DATE: 21-AUG-1998 TO: Manufacture of 5 Circuit Boards FROM: Dan Edmunds and Steve Gross Physics Department Michigan State University East Lansing, MI 48824-1116 Phone: (517) 355-8525 Email Edmunds@pa.msu.edu FAX: (517) 355-6661 RE: Manufacture of 5 different types of Printed Circuit Boards Michigan State University Purchase Order Number ?? ------------------------------- --- Good for Production --- ------------------------------- This note covers the manufacture of 5 different types of small adapter printed circuit boards (paddle boards). All 5 of these cards employ the same circuit board stack up and have many other common features. The following table gives the names of these circuit boards, the quantity that we need manufactured, and the over all size of each board. Quantity to Circuit Board Name Manufacture Over All Size ----------------------------- ----------- --------------- Term Receiver Paddle Board 50 2.900" x 4.950" Per Bunch Scaler Paddle Board 80 2.100" x 4.050" Gated Scaler Paddle Board 50 3.310" x 4.050" Trigger Decision Paddle Board 30 3.600" x 4.550" Rear Paddle Board 100 2.900" x 4.950" Three of these circuit boards: the Term Receiver PB, the Trigger Decision PB, and the Rear PB each have a small notch cut out of two corners as shown in the drawings. Common Features of these Circuit Boards --------------------------------------- Circuit Board Material: G10 (FR4) Overall Circuit Board Thickness: nominal thickness of 0.062 inch Circuit Board Size: The table above shows the over all size of these 5 circuit boards. Note also that the board outline, as indicated by the center of the line drawn in the Test Plot, indicates the real finished board size. Layers: 5: 2 external signal trace layers 2 internal signal trace layers 1 internal ground plane Copper thickness: 1 oz copper to be used on all layers Solder Mask: BOTH SIDES Different solder masks are used on the component and solder sides. Use a Liquid Photo Imagable solder mask. Solder plating: Only the area of copper NOT covered by the solder mask should be solder plated. (i.e. Solder Mask over Bare Copper). Silk Screen: Only the Component Side has a Silk Screen Delivery Schedule: 4 weeks after approval of photo-plots Holes: There are 3 different hole sizes. These are FINISHED hole sizes. ALL of the 13 mil and 40 mil holes are PLATED. NONE of the 106 mil holes are plated. Hole Count vs Board Type -------------------------------------------------- FINISHED T Term Per Bunch Gated Trigger Rear Hole Size Code Receiver Scaler Scaler Decision Pdl Brd --------- ---- -------- --------- ------ -------- ------- 13 mil 1 100 96 104 214 96 40 mil 2 298 228 290 282 298 106 mil 3 8 4 4 4 12 Gerber File vs Board Layer ---------------------------------------------- File Name Contents Location in Board Stack -------------- ---------------------------- ------------------------ ArtWork_01.Grb Test plot of board outline ArtWork_02.Grb Component side Traces & Pads Component Side ArtWork_03.Grb Layer #2 traces Next to Component Side ArtWork_04.Grb Ground Planes Center Ground Plane ArtWork_05.Grb Layer #5 traces Next to Solder Side ArtWork_06.Grb Solder side Traces Solder Side ArtWork_07.Grb Component side Silkscreen On the Component Side ArtWork_08.Grb Solder Mask Component Side On the Component Side ArtWork_09.Grb Solder Mask Solder Side On the Solder Side The ground plane layer, i.e. file #4 is supplied as negative data. This ground plane layer is mostly a copper plane and covers almost the entire area of the board. The Solder Mask, i.e. files 8, and 9 are is also supplied as negative data. All of the 33 mil via's are completely covered by solder mask. All other files are positive data. Aperture Table ----------------------------------------------------- The same Aperture Table is used for plotting all 5 of these circuit boards. Aperture Table used for all plots EXCEPT for the two Solder Masks ----------------------------------------------------------------- Height(Y)/ Thermal Dcode Shape Type Diameter Width(X) Relief ----- -------- ----- ---------- -------- ------- 10 circle trace 0.010 - - 11 circle trace 0.012 - - 12 circle trace 0.008 - - 13 circle flash 0.033 - - 14 circle flash 0.060 - - 15 rectangle flash 0.025 0.080 - 16 circle flash 0.057 - - 17 circle flash 0.084 - - 18 circle flash 0.084 - YES 19 circle flash 0.150 - - 70 circle trace 0.300 - - Definition of the Thermal Relief Aperture D-Code 18 "D" Code 18 is a Thermal Relief Aperture This thermal relief consists of a 0.060" diameter inner pad followed by a 0.012" wide air gap around this pad. This makes the full outer diameter 0.084". The air gap is crossed by 4 copper ties. Each tie is 0.012" wide. The ties run at 45 degrees to the X and Y axis. Aperture Table used ONLY for the two Solder Masks ------------------------------------------------- Height(Y)/ Thermal Dcode Shape Type Diameter Width(X) Relief ----- -------- ----- ---------- -------- ------- 10 circle trace 0.010 - - 14 circle flash 0.065 - - 15 rectangle flash 0.030 0.085 - Circuit Board Cross Section --------------------------- The following sketch shows the stack up to be used for all 5 of these circuit boards. Nominal thickness of the dielectric layers is shown. Cross Section of the Circuit Board ------------------------------------- - Silkscreen - Solder Mask Comp Side -------------------- - Component Side Trace Layer +------------------------+ | Dielectric 8 mil | +------------------------+ -------------------- - Next to Comp Side Trace Layer +------------------------+ | Dielectric | | 24 mil | +------------------------+ -------------------- - Center Ground Plane Layer +------------------------+ | Dielectric | | 24 mil | +------------------------+ -------------------- - Next to Solder Side Trace Layer +------------------------+ | Dielectric 8 mil | +------------------------+ -------------------- - Solder Side Trace Layer -Solder Mask Solder Side NOTE: The actual board cross section that will be used in manufacturing +++++ these 5 boards is being worked out via FAX with RJ. ASSEMBLY OF THE BOARD Order of the Layers: --------------------------------------------- Component Side Silk Screen File Number 7 Component Side Solder Mask File Number 8 Layer 1: Component Side traces and pads File Number 2 Layer 2: Next to Comp Side traces File Number 3 Layer 3: Ground Plane File Number 4 Layer 4: Next to Solder Side traces File Number 5 Layer 5: Solder Side traces File Number 6 Solder Side Solder Mask File Number 9 If there are any questions or suggestions about the production of these circuit boards please contact: Dan Edmunds Physics Department Michigan State University East Lansing, MI 48824-1116 Phone: (517) 355-8525 Email Edmunds@pa.msu.edu FAX: (517) 355-6661 The check copies of the photoplots should be SHIPPED to: Daniel Edmunds 211 Physics/Astronomy Building Michigan State University East Lansing, MI 48824-1116 This order should be BILLED to: Accounts Payable 366 Administration Building Michigan State University East Lansing, MI 48824 This is Michigan State University Purchase Order Number: ??