DATE: 24-SEP-1996 TO: Sovereign Circuits 12808 DeBartolo Drive North Jackson, OH 44451 Phone: (216) 538-3900 FAX: (216) 538-3820 or (216) 538-2434 attn: Ron Bull FROM: Dan Edmunds and Steve Gross Physics Department Michigan State University East Lansing, MI 48824-1116 Phone: (517) 355-8525 Edmunds@pa.msu.edu FAX: (517) 355-6661 RE: Manufacture the quantity 20 of Printed Circuit Boards (TOM Rev A) Michigan State University Purchase Order Number 20621-BJF ------------------------------- --- GOOD for Production --- ------------------------------- Timing Origination Module PCB Rev A (TOM Rev A) ---------------------------------------------------- These instructions are for the manufacture of the quantity of 20 of a printed circuit board referred to as the Timing Origination Module (TOM) printed circuit board. The TOM printed circuit board has 12 layers. 7 of the layers are trace layers and 5 of the layers are internal power and ground plane layers. This circuit board uses both through hole and single sided surface mount components. This board uses 1 oz copper on all layers. The board has 4 different hole sizes. the size of each type of hole is specified below. A mechanical drawing with appropriate dimensions is provided in this package. This board has a solder mask on both sides (different solder mask on the Component and Solder sides) and it has a silkscreen on the component side only. The minimum trace width on these boards is 10 mills, the minimum clearance between traces is 15 mills, and the minimum trace to pad clearance is 15 mills. The artwork data is provided in 16 Gerber data files on the enclosed 3.5" IBM-PC format diskette. Two different aperture tables are required for this board, both are described below and included on the enclosed diskette. The drill information is provided in an Excellon format data file on the enclosed diskette. ------------------------------- --- GOOD for Production --- ------------------------------- We would like the following delivery schedule: Deliver copies of the photoplots of each Gerber file for our approval within one week after receipt of the design data. Do not start the actual manufacturing of the printed circuit boards until you receive our approval of the photoplot copies. Deliver 20 printed circuit boards to us within 4 weeks of our approving the photoplots. The assembly description of the TOM Rev. A circuit card follows. ------------------------------- --- GOOD for Production --- ------------------------------- Data for the Manufacture of the 20 TOM Rev A Boards ------------------------------------------------------ There are 16 Gerber files: PCB File Name Layer Description Data Type --------- ----- ----------- --------- ART_01.GRB Board Outline Test Plot POSITIVE ART_02.GRB 1 Component Side Traces POSITIVE ART_03.GRB 2 VEE Plane NEGATIVE ART_04.GRB 3 Internal Traces POSITIVE ART_05.GRB 4 Ground Plane NEGATIVE ART_06.GRB 5 Internal Traces POSITIVE ART_07.GRB 6 VCC Plane NEGATIVE ART_08.GRB 7 Internal Traces POSITIVE ART_09.GRB 8 Ground Plane NEGATIVE ART_10.GRB 9 Internal Traces (ECL NINV) POSITIVE ART_11.GRB 10 Internal Traces (ECL INV) POSITIVE ART_12.GRB 11 VTT Plane NEGATIVE ART_13.GRB 12 Solder Side Traces POSITIVE ART_14.GRB Component Side Solder Mask NEGATIVE ART_15.GRB Solder Side Solder Mask NEGATIVE ART_16.GRB Component Side Silkscreen POSITIVE The following tables summarize the correspondence between the Gerber D-codes used and the apertures expected. ------------------------------- --- GOOD for Production --- ------------------------------- The following is the Aperture Table for all artwork files EXCEPT the Component Side Solder Mask (ART_14.GRB) and Solder Side Solder Mask (ART_15.GRB). It is stored on the enclosed diskette as NOT_1415.APT: Diameter or Thermal D Code Shape Type Height(Y) Width(X) Relief ------ --------- ----- ----------- -------- ------- 10 circle trace 0.010 no 11 circle trace 0.015 no 12 circle trace 0.025 no 13 circle trace 0.020 no 14 circle flash 0.033 no 15 circle flash 0.060 no 16 circle flash 0.074 no 17 circle flash 0.040 no 18 rectangle flash 0.063 0.063 no 19 rectangle flash 0.043 0.032 no 70 rectangle flash 0.025 0.080 no 71 rectangle flash 0.080 0.025 no 20 rectangle flash 0.106 0.110 no 21 rectangle flash 0.110 0.106 no 22 circle flash 0.057 no 23 circle flash 0.057 YES 24 circle flash 0.084 no 25 circle flash 0.084 YES 26 circle flash 0.098 no 27 circle flash 0.150 no 28 circle trace 0.100 no 29 circle trace 0.075 no 72 circle trace 0.050 no 73 circle trace 0.200 no 125 circle flash 0.098 YES 126 rectangle flash 1.0875 0.525 no 127 circle flash 0.200 no "D" Code 23 is a Thermal Relief Aperture This thermal relief consists of a 0.033" diameter inner pad surrounded by a 0.012" wide air gap around this pad. This makes the full outer diameter 0.057". The air gap is crossed by 4 copper ties. Each tie is 0.012" wide. The ties should run at a 45 degree angle to the X and Y axes. "D" Code 25 is a Thermal Relief Aperture This thermal relief consists of a 0.060" diameter inner pad surrounded by a 0.012" wide air gap around this pad. This makes the full outer diameter 0.084". The air gap is crossed by 4 copper ties. Each tie is 0.012" wide. The ties should run at a 45 degree angle to the X and Y axes. "D" Code 23 is a Thermal Relief Aperture This thermal relief consists of a 0.074" diameter inner pad surrounded by a 0.012" wide air gap around this pad. This makes the full outer diameter 0.098". The air gap is crossed by 4 copper ties. Each tie is 0.012" wide. The ties should run at a 45 degree angle to the X and Y axes. ------------------------------- --- GOOD for Production --- ------------------------------- The following is the Aperture Table for the Component Side Solder Mask (ART_14.GRB) and the Solder Side Solder Mask (ART_15.GRB) only. It is stored on the enclosed diskette as ONLY1415.APT: Diameter or Thermal D Code Shape Type Height(Y) Width(X) Relief ------ --------- ----- ----------- -------- ------- 10 circle trace 0.010 no 14 circle flash 0.038 no 15 circle flash 0.065 no 16 circle flash 0.079 no 18 rectangle flash 0.068 0.068 no 19 rectangle flash 0.048 0.037 no 70 rectangle flash 0.030 0.085 no 71 rectangle flash 0.085 0.030 no 20 rectangle flash 0.111 0.115 no 21 rectangle flash 0.115 0.111 no 127 circle flash 0.200 no ------------------------------- --- GOOD for Production --- ------------------------------- Description of the Hole Sizes Used on the TOM Rev A Card --------------------------------------------------------- The board uses 4 different hole sizes. These hole sizes are summarized in the following table: Finished Hole Size Function -------------- ------------------------------------------------------- 0.013" There are 650 of these 0.013" diameter holes in this board. The tolerance of these holes is +/- 0.003". These holes are for vias and ALL of them should be plated through. This hole is T-Code T1 in the Excellon drill file. 0.038" There are 1548 of these 0.038" diameter holes in this board. The tolerance of these holes is +/- 0.003". These holes are for "pin-through-hole" component pins and ALL of them should be plated through. This hole is T-Code T2 in the Excellon drill file. 0.050" There are 18 of these 0.050" diameter holes in this board. The tolerance of these holes is +/- 0.003". These holes are for "pin-through-hole" component pins and ALL of them should be plated through. This hole is T-Code T3 in the Excellon drill file. 0.106" There are 20 of these 0.106" diameter holes in this board. These holes are for the mechanical mounting of components and the front panel. These holes should NOT been plated through. This hole is T-Code T4 in the Excellon drill file. -------------------------------------------------- ALL HOLE DIAMETERS ARE GIVEN AS THE FINISHED SIZE. -------------------------------------------------- ------------------------------- --- GOOD for Production --- ------------------------------- Data for Assembly of the TOM Rev. A Printed Circuit Boards --------------------------------------------------------------- Circuit board name: Foundation Module (TOM) Rev A Quantity: Twenty (20) Boards Circuit Board Material: G10 (FR4) Overall Circuit Board Thickness: 0.080 to 0.110 mills. Please contact us to discuss the board thickness before production begins. The left and right edges must be milled to 0.070 inch thickness by removing material from the SOLDER side of the card. Material is to be removed in a strip 80 mills wide running the whole way from the top to the bottom of the card. This is to allow this card to fit in standard card guides. See the attached drawing. Copper thickness: 1 oz copper to be used on all 12 layers Overall Circuit Board Size: 15.748" x 14.437" rectangular board with one large section about 11" x 9" cut out. The board outline, as indicated by the center the line drawn in the Test Plot, indicates the real finished board size. The interior corners of the cut out section should be routed with a 1/4" diameter bit. Layers: 12: 2 external signal layers, 5 internal signal layers, and 5 internal power/ground planes Solder Plating: Only the area of copper NOT covered by the solder mask should be tin plated. (i.e. Solder Mask over Bare Copper). Solder Mask: BOTH SIDES (different on component and solder sides) Silk Screen: On the component side only. Holes: There are 4 different hole sizes. ------------------------------- --- GOOD for Production --- ------------------------------- ASSEMBLY OF THE BOARD Order of the Layers: --------------------------------------------- Component Side Silk Screen File ART_16.GRB Component Side Solder Mask File ART_14.GRB Layer 1: Component Side Traces, Signal 1 File ART_02.GRB Layer 2: VEE Plane File ART_03.GRB Layer 3: Layer 3 Internal Traces, Signal 2 File ART_04.GRB Layer 4: GND Plane File ART_05.GRB Layer 5: Layer 5 Internal Traces, Signal 3 File ART_06.GRB Layer 6: VCC Plane File ART_07.GRB Layer 7: Layer 7 Internal Traces, Signal 4 File ART_08.GRB Layer 8: GND Plane File ART_09.GRB Layer 9: Layer 9 Internal Traces, Signal 5 File ART_10.GRB Layer 10: Layer 10 Internal Traces, Signal 6 File ART_11.GRB Layer 11: VTT Plane File ART_12.GRB Layer 12: Solder Side Traces, Signal 7 File ART_13.GRB Solder Side Solder Mask File ART_15.GRB ------------------------------- --- GOOD for Production --- ------------------------------- BILLING AND SHIPPING INFORMATION ---------------------------------- The photoplots and finished cards should be SHIPPED to: Physics Electronics Shop 211 Physics/Astronomy Building Michigan State University East Lansing, MI 48824-1116 attn: Steve Gross/Dan Edmunds This order should be BILLED to: Accounts Payable 366 Administration Building Michigan State University East Lansing, MI 48824 This is Michigan State University Purchase Order Number: 20621-BJF