HSROCB High Speed ReadOut Circuit Board ----------------------------------- Original Rev. 10-SEP-1998 Most Recent Rev. 12-NOV-1998 Should we build our own mezzanine circuit boards to hold the G-Link chip and Finisar laser module combination. From Finisar the G-Link Laser circuit boards are $983 ea in qty 25:99 This is Finisar part number: FTC-1101-1 The laser module itself is part number FTM-8510-1-0-1 and they are $184 each in qty 25:99. G-Link chips are $75 in qty of 1:10. Estimate raw circuit board cost of $35 ea plus $300 tooling based on 6 layer board i.e.the gated scaler PB Estimate assembly cost of $50 ea plus $260 setup based on 1/2 THE-Card assembly cost plus Hughes setup. Estimate the additional passive components at $10 per card Note that we already have the AMP connectors for the cards. Build 80 cards so split the setup and tooling by 80. Laser Module $184 G-Link Chip 75 Raw PCB 39 Assembly 54 Passive + 10 ------- Total $362 If this estimate to build the cards ourselves is correct then we save $621 per card or a total of $ 49,680 on the purchase of 80 cards. $ 983 x 80 = $ 78,640 $ 362 x 80 = $ 28,960 ---------- View of how many cards to build as of 12-NOV-1998 Running L1 FW cards that need HSROCB 33 Estimate of the Running L2 FW with HSROCB 4 Spare cards at Fermi with HSROCB a 10 (2ea TRM,AOM,FOM,TDM,SM) Estimate of Helper cards that need HSROCB 4 (2 to L1, 2 to L2,) HSROCB to readout the L1 Cal Trig 12 HSROCB cards in the MSU Test Rack + 22 <-- How much is real ? -------- 85 So this 85 must contain a number of spares because the MSU Test Rack can not really need 22. We have 6 cards now so lets build 80 but get 10 extra of the HP HDMP-1012 G-Link Chips. ---------- Circuit Difference: Finisar vs MSU ------------------------------------ G-Link Chip NC Pin Changes NC G-Link pins 5,6 26:32 On the Finisare pcb these 9 pins are not connected to anything. On the MSU card they will be connected to the Gnd Plane. G-Link Chip Outputs HCLK G-Link pins 11,12 These are outputs. On Finisar pcb they are not pulled to Vtt via 51 Ohm resistors and capacitor coupled to a pad. We will just bring them out to small pads. INV G-Link pin 25 This is an output. On the Finisar pcb it is pulled to GND via 1k Ohm. IN the HP specification it says that it should be pulled to Vee with a 1k Ohm. We will just bring it out to a small pad. Strobe_Out G-Link pin 76 This is an output. On the Finisar pcb it is pulled to Vtt via 270 Ohm resistor and presented to a pad. We will just bring it out to a small pad. LOCKED G-Link pin 75 This is an output. On the Finisar pcb it is just connected to pin 32 of the board connector. We will also have a convienient well labeled pad on this signal in case we want to probe it. G-Link Chip Inputs HCLKON G-Link pin 10 This is an input. On the Finisar pcb it is pulled to Vtt vai 220 Ohm and brought out to jumpers to pull it Hi = Gnd. We always want it voltage low so in principal we could let it float (pg 39) but because it is adjacent to pin 9 i.e. STRBIN* which does have high speed edges we need to pull it down harder (pg 39) so lets pull it to Vtt with 1k Ohm and keep it away from pin 9. Keeping HCLKON voltage low keeps the HCLK outputs disabled. MDFSEL G-Link pin 74 This is an input. On Finisar pcb this is tied to GND. But we always want it to be voltage low to because we do not want double frame mode. This pin is between M20SEL and LOCKED both of which should be stable so there are no high frequency adjacent signal issues. So we will float this pin (pg 39) and tie it to a small pad. EHCLKSEL G-Link pin 78 This is an input. On Finisar pcb it was pulled to Vtt via 220 Ohms. We always want this voltage because we always want to have STRBIN be at the frame rate and not at the serial bit stream rate. So we can float this pin (pg 39) and it will go voltage low. Its neighbors are both Gnd so there is no noise. We can bring it to a small pad. Finisar Module Connections Vcc Finisar Module pin 3 We will use two ceramic bypass caps instead of just the one that Finisar uses. RX SYS2 Finisar Module pin 17 Finisar PCB ties this through an LED and a 1k Ohm series resistor to Vcc and to pin 28 of the board connector. We will just pull it to Vcc via two 1k Ohm resistors in series and tie it to pin 28 on the board connector, i.e. no LED. G-Link Dout pin 17 to Laser module Tx+ pin 10 On the Finisar board this hops over the complement trace via a zero Ohm resistor. We will use a 0.1 uFd cap to accomplish the samething. Component Changes We will use 1205 parts instead of the ??? parts that Finisar uses. We may use a SMD inductor instead of the ferite bead on the wire. Physical Changes Finisar used one size hole for mounting the Laser Module to their card and a different size hole for mounting their card to its supporting board. We will use 135 mil diameter holes in the HSROCB for both Laser Module mounting and mounting the HSROCB to the THE-Card. Finisar connected the laser mounting holes in their circuit board to the digital Laser ground. They floated their board mounting holes. We will float both of our holes an in fact relieve the Gnd and Power planes from the vicinity of these holes. Note that the metal ST connector on the front of the Finisar laser module is connected to the laser module ground pins. Components and References used on HSROCB ---------------------------------------- HP G-Link chip HDMP-1012 U1 Laser Module Finisar FTM-8510-1 U2 note the laser module is soldered directly to the circuit board without a connector. Connector AMP 104068-6 J1 Chip Resistor 10 Ohm R1 :R4 Vee ByPass Chip Resistor 51 Ohm R11:R12 Terminate STRBIN Chip Resistor 1k Ohm R21 HCLKON pull down R22:R24 Laser Mod Lines Resistor Network 51 Ohm CTS 766-161-510 R31, R32 Terminator Chip Capacitor 0.1 uFd bypass quality C1 :C6 Vee C11:C18 Vtt C21:C22 Vcc Chip Capacitor 0.1 uFd 10% good quality C31:C32 Strobe AC Couple C33 Loop Filter C34 DOut-Tx hop over Ferite or Filter Inductor (SMD ?) L1 Physical Specifications: ------------------------ The mounting holes in the Laser Module must be for 2-56 screws. They measure somewhere between 0.082" & 0.086" in diameter. A 2-56 screw should use a #44 body drill. The holes in the circuit board for the Laser Module mounting screws measure about 0.140" diameter, i.e. a #28 drill. These holes appear to be the proper size. The holes in the circuit board for mounting the circuit board to the brackets on THE-Card measure in the range of 0.152" to 0.154" in diameter, i.e. a #23 or #24 drill. We use a 4-40 screw to hold down these circuit boards. 4-40 screws typically use a #33 body drill which is 0.113" diameter. These holes are a good size for this use. We will use 135 mil diameter holes in the HSROCB for both Laser Module mounting and mounting the HSROCB to the THE-Card. Components that are on the "Solder Side" of the Finisar circuit board: The two 16 pin SOIC resistor arrays Various Vtt bypass capacitors Two Vtt bypass capacitors by pin 16 of each of the 16 pin SOIC resistor arrays. These are in two different sizes, one of each size by each resistor array. A Vtt bypass by each of the terminator resistors for the StrobeIn signals. The terminator resistors and the AC coupling capacitors for the two StrobeIn signals. The Vcc bypass capacitor for the Laser supply. Three sets of bypass capacitor plus series resistor for the Vee supply. These cover the bypass near pins 41,42, 62,62 and 80. The solder side has the traces for: Laser to J1, StrobeIn, and G-Link "LoopEn" i.e. J1 pin 23. Components that are on the "Component Side" of the Finisar circuit board: Laser, G-Link chip, Vcc filter inductor, J1 Two bulk filter caps on Vee The Vee bypass series resistor combination near pins 21,22 The resistors that define the static level inputs to G-Link chip and Laser. The bulk of the J1 to G-Link traces and the two G-Link to Laser module. Review of the Various G-Link Chips ---------------------------------- HDMP-1002 Vee range -4.5V : -5.5V Typ 340 ma min 1.53 Watts 68 lead ceramic quad flatpack max 1.87 Watts 110 to 1400 MBaud, ECL I/O, BiPolar HDMP-1012 Vee range -4.5V : -5.5V Typ 403 ma so for 4.5 1.73 Watts 80 lead aluminum M-Quad package max 2.22 Watts 150 to 1500 MBaud, ECL I/O, BiPolar HDMP-1022 Vcc +5.0V Typ 385 ma Max 470 ma typ 1.93 Watts 80 lead aluminum M-Quad package max 2.35 Watts 150 to 1500 MBaud, TTL I/O, BiPolar HDMP-1032 Vcc in range +3.3V @ ??? ma typ . Watts