DATE: 25-MAR-1998 TO: Tom Bresnan and David Goecke Multek, Inc. 16 Hammond Irvine CA 92718 FROM: Steve Gross and Jason Biel Physics Department Michigan State University East Lansing, MI 48824-1116 Phone: (517) 355-8525 Email: gross@pa.msu.edu FAX: (517) 355-6661 RE: Manufacture the quantity 15 of Printed Circuit Boards (TDM Rev. A) Michigan State University Purchase Order Number 66145 ------------------------------- --- GOOD for Production --- ------------------------------- Trigger Decision Module PCB Rev. A (TDM) ----------------------------------------------- The following files have been placed in Multek's Chopin host, in the directory: /guests/msu/tdm: 18 Gerber format artwork files: artwork_1 .. artwork_18 1 Excellon format drill file: drill_plt_unplt 2 Gerber aperture tables: ap_table_1_16, ap_table_17_18 1 Excellon drill table: drill_table 1 copy of these instructions: README.TXT 2 dimensioned drawings in Encapsulated PostScript format: dim_draw_1.eps, dim_draw_2.eps Please manufacture 15 Trigger Decision Module (TDM) Rev. A PCB's based on this data. These printed circuit boards have a solder mask on both sides and a silk screen pattern on only the component side. The minimum trace width on these boards is 7 mills, the minimum clearance between traces is 12 mills, the minimum trace to pad clearance is 5 mills, and the minimum pad to pad clearance (on the 240 pin PQFP) is 10 mills. ------------------------------- --- GOOD for Production --- ------------------------------- We would like the following delivery schedule: Deliver copies of the photoplots of each Gerber file for our approval within one week after receipt of the design data. Do not start the actual manufacturing of the printed circuit boards until you receive our approval of the photoplot copies. Deliver the full quantity of printed circuit boards to us within 4 weeks of our approving the photoplots. The assembly description of the TDM Rev. A circuit card follows. ------------------------------- --- GOOD for Production --- ------------------------------- Data for the Manufacture of the TDM Rev A Boards -------------------------------------------------------- There are 18 Gerber files: File Pos/Neg Name File Contents Data --------- ------------------------ ------- artwork_1 Board Outline Test Plot POS artwork_2 Component Side Traces 1 POS artwork_3 Internal Traces 2 POS artwork_4 VTT Plane NEG artwork_5 Internal Traces 4 POS artwork_6 Internal Traces 5 POS artwork_7 GND Plane A NEG artwork_8 VDD Plane NEG artwork_9 VCC Plane NEG artwork_10 GND Plane B NEG artwork_11 Internal Traces 10 POS artwork_12 Internal Traces 11 POS artwork_13 VEE Plane NEG artwork_14 Internal Traces 13 POS artwork_15 Solder Side Traces 14 POS artwork_16 Component Side Silkscreen POS artwork_17 Component Side Solder Mask NEG artwork_18 Solder Side Solder Mask NEG The following tables summarize the correspondence between the Gerber Draft Codes used and the apertures expected. ------------------------------- --- GOOD for Production --- ------------------------------- The following is the Aperture Table for all artwork files EXCEPT: Component Side Solder Mask (artwork_17) and Solder Side Solder Mask (artwork_18). It is on the Multek ftp server as ap_table_1_16. D Code Shape Type Width(X) Height(Y)/Diameter ------ ----- ---- -------- ------------------ 10 circle trace 0.01000 11 circle trace 0.00700 12 circle trace 0.02500 13 circle trace 0.01200 14 circle flash 0.03300 15 circle flash 0.06000 16 oval flash 0.03500 0.04500 17 rectangle flash 0.06300 0.06300 18 rectangle flash 0.11000 0.10600 19 rectangle flash 0.10600 0.11000 70 rectangle flash 0.08500 0.11000 71 rectangle flash 0.05120 0.00985 20 rectangle flash 0.03200 0.04300 21 rectangle flash 0.02500 0.08000 22 rectangle flash 0.08000 0.02500 23 rectangle flash 0.00985 0.05120 24 rectangle flash 0.01400 0.08400 25 rectangle flash 0.04300 0.03200 26 rectangle flash 0.12600 0.07000 27 rectangle flash 0.11000 0.08500 28 circle flash 0.05700 29 circle thermal flash 0.05700 72 circle flash 0.08400 73 oval flash 0.04500 0.06000 125 oval thermal flash 0.04500 0.06000 126 circle thermal flash 0.08400 127 circle flash 0.15000 128 circle trace 0.20000 130 circle trace 0.02000 131 rectangle flash 0.27500 0.52500 132 circle trace 0.01500 133 circle flash 0.03935 137 rectangle flash 0.27500 0.37500 Thermal relief D29 Tie is 0.012 Air Gap is 0.012 Thermal relief D125 Tie is 0.012 Air Gap is 0.005 Thermal relief D126 Tie is 0.012 Air Gap is 0.012 Note: thermal reliefs are specified as follows: tie \ ----- \ X ^ \ XX XX | | X X | air gap -> X X height X X | | XX XX v X ----- | | |<- width ->| The "inner pad" width (height) = width (height) - 2 * air gap. The ties are to be at 45, 135, 225, and 315 degrees. ------------------------------- --- GOOD for Production --- ------------------------------- The following is the Aperture Table for: Component Side Solder Mask (artwork_17) and Solder Side Solder Mask (artwork_18). It is on the Multek ftp server as ap_table_17_18. D code Shape Type Width(X) Height(Y)/Diameter ------ ----- ---- -------- ------------------ 10 circle trace 0.01000 15 circle flash 0.06500 16 oval flash 0.04000 0.05000 17 rectangle flash 0.06800 0.06800 18 rectangle flash 0.11500 0.11100 19 rectangle flash 0.11100 0.11500 70 rectangle flash 0.09000 0.11500 71 rectangle flash 0.05620 0.01485 20 rectangle flash 0.03700 0.04800 21 rectangle flash 0.03000 0.08500 22 rectangle flash 0.08500 0.03000 23 rectangle flash 0.01485 0.05620 24 rectangle flash 0.01900 0.08900 25 rectangle flash 0.04800 0.03700 26 rectangle flash 0.13100 0.07500 27 rectangle flash 0.11500 0.09000 135 circle flash 0.19685 136 circle flash 0.11810 137 rectangle flash 0.28000 0.38000 ------------------------------- --- GOOD for Production --- ------------------------------- The following is the drill table for both plated and unplated holes. It is on the Multek ftp server as drill_table. T code Finished Size Type Count ------ ------------- ---- ----- 1 0.013 plated 6633 2 0.022 plated 60 3 0.038 plated 845 4 0.106 unplated 23 6 0.090 unplated 2 7 0.113 unplated 2 The tolerance on these holes is +/- 0.003" -------------------------------------------------- ALL HOLE DIAMETERS ARE GIVEN AS THE FINISHED SIZE. -------------------------------------------------- ------------------------------- --- GOOD for Production --- ------------------------------- Data for Assembly of the TDM Rev. A Printed Circuit Boards --------------------------------------------------------------- Circuit board name: Trigger Decision Module (TDM) Rev. A Quantity: Fifteen (15) Boards Circuit Board Material: FR4 Overall Circuit Board Thickness: 0.100". This card is to be built with the same structure as our FM Rev. A.2 from August 1996, PO 17072-NLV. See note from Mark Gerrie at end of this file. The left and right edges must be milled to 70 mills thickness by removing material from the SOLDER side of the card. Material is to be removed in a strip 80 mills wide running the whole way from the top to the bottom of the card. This is to allow this card to fit in standard card guides. See dim_draw_2.eps. Copper thickness: 1 oz copper to be used on all 14 layers Overall Circuit Board Size: 15.748" x 14.437" rectangular board. The board outline, as indicated by the center of the line drawn in the Test Plot, indicates the real finished board size. See also dim_draw_1.eps Layers: 14: 2 external signal layers, 6 internal signal layers, and 6 internal power/ground planes Surface treatment: Entek 56 OSP is to be used. Solder Mask: BOTH SIDES (different on component and solder sides) Use a Liquid Photo Imagable solder mask. Silk Screen: On the component side only. Holes: There are 6 different hole sizes. ------------------------------- --- GOOD for Production --- ------------------------------- ASSEMBLY OF THE BOARD Order of the Layers: --------------------------------------------- Component Side Silk Screen artwork_16 Component Side Solder Mask artwork_17 Layer 1: Component Side Traces 1 artwork_2 Layer 2: Internal Traces 2 artwork_3 Layer 3: VTT Plane artwork_4 Layer 4: Internal Traces 4 artwork_5 Layer 5: Internal Traces 5 artwork_6 Layer 6: GND Plane A artwork_7 Layer 7: VDD Plane artwork_8 Layer 8: VCC Plane artwork_9 Layer 9: GND Plane B artwork_10 Layer 10: Internal Traces 10 artwork_11 Layer 11: Internal Traces 11 artwork_12 Layer 12: VEE Plane artwork_13 Layer 13: Internal Traces 13 artwork_14 Layer 14: Solder Side Traces 14 artwork_15 Solder Side Solder Mask artwork_18 ------------------------------- --- GOOD for Production --- ------------------------------- BILLING AND SHIPPING INFORMATION ---------------------------------- The photoplots and finished cards should be SHIPPED to: Physics Electronics Shop 211 Physics/Astronomy Building Michigan State University East Lansing, MI 48824-1116 attn: Steve Gross This order should be BILLED to: Accounts Payable 366 Administration Building Michigan State University East Lansing, MI 48824 This is Michigan State University Purchase Order Number: 66145 Date: Wed, 21 Aug 96 19:52:26 PST From: "MARK GERRIE" Message-Id: <9607218406.AA840682466@SMTPGWY.MULTEK.COM> To: edmunds@pa.msu.edu Cc: tbresnan@SMTPGWY.MULTEK.COM Subject: Foundation Module Board In consideration of your request to be informed of the dielectrics used in the mentioned board, please accept the following as the finalized dielectrics. The overall thickness including copper foil will end up at .097 with a resulting .100 thickness for the final board. Regards, Mark Gerrie Engineer LAYER 1 _______________ .007 LAYER 2 _______________ [ .006 ] LAYER 3 [_______________] .006 LAYER 4 _______________ [ .006 ] LAYER 5 [_______________] .006 LAYER 6 _______________ [ .006 ] LAYER 7 [_______________] .006 LAYER 8 _______________ [ .006 ] LAYER 9 [_______________] .006 LAYER 10 _______________ [ .006 ] LAYER 11 [_______________] .006 LAYER 12 _______________ [ .006 ] LAYER 13 [_______________] .007 LAYER 14 _______________