File Number 8 Layer 8: VCC Plane File Number 9 Layer 9: GND Plane B File Number 10 Layer 10: Internal Traces 10 File Number 11 Layer 11: Internal Traces 11 File Number 12 Layer 12: VEE Plane File Number 13 Layer 13: Internal Traces 13 File Number 14 Layer 14: Solder Side Traces 14 File Number 15 Solder Side Solder Mask File Number 17 ------------------------------- --- GOOD for Production --- ------------------------------- BILLING AND SHIPPING INFORMATION ---------------------------------- The photoplots and finished cards should be SHIPPED to: Physics Electronics Shop 211 Physics/Astronomy Building Michigan State University East Lansing, MI 48824-1116 attn: Steve Gross/Dan Edmunds This order should be BILLED to: Accounts Payable 366 Administration Building Michigan State University East Lansing, MI 48824 This is Michigan State University Purchase Order Number: 17072-NLV