DATE: 30-JANUARY-1997 TO: Sovereign Circuits 12808 DeBartolo Drive North Jackson, OH 44451 Phone: (330) 538-3900 FAX: (330) 538-3820 or (330) 538-2434 attn: Ron Bull FROM: Dan Edmunds and Steve Gross Physics Department Michigan State University East Lansing, MI 48824-1116 Phone: (517) 355-8525 Email Edmunds@pa.msu.edu FAX: (517) 355-6661 RE: Manufacture the quantity 20 of P1BP Rev. B Printed Circuit Boards Michigan State University Purchase Order Number ?? ------------------------------- --- GOOD for Production --- ------------------------------- P1 Backplane Rev. B Printed Circuit Board -------------------===------------------------ These instructions are for the manufacture of the quantity of 20 of a printed circuit board referred to as the P1 Backplane (P1BP) printed circuit board. The P1 printed circuit board has 13 layers. 4 of these layers contain only a power or ground plane and the other 9 layers contain a combination of traces and ground planes. The board uses 1 oz copper on all layers. The board has 3 different hole sizes. The size of each type of hole is specified below. A mechanical drawing with appropriate dimensions is provided in this package. This board has a solder mask on both sides (same solder mask used on each side) and silkscreen on each side (different silkscreens used on each side). The minimum trace width on these boards is 11 mills, the minimum clearance between traces is 10 mills, and the minimum trace to pad clearance is 12 mills. The artwork data is provided in 17 Gerber data files on the enclosed 3.5" IBM-PC format diskette. The aperture table to be used with this Gerber data is both described below and included on the enclosed diskette. The drill information is provided in an Excellon format data file on the enclosed diskette. ------------------------------- --- GOOD for Production --- ------------------------------- We would like the following delivery schedule: Deliver copies of the photoplots of each Gerber file for our approval within one week after receipt of the design data. Do not start the actual manufacturing of the printed circuit boards until you receive our approval of the photoplot copies. Deliver 20 printed circuit boards to us within 4 weeks of our approving the photoplots. The assembly description of the P1BP Rev. B circuit card follows. ------------------------------- --- GOOD for Production --- ------------------------------- Data for the Manufacture of the 20 P1BP Rev B Boards ------------------------------------------------------ There are 17 Gerber files: PCB File Name Layer Description Data Type --------- ----- ----------- --------- ART_01.GRB Board Outline Test Plot POSITIVE ART_02.GRB 1 Component Side Ground Plane NEGATIVE ART_03.GRB 2 A Even traces and +12 Plane NEGATIVE ART_04.GRB 3 B Even traces and -12 Plane NEGATIVE ART_05.GRB 4 Ground Plane NEGATIVE ART_06.GRB 5 A Odd traces and +5 Plane NEGATIVE ART_07.GRB 6 B Odd traces and Ground Pane NEGATIVE ART_08.GRB 7 C Signal Trc and +5 STDBY Plane NEGATIVE ART_09.GRB 8 D Even traces and Ground NEGATIVE ART_10.GRB 9 E Even traces and +5 Plane NEGATIVE ART_11.GRB 10 Ground Plane NEGATIVE ART_12.GRB 11 D Odd traces and -4.5 Plane NEGATIVE ART_13.GRB 12 E Odd traces and -2.0 Plane NEGATIVE ART_14.GRB 13 Solder Side Ground Plane NEGATIVE ART_15.GRB Solder Mask (same both sides) NEGATIVE ART_16.GRB Component Side Silkscreen POSITIVE ART_17.GRB Solder Side Silkscreen POSITIVE The following is the Aperture Table for all artwork files. It is stored on the enclosed diskette as APERTURE.TBL: Dcode Shape Type Width(X) Height(Y)/Diameter ----- ----- ---- -------- ------------------ 10 circle trace 0.010 12 circle flash 0.084 14 circle flash 0.150 16 circle flash 0.065 19 rectangle flash 0.525 0.175 70 circle trace 0.100 ------------------------------- --- GOOD for Production --- ------------------------------- This board uses 3 different hole sizes. These hole sizes are summarized in the following table: Description of the Hole Sizes Used on the P1BP Rev B Card --------------------------------------------------------- Finished Hole Size Function -------------- ------------------------------------------------------- 0.020" There are 380 of these 0.020" diameter holes in this board. The tolerance of these holes is +/- 0.003". These holes are for vias and ALL of them should be plated through. This hole is T-Code T1 in the Excellon drill file. 0.039" There are 3590 of these 0.039" diameter holes in this board. The tolerance of these holes is +0.003" -0.002". These holes are for the connector press-fit pins and other vias and ALL of them should be plated through. This hole is T-Code T2 in the Excellon drill file. 0.106" There are 84 of these 0.106" diameter holes in this board. These holes are for mounting this board to the cardfile mechanics and for mounting the connector shrouds to the board and they should NOT be plated through. This holes is T-Code T3 in the Excellon drill file. -------------------------------------------------- ALL HOLE DIAMETERS ARE GIVEN AS THE FINISHED SIZE. -------------------------------------------------- ------------------------------- --- GOOD for Production --- ------------------------------- Data for Assembly of the P1BP Rev. B Printed Circuit Boards ------------------------------------------------------------- Circuit board name: P1 Backplane (P1BP) Rev. B Quantity: Twenty (20) Boards Circuit Board Material: G10 (FR4) Overall Circuit Board Thickness: At least 0.125 mills. Please contact us to discuss the board thickness before production begins. Copper thickness: 1 oz copper to be used on all 13 layers Overall Circuit Board Size: 5.118" x 16.744" rectangular board. The board outline, as indicated by the center of the line drawn in the Test Plot, indicates the real finished board size. Layers: 13: 2 external ground plane layers, 2 internal ground plane layers, and 9 internal trace - plane layers. Tin plating: Only the area of copper NOT covered by the solder mask should be tin plated. (i.e. Solder Mask over Bare Copper). Solder Mask: BOTH SIDES (same on component and solder sides) Silk Screen: BOTH SIDES (different on component and solder sides) Holes: There are 3 different hole sizes. ------------------------------- --- GOOD for Production --- ------------------------------- ASSEMBLY OF THE BOARD Order of the Layers: --------------------------------------------- Component Side Silk Screen File Number 16 Component Side Solder Mask File Number 15 Layer 1: Component Side Ground Plane File Number 2 Layer 2: A Even Traces and +12 plane File Number 3 Layer 3: B Even Traces and -12 plane File Number 4 Layer 4: Ground Plane 4 File Number 5 Layer 5: A Odd Traces and +5 plane File Number 6 Layer 6: B Odd Traces and Ground Plane File Number 7 Layer 7: C Signal Traces and Stby Plane File Number 8 Layer 8: D Even Traces and Ground Plane File Number 9 Layer 9: E Even Traces and +5 Plane File Number 10 Layer 10: Ground Plane 10 File Number 11 Layer 11: D Odd Traces and -4.5 Plane File Number 12 Layer 12: E Odd Traces and -2.0 Plane File Number 13 Layer 13: Solder Side Ground Plane File Number 14 Solder Side Solder Mask File Number 15 Solder Side Silk Screen File Number 17 ------------------------------- --- GOOD for Production --- ------------------------------- Notes about the layers: All 13 layers in this P1 Backplane contain a significant amount of plane copper. The bottom 1/4 off all layers is solid copper. The internal layers all contain a significant amount of power or ground plane. The two surface layers are solid plane copper. Internal layers #4, #10 are also solid plane copper. The other internal layers are a significant amount of plane copper plus typically a small number of traces. The Gerber data for all of the layers is "negative data", i.e. where the photo-plot is clear there should be copper in the finished circuit boards. All components on this circuit board are "press in" parts. Only two part types are used: 160 pin ERNI DIN connectors and AMP ten pin "power taps". Because this card is not soldered, no thermal reliefs are used. All connector pins and "power tap" pins that connect to a plane are buried in that plane. Besides the holes used by the 160 pin DIN connectors and the "power taps" this card has some additional vias. There is one 0.039" via and nineteen 0.020" via's between each adjacent pair of 5 row DIN connectors. These via's are used to connect ground traces and planes together on all layers. No components are installed in these via's. These via's are covered by the solder mask. The solder mask photo-plot is also negative data. Where this plot is clear, solder mask should be applied to the circuit board. Only the two silk screen photo-plots are positive data. ------------------------------- --- GOOD for Production --- ------------------------------- BILLING AND SHIPPING INFORMATION ---------------------------------- The photoplots and finished cards should be SHIPPED to: Physics Electronics Shop 211 Physics/Astronomy Building Michigan State University East Lansing, MI 48824-1116 attn: Steve Gross/Dan Edmunds This order should be BILLED to: Accounts Payable 366 Administration Building Michigan State University East Lansing, MI 48824 This is Michigan State University Purchase Order Number: ??