ADF-2 Trailer Sheets ---------------------- D-Zero Run 2B L1 Calorimeter Trigger Latest Entry: 30-June-2005 ADF-2 Card Species: Species A: EM 4.0 HD 2.0 SN#A1-A21 ADCO mark Red Species B: EM 5.5 HD 3.5 SN#B1-B21 ADCO mark Green Species C: EM 4.0 HD 4.0 SN#C1-C21 ADCO mark Yellow Species D: EM 5.5 HD 5.5 SN#D1-D37 ADCO mark Blue Shipments from ADCO: 04-Jan-2005 SN#C1-C10 11-Mar-2005 SN#A1-A20 18-Mar-2005 SN#C11-C21 SN#B1-B9 SN#D1-D26 01-Apr-2005 SN#A21 SN#B10-B21 SN#D27-D37 Card Locations: 08-Mar-2005 C3 Moved to Fermilab 22-Mar-2005 C5 Moved to Fermilab 18-May-2005 Cards for crates M104 and M109 taken to Fermilab. Crate M104: SN#A1-A16,B1-B4 Crate M109: SN#C14-C21,D1-D12 01-Jun-2005 Cards for crates M106 and M111 taked to Fermilab. Crate M106: SN#B5-B16,C6-C13 Crate M104: SN#D13-D32 Initials: JDB Jason Biel JAB Jorge A. Benitez DE Dan Edmunds PL Philippe Laurens MN Mike Nila =============================================================================== S/N: __ ADF-2 Gain Species: EM: ___ HD: ___ Date of the latest entry in this card's Trailer Sheet: __-___-2005 Mechanical Inspection: __-___-2005 by ___ Final Assembly: __-___-2005 by ___ Testing: Ohm Meter: __-___-2005 by ___ Initial Power Up: __-___-2005 by ___ Program Board Control PAL: __-___-2005 by ___ BC_PAL Firmware Version: __-___-2005 VME IO to PAL and FPGAs __-___-2005 by ___ Geographic Address Lines: __-___-2005 by ___ Random Register: __-___-2005 by ___ DAC/ADC Ratio: __-___-2005 by ___ Find DAC: __-___-2005 by ___ Frequency Response: __-___-2005 by ___ FFT Analysis __-___-____ by ___ Channel Link: __-___-2005 by ___ Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: Notes: =============================================================================== S/N: A1 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 11-Mar-2005 by JDB Final Assembly: 11-Mar-2005 by JDB Testing: Ohm Meter: 11-Mar-2005 by JDB Initial Power Up: 11-Mar-2005 by JDB Program Board Control PAL: 10-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 06-Apr-2005 by JDB Geographic Address Lines: 06-Apr-2005 by JDB Random Register: 06-Apr-2005 by JDB DAC/ADC Ratio: 06-Apr-2005 by JDB Find DAC: 06-Apr-2005 by JDB Frequency Response: 06-Apr-2005 by JDB FFT Analysis 12-May-2005 by JAB Channel Link: 17-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 10-Mar-2005 N621 was put on upside down (the side that should be against the circuit board is facing up) and rotated 90 degrees. This was unsoldered and put back on in the correct orientation. One pin on the resistor pack may have been damaged. This should be replaced when the spare parts are back in-house. 06-Apr-2005 Replace N621. Notes: 10-Mar-2005 Visual inspection: The front edge of the board has a jagged protrusion running down the center. I think this is from an extension that ADCO used to hold the board during the assembly process but was removed after assembly. The jagged edge has been removed beneath the LEDs. It may need to be removed for the bracket to fit properly. There was a large solder glob on the board near the P1 connector. It came off easily. There is some residue on the P1 side of the VCXO. It can be removed with tissue. The P3 connector does not look like it is seated. The pins closest to to P1 and P2 stick through the bottom of the board but the pins in the center of the connector do not stick through the bottom of the board. When looking at the face of the connector the bottom edge appears to be curved. This is more apparent when a straight edge is held up against it. There is about a 0.003" gap between the straight edge and the connector in the center. This is not enough to affect how the pins on the backplane will insert into the connector, but the connector does seem stressed. The circuit board is also bent. It is bent much more than the P3 connector, about a 0.0035" deviation from the center of the connector to edge. One of the screws in the P1 connector was very loose. The connector appears to be seated correctly on the circuit board though. The plastic braces at the two ends of the connector are flat against the circuit board. Electrical Tests: SN#59 passed steps 4-10 of the check in process. Step 11 failed (Find DAC) on TT_HD(3,0) initially but passed after N621 was fixed. TT_HD(3,1) still gave a warning that its value for a DAC output of 490 was 205, which is outside the predefined acceptable range of 50-200. Step 12 (Frequency Response) half passed. This card is species A and the tests are hard wired for species C now. Species A has the same gain for the EM channels and a different gain for the HD channels so only the EM channels were considered. A channel link test was started at 1:30AM. I confirmed that the test was running properly by writing over a seed in a register an FPGA on the ADF-2 and watching errors occur in one bit in the channel link software. The test was restarted after this. The test ran for 11 hours and was stopped with no erros. 10-Mar-2005 Returned to ADCO to repress P3. 11-Mar-2005 Rechecked back in after receiving back from ADCO. P3 is now inserted properly. SN#59 passes items 1-12 on checking checklist. Step 12 (FFT test) is run in 2 parts because the gain is different for the EM and HD channels. The gain was manually changed in the command file. Start channel link test and let run overnight. The test successfully ran for 11 hours and was stopped without errors. 15-Mar-2005 Changed serial number from 59 to A1. 23-Mar-2005 The card was tested again using the GUI v.3.2.B (channel link test was not included, this one passed on 17-Mar-2005) the results were satisfactory. A General observation that applies to all 'A' specie cards is that the HD channels have and RMS value lower than the EM channels, in average 243 counts compared to 253 for the EM channels, this characteristic made some of the HD channel to fail the RMS test of the FFTTOOL, but their values were not too far from the expected values, about 6% below the central threshold, the current accepted values for the RMS values are 5 % plus or minus the central threshold. 06-Apr-2005 Rerun DAC/ACD ratio, FIND DAC, Freqrency Response and FFT tests after changing N621. FFT fails stating that channels HD(0,0)(0,1)(0,2)(0,3) (1,0)(1,1)(1,2)(1,3)(2,0)(2,1)(2,2)(0,3)(3,0)(3,1)(3,2)(3,3) RMS values are outside of the acceptable range. The values are around 250 and the acceptable range is 120-132. The same errors were reported on 23-Mar. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A2 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 14-Mar-2005 by JDB Final Assembly: 14-Mar-2005 by JDB Testing: Ohm Meter: 14-Mar-2005 by JDB Initial Power Up: 14-Mar-2005 by JDB Program Board Control PAL: 15-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 23-Mar-2005 by JAB Geographic Address Lines: 23-Mar-2005 by JAB Random Register: 23-Mar-2005 by JAB DAC/ADC Ratio: 23-Mar-2005 by JAB Find DAC: 23-Mar-2005 by JAB Frequency Response: 23-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 23-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 30-Mar-2005 Glue the plastic housing on U1331 to the metal brace. 06-Apr-2005 Clean residue from around the VCXO with alcohol and a kimwipe. 13-Apr-2005 Add C1227 Notes: 14-Mar-2005 C1227 (100nF Cap) missing. Red dye underneath R22. Removed with alcohol and kimwipe. On U1331 (3.3V DC/DC convertor), the plastic housing is not connected to the mechanical support that holds one end to the circuit board. There is a metal clip that is soldered to the circuit board of the DC/DC convertor and that metal clip is glued to the black plastic housing of the inductor. This is the joint that has failed. The Housing of LED1371 is loose. The PLL_Monitor signal is not stable. It changes a lot over a short period of time (+-20mv in 10s). 23-Mar-2005 The card was tested again using the GUI v.3.2.B, the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 10-May-2005 Rechecked the PLL signal. It is stable; there is less then 10mv change over 10 min. and there is no change on the oder of 1 sec. 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A3 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 14-Mar-2005 by JDB Final Assembly: 14-Mar-2005 by JDB Testing: Ohm Meter: 14-Mar-2005 by JDB Initial Power Up: 14-Mar-2005 by JDB Program Board Control PAL: 15-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 23-Mar-2005 by JAB Geographic Address Lines: 23-Mar-2005 by JAB Random Register: 23-Mar-2005 by JAB DAC/ADC Ratio: 23-Mar-2005 by JAB Find DAC: 23-Mar-2005 by JAB Frequency Response: 23-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 23-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 15-Mar-2005 Removed solderball underneath C840 between its pads. 30-Mar-2005 Glue the plastic housing on U1331 to the metal brace. Notes: 15-Mar-2005 On U1331 (3.3V DC/DC convertor), the plastic housing is not connected to the mechanical support that holds one end to the circuit board. There is a metal clip that is soldered to the circuit board of the DC/DC convertor and that metal clip is glued to the black plastic housing of the inductor. This is the joint that has failed. P3 metal casing bent near P2. Solder ball under C840. Removed. The Housing of LED1371 is loose. The swipes for pins Z17 and Z18 on the P1 connector have a dull gold finish. The swipes for pin Z18 and Z20 on the P2 connector have a dull gold finish. I suspect these had solder on them from assembling P1 and P2 and were reworked. 23-Mar-2005 The card was tested again using the GUI v.3.2.B the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 10-May-2005 Rechecked the PLL signal. It is stable; there is less then 10mv change over 10 min. and there is no change on the oder of 1 sec. 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A4 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 14-Mar-2005 by JDB Final Assembly: 14-Mar-2005 by JDB Testing: Ohm Meter: 14-Mar-2005 by JDB Initial Power Up: 14-Mar-2005 by JDB Program Board Control PAL: 15-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 23-Mar-2005 by JAB Geographic Address Lines: 23-Mar-2005 by JAB Random Register: 23-Mar-2005 by JAB DAC/ADC Ratio: 23-Mar-2005 by JAB Find DAC: 23-Mar-2005 by JAB Frequency Response: 23-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 23-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: Notes: 15-Mar-2005 The swipes for pins Z11,Z12,Z14,Z17,Z18,z19,Z20 on the P1 connector have a dull gold finish. I suspect these had solder on them from assembling P1 and P2 and were reworked. 23-Mar-2005 The card was tested again using the GUI v.3.2.B, the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A5 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 14-Mar-2005 by JDB Final Assembly: 14-Mar-2005 by JDB Testing: Ohm Meter: 14-Mar-2005 by JDB Initial Power Up: 14-Mar-2005 by JDB Program Board Control PAL: 18-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 23-Mar-2005 by JAB Geographic Address Lines: 23-Mar-2005 by JAB Random Register: 23-Mar-2005 by JAB DAC/ADC Ratio: 23-Mar-2005 by JAB Find DAC: 23-Mar-2005 by JAB Frequency Response: 23-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 23-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 30-Mar-2005 Glue the plastic housing on U1331 to the metal brace. Notes: 15-Mar-2005 The swipes for pins Z4,Z5,Z6 on the P1 connector have a dull gold finish. I suspect these had solder on them from assembling P1 and P2 and were reworked. On U1331 (3.3V DC/DC convertor), the plastic housing is not connected to the mechanical support that holds one end to the circuit board. There is a metal clip that is soldered to the circuit board of the DC/DC convertor and that metal clip is glued to the black plastic housing of the inductor. This is the joint that has failed. 16-Mar-2005 VME I0 to PAL and FPGAs test failed. The card had been taken for further inspection. 18-Mar-2005 PAL programmed could not be verified. 3.3V load was 2A , the same before the PAL is programmed. Reprogrammed the PAL and VME IO to PAL and FPGAs now work. 23-Mar-2005 The card was tested again using the GUI v.3.2.B, the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A6 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 16-Mar-2005 by JDB Final Assembly: 16-Mar-2005 by JDB Testing: Ohm Meter: 16-Mar-2005 by JDB Initial Power Up: 16-Mar-2005 by JDB Program Board Control PAL: 16-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 23-Mar-2005 by JAB Geographic Address Lines: 23-Mar-2005 by JAB Random Register: 23-Mar-2005 by JAB DAC/ADC Ratio: 23-Mar-2005 by JAB Find DAC: 23-Mar-2005 by JAB Frequency Response: 23-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 23-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 16-Mar-2005 Removed Solder balls under C1014, C1013, C1011, C1008, C1004, C1007, C1003, C1586, C1575, C1576, C1573, C1565, C1566, C1563, C160, C80, C123, C1213, C1218, C154, C59, C9, C229. 30-Mar-2005 Glue the plastic housing on U1331 to the metal brace. Notes: 16-Mar-2005 The PLL Monitor signal jumps around a lot. C1533 on very crooked. Solder balls under C1014, C1013, C1011, C1008, C1004, C1007, C1003, C1586, C1575, C1576, C1573, C1565, C1566, C1563, C160, C80, C123, C1213, C1218, C154, C59, C9, C229. Removed. On U1331 (3.3V DC/DC convertor), the plastic housing is not connected to the mechanical support that holds one end to the circuit board. There is a metal clip that is soldered to the circuit board of the DC/DC convertor and that metal clip is glued to the black plastic housing of the inductor. This is the joint that has failed. The swipes for pins Z14-Z21 on the P1 connector have a dull gold finish. I suspect these had solder on them from assembling P1 and P2 and were reworked. 16-Mar-2005 The random register test failed at first, the error showing up in the screen was VME IO's timeout errors. The test was ran again from Step0 and this time the test was successful. 23-Mar-2005 The card was tested again using the GUI v.3.2.B, the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A7 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 16-Mar-2005 by DE Final Assembly: 16-Mar-2005 by DE Testing: Ohm Meter: 16-Mar-2005 by JDB Initial Power Up: 16-Mar-2005 by JDB Program Board Control PAL: 16-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 23-Mar-2005 by JAB Geographic Address Lines: 23-Mar-2005 by JAB Random Register: 23-Mar-2005 by JAB DAC/ADC Ratio: 23-Mar-2005 by JAB Find DAC: 23-Mar-2005 by JAB Frequency Response: 23-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 16-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: Notes: 23-Mar-2005 The card was tested again using the GUI v.3.2.B, (channel link test was not included, this one passed on 16-Mar-2005) the results were satisfactory. 30-Mar-2005 Pin Z27 on P2 has a solder spot on it. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A8 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 16-Mar-2005 by DE Final Assembly: 16-Mar-2005 by DE Testing: Ohm Meter: 16-Mar-2005 by JDB Initial Power Up: 16-Mar-2005 by JDB Program Board Control PAL: 16-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 23-Mar-2005 by JAB Geographic Address Lines: 23-Mar-2005 by JAB Random Register: 23-Mar-2005 by JAB DAC/ADC Ratio: 23-Mar-2005 by JAB Find DAC: 23-Mar-2005 by JAB Frequency Response: 23-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 16-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 16-Mar-2005 Remove solder globs near channel link bypass capacitors. Clean flux stain around channel link chips. Remove solder globs under bypass capacitors near channel link chips and F1. Notes: 16-Mar-2005 Side 2 solder globs near channel link bypass caps Side 1 flux around channel link chips. Large flux stains around channel link chips. Side 2 some solder globs under bypass capacitors near channel link chips and F1. The swipes for pins Z25-Z32 on the P1 connector have a dull gold finish. I suspect these had solder on them from assembling P1 and P2 and were reworked. 23-Mar-2005 The card was tested again using the GUI v.3.2.B, (channel link test was not included, this one passed on 16-Mar-2005) the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A9 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 16-Mar-2005 by DE Final Assembly: 16-Mar-2005 by DE Testing: Ohm Meter: 16-Mar-2005 by JDB Initial Power Up: 16-Mar-2005 by JDB Program Board Control PAL: 16-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 23-Mar-2005 by JAB Geographic Address Lines: 23-Mar-2005 by JAB Random Register: 23-Mar-2005 by JAB DAC/ADC Ratio: 23-Mar-2005 by JAB Find DAC: 23-Mar-2005 by JAB Frequency Response: 23-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 16-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 16-Mar-2005 Removed solder globs under bypass capacitors by channel link chips. Remove flux stain on U1011. 06-Apr-2005 Clean residue from around the VCXO with alcohol and a kimwipe. Notes: 16-Mar-2005 Side 2 solder globs under bypass caps by channel link chips. Side 1 flux stain on U1011. PLL Monitor signal jumps around. 23-Mar-2005 The card was tested again using the GUI v.3.2.B, (channel link test was not included, this one passed on 16-Mar-2005) the results were satisfactory. The PLL is stable. It changes <10mV in 10min. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 10-May-2005 Rechecked the PLL signal. It is stable; there is less then 10mv change over 10 min. and there is no change on the oder of 1 sec. 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A10 Maestro ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 16-Mar-2005 by DE Final Assembly: 16-Mar-2005 by DE Testing: Ohm Meter: 16-Mar-2005 by JDB Initial Power Up: 16-Mar-2005 by JDB Program Board Control PAL: 16-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 23-Mar-2005 by JAB Geographic Address Lines: 23-Mar-2005 by JAB Random Register: 23-Mar-2005 by JAB DAC/ADC Ratio: 23-Mar-2005 by JAB Find DAC: 23-Mar-2005 by JAB Frequency Response: 23-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 17-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 16-Mar-2005 Removed solder glob on P1 pin Z21. Notes: 16-Mar-2005 There had been a solder glob on P1 pin Z21. Connector P3 edge broken as it was dragged over the pcb edge. 23-Mar-2005 The card was tested again using the GUI v.3.2.B, (channel link test was not included, this one passed on 17-Mar-2005) the results were satisfactory. 30-Mar-2005 There are permanent marker hash marks on the PCB under P1. 05-Apr-2005 Add jumpers W1021-W1027 to change SN#A10 into a Maestro ADF-2 card. Confirm that PLL tracks with SCLD input into SN#A10. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A11 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 16-Mar-2005 by DE Final Assembly: 16-Mar-2005 by DE Testing: Ohm Meter: 16-Mar-2005 by JDB Initial Power Up: 16-Mar-2005 by JDB Program Board Control PAL: 16-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JAB Random Register: 24-Mar-2005 by JAB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 17-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: Notes: 16-Mar-2005 Side 2 latten scratches under P3. 24-Mar-2005 The card was tested again using the GUI v.3.2.B, (channel link test was not included, this one passed on 17-Mar-2005) the results were satisfactory. 08-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A12 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 16-Mar-2005 by JDB Final Assembly: 16-Mar-2005 by JDB Testing: Ohm Meter: 16-Mar-2005 by JDB Initial Power Up: 16-Mar-2005 by JDB Program Board Control PAL: 16-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JAB Random Register: 24-Mar-2005 by JAB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 17-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 16-Mar-2005 Removed Solder balls under C774, C254, C504, C204, C223, C674, C643, C693, C778, C491, C375, C125, C155, C105, C393, C575, C793, C791, C741, C725, C691, C675, C655, C625, C641, C695. 06-Apr-2005 Add C1227. Notes: 16-Mar-2005 Solder balls under C774, C254, C504, C204, C223, C674, C643, C693, C778, C491, C375, C125, C155, C105, C393, C575, C793, C791, C741, C725, C691, C675, C655, C625, C641, C695. Removed. One of the screws for the P1 connector was extremely loose (rattling). C1227 is missing. 24-Mar-2005 The card was tested again using the GUI v.3.2.B,(channel link test was not included, this one passed on 17-Mar-2005) the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A13 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 17-Mar-2005 by JDB Final Assembly: 17-Mar-2005 by JDB Testing: Ohm Meter: 17-Mar-2005 by JDB Initial Power Up: 17-Mar-2005 by JDB Program Board Control PAL: 17-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JAB Random Register: 24-Mar-2005 by JAB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 17-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 17-Mar-2005 Removed Solder balls under C1012,C1011,C1012,C1612,C1563,C1564 C1575,C1576,C1573,C1582,C1577,C1562,C1567,C1403,C1406,C1601,C940 C143,C742,C442,C445,C1216,C1215. Remove solder glob on C1227 lead. Remove solder glob on board near P2 connector on back side. Clean white residue on bottom side near P1 connector. Remove solder flakes near P3 connector on back side. Notes: 17-Mar-2005 Solder balls under C1012,C1011,C1012,C1612,C1563,C1564 C1575,C1576,C1573,C1582,C1577,C1562,C1567,C1403,C1406,C1601,C940 C143,C742,C442,C445,C1216,C1215. Removed. C1227 has a glob of solder onto of one of its leads. Removed. There is corrosion on the P3 metal casing. There are solder whisps/flakes near the P3 connector on the back side. Removed. There is white residue near the edge of the card one the back side of the board by the P1 connector. 24-Mar-2005 The card was tested again using the GUI v.3.2.B, (channel link test was not included, this one passed on 17-Mar-2005) the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A14 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 17-Mar-2005 by JDB + DE Final Assembly: 17-Mar-2005 by DE Testing: Ohm Meter: 17-Mar-2005 by JDB Initial Power Up: 17-Mar-2005 by JDB Program Board Control PAL: 17-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JAB Random Register: 24-Mar-2005 by JAB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 18-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 17-Mar-2005 Cleared the opening in the plastic for P3 pin B19. 30-Mar-2005 Glue the plastic housing on U1331 to the metal brace. Notes: 17-Mar-2005 On U1331 (3.3V DC/DC convertor), the plastic housing is not connected to the mechanical support that holds one end to the circuit board. There is a metal clip that is soldered to the circuit board of the DC/DC convertor and that metal clip is glued to the black plastic housing of the inductor. This is the joint that has failed. P3 connector damaged next to P2. Repaired Board scratched between P2 and P3 on bottom. P3 metal casing bent on top. 24-Mar-2005 The card was tested again using the GUI v.3.2.B, (channel link test was not included, this one passed on 18-Mar-2005) the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A15 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 17-Mar-2005 by JDB Final Assembly: 17-Mar-2005 by JDB Testing: Ohm Meter: 17-Mar-2005 by JDB Initial Power Up: 17-Mar-2005 by JDB Program Board Control PAL: 17-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JAB Random Register: 24-Mar-2005 by JAB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 18-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 17-Mar-2005 Cleaned white residue off board on back side around P2 connector. Removed Solder balls under C441,C175,C1013,C1053,C1575,C1572,C281, C1567,C1577,C911,C915,C811,C810,C838,C819,C841,C816,C814,C840,C1209, C1259,C60,C110,C208,C260,C258,C346,C329,C380,C851,C530,C529,C507, C428,C603,C610,C609,C604,C629,C624,C658,C659,C633,C639,C674,C710, C723,C731,C753,C760,C756,C796,C945,C1071,C1251,C1577,C1571,C938, C913,C941,C1021,C946,C846,C1601,C815,C1573,C10,C24,C579,C323,C309, C274,C259,C229,C230,C203,C403,C404,C454,C474,C559,C773,C724,C729,C704, C703,C673,C696,C653,C646. On C579,C229 and C474 flux and a solder iron were needed to completely remove the excess solder. Notes: 17-Mar-2005 Solder mask scratched away between P1 and P3 on back side near edge. White residue by P2 on Backside. Many solder balls on capacitors. See repairs comments above. 24-Mar-2005 The card was tested again using the GUI v.3.2.B, (channel link test was not included, this one passed on 18-Mar-2005) the results were satisfactory. 30-Mar-2005 P1 pin Z22 is discolored. It looks like not all of the pin was gold plated. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A16 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 17-Mar-2005 by JDB Final Assembly: 17-Mar-2005 by JDB Testing: Ohm Meter: 17-Mar-2005 by JDB Initial Power Up: 17-Mar-2005 by JDB Program Board Control PAL: 17-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JAB Random Register: 24-Mar-2005 by JAB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 17-Mar-2005 by JDB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 17-Mar-2005 Cleaned white residue off board on back side around P2 connector. Clean residue from around C1331,C1332,U1331,C1623,C1624 and R1351. The solder joints looked ok after cleaning. Removed Solder balls under C344,C812,C641,C625,C705,C755,C791,C793, C525 C592,C695,C42,C541,C543,C493,C241,C293,C343,C355,C155,C1454, C1455, C104,C41,C1251,C391,C393,C375,C205,C443,C425,C491,C505,C525, C555, C593,C591,C575,C725,C705,C643,C345,C642,C694,C792,C795,C1576, C1573, C909,C758,C660,C1210,C361,C760,C603. On C361 flux and a solder iron were needed to completely remove the excess solder. 30-Mar-2005 Glue the plastic housing on U1331 to the metal brace. 10-May-2005 Removed solder glob on C1227. Notes: 17-Mar-2005 On U1331 (3.3V DC/DC convertor), the plastic housing is not connected to the mechanical support that holds one end to the circuit board. There is a metal clip that is soldered to the circuit board of the DC/DC convertor and that metal clip is glued to the black plastic housing of the inductor. This is the joint that has failed. There is corrosion on the metal cover on P3. C1521 was put on crooked. There is a solder extension on a lead of C1227. White residue by P2 on Backside. There is residue on the board around C1331,C1332,U1331,C1623,C1624 and R1351. The solder joints of some of these components look dull white before cleaning but ok afterwards. Many solder balls on capacitors. See repairs comments above. 24-Mar-2005 The card was tested again using the GUI v.3.2.B,(channel link test was not included, this one passed on 17-Mar-2005) the results were satisfactory. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A17 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 17-Mar-2005 by JDB Final Assembly: 17-Mar-2005 by JDB Testing: Ohm Meter: 17-Mar-2005 by JDB Initial Power Up: 17-Mar-2005 by JDB Program Board Control PAL: 17-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JDB Random Register: 24-Mar-2005 by JDB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 17-Mar-2005 by JDB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 17-Mar-2005 Removed Solder balls under C1061,C455,C642,C1582,C1577,C1578,C1571, C1586,C1576,C1573,C1014,C1013,C1003,C427,C174,C1581,C1568,C1575,C1576 C1565,C1206,C1205,C1207. 30-Mar-2005 Glue the plastic housing on U1331 to the metal brace. Notes: 17-Mar-2005 On U1331 (3.3V DC/DC convertor), the plastic housing is not connected to the mechanical support that holds one end to the circuit board. There is a metal clip that is soldered to the circuit board of the DC/DC convertor and that metal clip is glued to the black plastic housing of the inductor. This is the joint that has failed. There is corrosion on the metal cover on P3. Many solder balls on capacitors. See repairs comments above. 24-Mar-2005 The card was tested again using the GUI v.3.2.B,(channel link test was not included, this one passed on 17-Mar-2005) the results were satisfactory. 12-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A18 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 17-Mar-2005 by JDB Final Assembly: 17-Mar-2005 by JDB Testing: Ohm Meter: 18-Mar-2005 by JDB Initial Power Up: 18-Mar-2005 by JDB Program Board Control PAL: 18-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JAB Random Register: 24-Mar-2005 by JAB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 18-Mar-2005 by JDB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 18-Mar-2005 Cleaned white residue off board on back side around P1+P2 connectors. Scratch in board under P3. Removed Solder balls under C625,C1223,C825,C847,C947,C1572,C1042,C123, C24,C28,C203,C208,C204,C228,C254,C274,C308,C304,C330,C324,C504,C511, C503,C473,C454,C460,C424,C627,C628,C656,C659,C681,C704,C731,C756, C1205, C1252,1211,C1227,C1071,C839,C829,C1583,C1573,C1574,C1012,C1011, C1004, C1103,C1101,C918,C38,C940,C932,C912,C916,C811,C915,C913,C843, C814,C841, C1218,C1220,C657,C659,C674,C709,C727,C378,C323,C204,C223, C246,C203,C403, C411,C424,C478,C511,C560,C580,C610,C624,C653,C660, C673,C678,C703,C711, C704,C760,C761,C780,C781,C774. Notes: 18-Mar-2005 There is corrosion on the metal cover on P3. White residue by P1+P2 on Backside. Many solder balls on capacitors. See repairs comments above. 24-Mar-2005 The card was tested again using the GUI v.3.2.B,(channel link test was not included, this one passed on 18-Mar-2005) the results were satisfactory. 12-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A19 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 18-Mar-2005 by JDB Final Assembly: 18-Mar-2005 by JDB Testing: Ohm Meter: 18-Mar-2005 by JDB Initial Power Up: 18-Mar-2005 by JDB Program Board Control PAL: 18-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JAB Random Register: 24-Mar-2005 by JAB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 18-Mar-2005 by JDB + JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 18-Mar-2005 Clean glob of black/grey junk next to F1302. Removed Solder balls under C155,C91,C41,C275,C341,C393,C641,C691,C705, C743,C812,C755,C555,C355,C305,C592,C1002,C795,C1259,C1219,C1218,C1208, C1054,C1022,C1006,C1031,C1574,C1576,C1575,C1584,C1581,C1578,C1561, C1567,C1401,C1411,C1101,C946,C918,C847,C813,C911,C931,C641,C9,C30,C53, C59,C61,C159,C180,C178,C196,C359,C223,C209,C595,C759,C728,C731,C723, C729,C710,C711,C628,C629,C604,C609,C610,C603,C1003,C1004,C1011,C1013, C1014,C1005,C1574,C1570,C1577,C1572,C818,C823,C824,C910,C909,C923, C153,C123,C103,C110,C23,C253,C273,C360,C553,C454,C578,C473,C404,C611 C608,C604,C623,C621,C673,C674,C704,C730,C724,C753,C760,C761,C758,C774, C922,C1627,C1202,C1412,C1051,C1052. Notes: 18-Mar-2005 White residue by P1+P2 on Backside. There is a glob of solder on P2 pin Z30 (CHECK POSITION). There is a scratch in the board between P2 and P3 on the back side and there is another scratch on the back side that goes under the pads of P3. Many solder balls on capacitors. See repairs comments above. 24-Mar-2005 The card was tested again using the GUI v.3.2.B ,(channel link test was not included, this one passed on 18-Mar-2005) the results were satisfactory. 12-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A20 ADF-2 Gain Species: EM: 4.0 HD: 2.0 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 18-Mar-2005 by JDB Final Assembly: 18-Mar-2005 by JDB Testing: Ohm Meter: 18-Mar-2005 by JDB Initial Power Up: 18-Mar-2005 by JDB Program Board Control PAL: 18-Mar-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 24-Mar-2005 by JAB Geographic Address Lines: 24-Mar-2005 by JAB Random Register: 24-Mar-2005 by JAB DAC/ADC Ratio: 24-Mar-2005 by JAB Find DAC: 24-Mar-2005 by JAB Frequency Response: 24-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 18-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 18-Mar-2005 Removed Solder balls under C1061,C275,C341,C705,C743,C725,C755,C775 C41,C355,C493,C455,C791,C741,C693,C641,C45,C795,C692,C742,C744,C1223, C1219,C1012,C1563,C1562,C1581,C915,C913,C229,C409,C430,C460,C503,C353, C559,C1228,C1218,C1209,C1004,C1002,C1021,C1573,C1574,C1576,C1564,C912 C918,C924,C60,C330,C327,C259,C280,C411,C429,C424,C453,C529,C773,C1211, C1104,C1212. 30-Mar-2005 Glue the plastic housing on U1321 to the metal brace. Notes: 18-Mar-2005 On U1321 (1.5V DC/DC convertor), the plastic housing is not connected to the mechanical support that holds one end to the circuit board. There is a metal clip that is soldered to the circuit board of the DC/DC convertor and that metal clip is glued to the black plastic housing of the inductor. This is the joint that has failed. There is white residue on the back side by P1 and P2. Many solder balls on capacitors. See repairs comments above. 24-Mar-2005 The card was tested again using the GUI v.3.2.B ,(channel link test was not included, this one passed on 18-Mar-2005) the results were satisfactory. 12-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: A21 Maestro ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 31-May-2005 Mechanical Inspection: 22-Apr-2005 by JDB Final Assembly: 22-Apr-2005 by JAB Testing: Ohm Meter: 22-Apr-2005 by JAB Initial Power Up: 22-Apr-2005 by JDB Program Board Control PAL: 22-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 22-Apr-2005 by JDB Geographic Address Lines: 22-Apr-2005 by JAB Random Register: 22-Apr-2005 by JAB DAC/ADC Ratio: 22-Apr-2005 by JAB Find DAC: 22-Apr-2005 by JAB Frequency Response: 22-Apr-2005 by JAB FFT Analysis 22-Apr-2005 by JAB Channel Link: 22-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 22-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top in the analog section. Notes: 22-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is corrosion on the P3 shielding. I1410 casing is damaged. There is white residue under P1. The is discoloration (FLux?) on the solder joint of capacitors in the FPGA section,C1062 and I1410. The top of U801 is scratched. There is residue around R1351. A mounting hole under P4 is filled with solder. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 31-May-2005 Add jumpers W1021-W1027 to change SN#A21 into a Maestro ADF-2 card. Confirm that PLL tracks with SCLD input into SN#A21. =============================================================================== S/N: B1 ADF-2 Gain Species: EM: 5.5 HD: 3.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 29-Mar-2005 by JDB Final Assembly: 29-Mar-2005 by JDB Testing: Ohm Meter: 29-Mar-2005 by JDB Initial Power Up: 30-Mar-2005 by JDB Program Board Control PAL: 30-Mar-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 31-Mar-2005 by JAB Geographic Address Lines: 31-Mar-2005 by JAB Random Register: 31-Mar-2005 by JAB DAC/ADC Ratio: 31-Mar-2005 by JAB Find DAC: 31-Mar-2005 by JAB Frequency Response: 31-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 31-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 29-Mar-2005 Clean white residue off board under P2 connector Removed Solder balls under C937,C641,C555,C257,C141,C973,C743,C741, C575,C293,C91,C692,C72,C768,C769,C660,C603,C604,C1209,C1611,910,C939, C909,C930,C929,C128,C760,C708,C610,C1102 Notes: 29-Mar-2005 Mechanical Inspection Corrosion on P3 connector housing White residue under P2 connector. There were many solder balls under capacitors. See repair notes. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: B2 ADF-2 Gain Species: EM: 5.5 HD: 3.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 29-Mar-2005 by JDB Final Assembly: 29-Mar-2005 by JDB Testing: Ohm Meter: 29-Mar-2005 by JDB Initial Power Up: 30-Mar-2005 by JDB Program Board Control PAL: 30-Mar-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 31-Mar-2005 by JAB Geographic Address Lines: 31-Mar-2005 by JAB Random Register: 31-Mar-2005 by JAB DAC/ADC Ratio: 31-Mar-2005 by JAB Find DAC: 31-Mar-2005 by JAB Frequency Response: 31-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 31-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 29-Mar-2005 Removed Solder balls under C904,C906,C693,C725,C755,C793,C255,C341, C325, C643,C743,C593,C543,C493,C195,C792,C744,C692,C642,C1612,C1573, C1563,C1564, C374,C754,C274,C503,C1216 Notes: 29-Mar-2005 Mechanical Inspection Corrosion on P3 connector housing There were many solder balls under capacitors. See repair notes. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: B3 ADF-2 Gain Species: EM: 5.5 HD: 3.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 30-Mar-2005 by JDB Final Assembly: 30-Mar-2005 by JDB Testing: Ohm Meter: 30-Mar-2005 by JDB Initial Power Up: 30-Mar-2005 by JDB Program Board Control PAL: 30-Mar-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 31-Mar-2005 by JAB Geographic Address Lines: 31-Mar-2005 by JAB Random Register: 31-Mar-2005 by JAB DAC/ADC Ratio: 31-Mar-2005 by JAB Find DAC: 31-Mar-2005 by JAB Frequency Response: 31-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 31-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 30-Mar-2005 Cleaned residue from under P1 and P2 connectors. Removed Solder balls under C43,C193,C355,C193,C55,C91,C755,C793,C743, C693, C692,C742,C795,C938,C932,C74,C354,C424,C610,C630,C631,C624,C653, C673,C674, C703,C709,C724,C728,C760,C759,C754,C773,C756,C780,C1210, C1053,C815,C816, C832,C809,C813,C814,C910,C939,C909,C930,C935,C929, C130,C79,C229,C730,C707,C660,C628,603. Notes: 30-Mar-2005 Mechanical Inspection Corrosion on P3 connector housing Scratch on circuit board under P3 connector. Something shiny on top of the PAL. It looks like super glue. It does not easily come off so I am leaving it be. There is a white residue on the circuit board under the P1 and P2 connectors. There were many solder balls under capacitors. See repair notes. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: B4 ADF-2 Gain Species: EM: 5.5 HD: 3.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 30-Mar-2005 by JDB Final Assembly: 30-Mar-2005 by JDB Testing: Ohm Meter: 30-Mar-2005 by JDB Initial Power Up: 30-Mar-2005 by JDB Program Board Control PAL: 30-Mar-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 31-Mar-2005 by JAB Geographic Address Lines: 31-Mar-2005 by JAB Random Register: 31-Mar-2005 by JAB DAC/ADC Ratio: 31-Mar-2005 by JAB Find DAC: 31-Mar-2005 by JAB Frequency Response: 31-Mar-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 31-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 30-Mar-2005 Removed Solder balls under C93,C155,C375,C393,C325,C305,C291,C293, C255,C243,C505,C755,C741,C693,C655,C641,C793,C143,C43,C1214,C1579, C1573,1576,C624,C623,C646,C809,C760,C654,C659,C660,C604,C608,C611, C603. Cleaned white residue from under the P1 and P2 connectors. Notes: 30-Mar-2005 Mechanical Inspection There is white residue under the P1 and P2 connectors. There were many solder balls under capacitors. See repair notes. 8-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: B5 ADF-2 Gain Species: EM: 5.5 HD: 3.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 18-Apr-2005 by JDB Final Assembly: 18-Apr-2005 by JAB Testing: Ohm Meter: 18-Apr-2005 by JAB Initial Power Up: 18-Apr-2005 by JDB Program Board Control PAL: 18-Apr-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 18-Apr-2005 by JDB Geographic Address Lines: 18-Apr-2005 by JAB Random Register: 18-Apr-2005 by JAB DAC/ADC Ratio: 18-Apr-2005 by JAB Find DAC: 18-Apr-2005 by JAB Frequency Response: 18-Apr-2005 by JAB FFT Analysis 18-Apr-2005 by JAB Channel Link: 18-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 18-Apr-2005 Removed Solder balls. There was one on the top side in the analog section and there were many on the bottom side in the Channel Link, PAL, VCXO, VME Buffers/Latches, and analog sections. Removed solder ball on circuit board on the back side under U1331. Cleaned white residue from under the P1 and P2 connectors. Notes: 18-Apr-2005 Mechanical Inspection There is corrosion on the P3 shielding There is excess solder on C1205 and C1206. There were many solder balls under capacitors. See repair notes. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: B6 ADF-2 Gain Species: EM: 5.5 HD: 3.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 18-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 18-Apr-2005 by JAB Initial Power Up: 18-Apr-2005 by JDB Program Board Control PAL: 18-Apr-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 18-Apr-2005 by JDB Geographic Address Lines: 18-Apr-2005 by JAB Random Register: 18-Apr-2005 by JAB DAC/ADC Ratio: 18-Apr-2005 by JAB Find DAC: 18-Apr-2005 by JAB Frequency Response: 18-Apr-2005 by JAB FFT Analysis 18-Apr-2005 by JAB Channel Link: 18-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 18-Apr-2005 Removed Solder balls. On the top side, these were in the analog and FPGA section and there were many on the bottom side in the Channel Link, FPGA and analog sections. Clean wipe residue from under P1 and P2. Notes: 18-Apr-2005 Mechanical Inspection There is a scratch in the board between P2 and P3 on the back side. There were many solder balls under capacitors. See repair notes. 10-May-2005 Front panel removed and put on C16 so that C16 could be used in a system crate test. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B7 ADF-2 Gain Species: EM: 5.5 HD: 3.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 18-Apr-2005 by JDB Final Assembly: 18-Apr-2005 by JAB Testing: Ohm Meter: 18-Apr-2005 by JAB Initial Power Up: 18-Apr-2005 by JDB Program Board Control PAL: 18-Apr-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 18-Apr-2005 by JDB Geographic Address Lines: 18-Apr-2005 by JAB Random Register: 18-Apr-2005 by JAB DAC/ADC Ratio: 18-Apr-2005 by JAB Find DAC: 18-Apr-2005 by JAB Frequency Response: 18-Apr-2005 by JAB FFT Analysis 18-Apr-2005 by JAB Channel Link: 18-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 18-Apr-2005 Removed Solder balls. There were some in the analog section on the top side and in the Channel Link, DC/DC convertors, and analog sections on the back side. Clean white residue off board on back side near P2. Notes: 18-Apr-2005 Mechanical Inspection There is a scratch in the board between P2 and P3 on the back side. There were many solder balls under capacitors. See repair notes. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: B8 ADF-2 Gain Species: EM: 5.5 HD: 3.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 18-Apr-2005 by JDB Final Assembly: 18-Apr-2005 by JAB Testing: Ohm Meter: 18-Apr-2005 by JAB Initial Power Up: 18-Apr-2005 by JDB Program Board Control PAL: 18-Apr-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 18-Apr-2005 by JDB Geographic Address Lines: 18-Apr-2005 by JAB Random Register: 18-Apr-2005 by JAB DAC/ADC Ratio: 18-Apr-2005 by JAB Find DAC: 18-Apr-2005 by JAB Frequency Response: 18-Apr-2005 by JAB FFT Analysis 18-Apr-2005 by JAB Channel Link: 18-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 18-Apr-2005 Removed Solder balls. These were in the analog sections on both the top and bottom. Notes: 18-Apr-2005 Mechanical Inspection There is corrosion on the P3 shielding There is a scratch in the board on the back side between P2 and P3. There were many solder balls under capacitors. See repair notes. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: B9 ADF-2 Gain Species: EM: 5.5 HD: 3.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 18-Apr-2005 by JDB Final Assembly: 18-Apr-2005 by JAB Testing: Ohm Meter: 18-Apr-2005 by JAB Initial Power Up: 18-Apr-2005 by JDB Program Board Control PAL: 18-Apr-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 18-Apr-2005 by JDB Geographic Address Lines: 18-Apr-2005 by JAB Random Register: 18-Apr-2005 by JAB DAC/ADC Ratio: 18-Apr-2005 by JAB Find DAC: 18-Apr-2005 by JAB Frequency Response: 18-Apr-2005 by JAB FFT Analysis 18-Apr-2005 by JAB Channel Link: 18-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 18-Apr-2005 Removed Solder balls. These occur on the top side in the analog and FPGA sections. These occur on the back side in the analog, FPGA and DC/DC contertors sections. Glue U1331 inductor plastic case back onto metal clip. Notes: 18-Apr-2005 Mechanical Inspection There is corrosion and black marks on the P3 shielding. There is a scratch between P2 and P3 on the back side. There is dull residue on the back side in the channel link section. There is excess solder on C1205 and C1206. There were many solder balls under capacitors. See repair notes. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: B10 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 22-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 22-Apr-2005 by JAB Initial Power Up: 22-Apr-2005 by JDB Program Board Control PAL: 22-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 22-Apr-2005 by JDB Geographic Address Lines: 24-Apr-2005 by JAB Random Register: 24-Apr-2005 by JAB DAC/ADC Ratio: 24-Apr-2005 by JAB Find DAC: 24-Apr-2005 by JAB Frequency Response: 24-Apr-2005 by JAB FFT Analysis 24-Apr-2005 by JAB Channel Link: 24-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 22-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top in the analog section and on the bottom in the VME buffer, DC/DC converter, FPGA, analog and Channel Link sections. Notes: 22-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a scratch in the board between P2 and P3. There is corrosion on the P3 connector. 10-May-2005 Front panel removed and put on C16 so that C16 could be used in a system crate test. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B11 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 22-Apr-2005 by JDB Final Assembly: 18-May-2005 by JAB Testing: Ohm Meter: 22-Apr-2005 by JAB Initial Power Up: 22-Apr-2005 by JDB Program Board Control PAL: 22-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 22-Apr-2005 by JDB Geographic Address Lines: 24-Apr-2005 by JAB Random Register: 24-Apr-2005 by JAB DAC/ADC Ratio: 24-Apr-2005 by JAB Find DAC: 24-Apr-2005 by JAB Frequency Response: 24-Apr-2005 by JAB FFT Analysis 24-Apr-2005 by JAB Channel Link: 24-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 22-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top and bottom in the analog section. Notes: 22-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is corrosion on the P3 shielding. 05-May-2005 Removed front panel to have silkscreen reworked. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B12 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 22-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 22-Apr-2005 by JAB Initial Power Up: 22-Apr-2005 by JDB Program Board Control PAL: 22-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 22-Apr-2005 by JDB Geographic Address Lines: 24-Apr-2005 by JAB Random Register: 24-Apr-2005 by JAB DAC/ADC Ratio: 24-Apr-2005 by JAB Find DAC: 24-Apr-2005 by JAB Frequency Response: 24-Apr-2005 by JAB FFT Analysis 24-Apr-2005 by JAB Channel Link: 24-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 22-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top and bottom in the analog section. Notes: 22-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is corrosion on the P3 shielding. There is a scratch in the board on the back side between P2 and P3. The circuit board is comming apart in the corner near the LEDs where the board was milled down to half thickness. 10-May-2005 Front panel removed and put on D23 so that C16 could be used in a system crate test. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B13 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 23-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 24-Apr-2005 by JAB Initial Power Up: 25-Apr-2005 by JDB Program Board Control PAL: 25-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 25-Apr-2005 by JDB Geographic Address Lines: 26-Apr-2005 by JAB Random Register: 26-Apr-2005 by JAB DAC/ADC Ratio: 26-Apr-2005 by JAB Find DAC: 26-Apr-2005 by JAB Frequency Response: 26-Apr-2005 by JAB FFT Analysis 26-Apr-2005 by JAB Channel Link: 26-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 23-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the analog,Channel Link and FPGA sections and on top in the FPGA section. Notes: 23-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a circular mark on U1031 by pin 8. 05-May-2005 Removed front panel to have silkscreen reworked. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B14 Maestro ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 20-May-2005 Mechanical Inspection: 23-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 28-Apr-2005 by JDB Initial Power Up: 28-Apr-2005 by JDB Program Board Control PAL: 28-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 28-Apr-2005 by JDB Geographic Address Lines: 28-Apr-2005 by JAB Random Register: 28-Apr-2005 by JAB DAC/ADC Ratio: 28-Apr-2005 by JAB Find DAC: 28-Apr-2005 by JAB Frequency Response: 28-Apr-2005 by JAB FFT Analysis 28-Apr-2005 by JAB Channel Link: 28-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 23-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the analog,Channel Link and FPGA sections and on top in the FPGA section. Cleaned white residue from around the Channel Link chips. Removed excess solder flakes on the backside near P1. 28-Apr-2005 Fix solder bridges on: U553 between pins 45 and 46 N553 between pins 7 and 8 N552 between pins 1 and 2 N552 between pins 7 and 8 Soldered Unsoldered pins on N552 pins 4 and 5. Notes: 23-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a lot of dull white residue around the Channel Link chips. There is solder on the back side near the P1 connector. 24-Apr-2005 The ohm meter test failed because there is 0 ohms between VDD_ANALOG and Ground. 28-Apr-2005 Solder bridge on U553 between pins 45+46. Fixed. Solder bridge on N553 between pins 7+8. Fixed. Solder bridge on N552 between pins 1+2 and also between pins 7+8. Fixed. Also on N552 pins 4 and 5 are not soldered. Fixed. 28-Apr-2005 The card has been tested after the repair work done. All the tests passed successfully 05-May-2005 Removed front panel to have silkscreen reworked. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB 20-May-2005 Add jumpers W1021-W1027 to change SN#B14 into a Maestro ADF-2 card. Confirm that PLL tracks with SCLD input into SN#B14. =============================================================================== S/N: B15 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 23-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 24-Apr-2005 by JAB Initial Power Up: 25-Apr-2005 by JDB Program Board Control PAL: 25-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 25-Apr-2005 by JDB Geographic Address Lines: 26-Apr-2005 by JAB Random Register: 26-Apr-2005 by JAB DAC/ADC Ratio: 26-Apr-2005 by JAB Find DAC: 26-Apr-2005 by JAB Frequency Response: 26-Apr-2005 by JAB FFT Analysis 26-Apr-2005 by JAB Channel Link: 26-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 23-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the analog,Channel Link and FPGA sections. The plastic case of the inductor on U1331 was super glues to the metal clip on the circuit board on U1331. Notes: 23-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. The plastic case for the inductor on U1331 is loose. There is corrosion on the P3 shielding. 05-May-2005 Removed front panel to have silkscreen reworked. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B16 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 23-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 24-Apr-2005 by JAB Initial Power Up: 25-Apr-2005 by JDB Program Board Control PAL: 25-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 25-Apr-2005 by JDB Geographic Address Lines: 26-Apr-2005 by JAB Random Register: 26-Apr-2005 by JAB DAC/ADC Ratio: 26-Apr-2005 by JAB Find DAC: 26-Apr-2005 by JAB Frequency Response: 26-Apr-2005 by JAB FFT Analysis 26-Apr-2005 by JAB Channel Link: 26-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 23-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the analog,VCXO, DC/DC convertors, and FPGA sections and on top in the analog section. Clean white residue by P5 and U1101. Remove solder flakes on board on back side near P1. Notes: 23-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is corrosion on the P3 shielding. The board is coming apart at corner (0,0) where the board was milled. There is white residue on top by P5 and U1101. There are solder flakes on the back side near P1. 05-May-2005 Removed front panel to have silkscreen reworked. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B17 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 23-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 24-Apr-2005 by JAB Initial Power Up: 25-Apr-2005 by JDB Program Board Control PAL: 25-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 25-Apr-2005 by JDB Geographic Address Lines: 26-Apr-2005 by JAB Random Register: 26-Apr-2005 by JAB DAC/ADC Ratio: 28-Apr-2005 by JAB Find DAC: 28-Apr-2005 by JAB Frequency Response: 28-Apr-2005 by JAB FFT Analysis 28-Apr-2005 by JAB Channel Link: 28-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 23-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the analog,Channel Link and FPGA sections. Notes: 23-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is corrosion on the P3 shielding. 26-Apr-2005 Find DAC test failed for the channel EM(3,3) FinDac= 103, StdDev= 0.43 after running the FFTTOOL it was found that the bit D9 is stuck on '0' for the channel EM(3,3). The card has been set apart for further inspection. 28-Apr-2005 The card has been tested after the repair work done. All the tests passed successfully 05-May-2005 Removed front panel to have silkscreen reworked. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B18 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 23-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 24-Apr-2005 by JAB Initial Power Up: 25-Apr-2005 by JDB Program Board Control PAL: 25-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 25-Apr-2005 by JDB Geographic Address Lines: 27-Apr-2005 by JAB Random Register: 27-Apr-2005 by JAB DAC/ADC Ratio: 27-Apr-2005 by JAB Find DAC: 27-Apr-2005 by JAB Frequency Response: 27-Apr-2005 by JAB FFT Analysis 27-Apr-2005 by JAB Channel Link: 27-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 23-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the analog and FPGA sections and on top in the analog section. Cleaned white residue from around the Channel Link chips. Removed solder flakes from the backside near P1. Notes: 23-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is corrosion on the P3 shielding. There is white residue around the Channel Link chips. There are solder flakes on the back side near P1. 05-May-2005 Removed front panel to have silkscreen reworked. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B19 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 18-May-2005 Mechanical Inspection: 23-Apr-2005 by JDB Final Assembly: 18-May-2005 by JDB Testing: Ohm Meter: 24-Apr-2005 by JAB Initial Power Up: 25-Apr-2005 by JDB Program Board Control PAL: 25-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 25-Apr-2005 by JDB Geographic Address Lines: 27-Apr-2005 by JAB Random Register: 27-Apr-2005 by JAB DAC/ADC Ratio: 27-Apr-2005 by JAB Find DAC: 27-Apr-2005 by JAB Frequency Response: 27-Apr-2005 by JAB FFT Analysis 27-Apr-2005 by JAB Channel Link: 27-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 23-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the analog section. Notes: 23-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. The board is coming apart in the coner near the LEDs. This is occuring where the board was milled. 05-May-2005 Removed front panel to have silkscreen reworked. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB =============================================================================== S/N: B20 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 31-May-2005 Mechanical Inspection: 23-Apr-2005 by JDB Final Assembly: 31-May-2005 by JDB Testing: Ohm Meter: 24-Apr-2005 by JAB Initial Power Up: 25-Apr-2005 by JDB Program Board Control PAL: 25-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 31-May-2005 by JDB Geographic Address Lines: 27-Apr-2005 by JAB Random Register: 27-Apr-2005 by JAB DAC/ADC Ratio: 27-Apr-2005 by JAB Find DAC: 27-Apr-2005 by JAB Frequency Response: 27-Apr-2005 by JAB FFT Analysis 27-Apr-2005 by JAB Channel Link: 27-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 23-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top and bottom in the analog section. 05-May-2005 Removed front panel to have silkscreen reworked. Glued plastic housing on LED1392. Notes: 23-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. The Basic IO test fails because the LED case to LED1392 is misisng. The LEDs work but they cannot be viewed through the from panel. 05-May-2005 Removed front panel to have silkscreen reworked. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 18-May-2005 Install front-panel with reworked silkscreen. JDB 31-May-2005 Install screws for front panel brace. JDB =============================================================================== S/N: B21 Maestro ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 31-May-2005 Mechanical Inspection: 26-Apr-2005 by JDB Final Assembly: 26-Apr-2005 by JAB Testing: Ohm Meter: 26-Apr-2005 by JAB Initial Power Up: 27-Apr-2005 by JDB Program Board Control PAL: 27-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 27-Apr-2005 by JAB Geographic Address Lines: 27-Apr-2005 by JAB Random Register: 27-Apr-2005 by JAB DAC/ADC Ratio: 27-Apr-2005 by JAB Find DAC: 27-Apr-2005 by JAB Frequency Response: 27-Apr-2005 by JAB FFT Analysis 27-Apr-2005 by JAB Channel Link: 27-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 26-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top in the FPGA section and on the bottom in the Channel Link, PAL, FPGA and analog sections. Glued the plastic case for the inductor on U1331 to the metal clip on the circuit board of U1331. Cleaned white residue from around U1051 and U1052. Notes: 26-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a lot of white residue around U1051 and U1052. Cleaned. The plastic case for the Inductor on U1331 is loose. Glued. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 31-May-2005 Add jumpers W1021-W1027 to change SN#B21 into a Maestro ADF-2 card. Confirm that PLL tracks with SCLD input into SN#B21. =============================================================================== S/N: C1 Maestro ADF-2 Gain Species: EM: 4.0 HD: 4.0 Date of the latest entry in this card's Trailer Sheet: 31-May-2005 Mechanical Inspection: 5-Jan-2005 by DE Final Assembly: 5-JAN-2005 by DE Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 04-Mar-2005 by JDB Program Board Control PAL: 22-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 29-Mar-2005 by JAB Geographic Address Lines: 29-Mar-2005 by JAB Random Register: 29-Mar-2005 by JAB DAC/ADC Ratio: 29-Mar-2005 by JAB Find DAC: 29-Mar-2005 by JAB Frequency Response: 29-Mar-2005 by JAB FFT Analysis 29-Mar-2005 by JAB Channel Link: 29-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 25-FEB-2005 Removed flag wires, temporary oscillator, discrete LEDs that were not in front panel and the front panel from SN#1. Added the VCXO, C905, C906, C907 and R129. Added front panel with discrete LEDs epoxied into front panel and soldered LED leads to the circuit board. Notes: 22-FEB-2005 Programmed BCP_16-FEB-2005.jed into the PAL. Both FPGAs configured properly over VME. 25-FEB-2005 Performed the DC resistance test. The resistance between GROUND and VCCINT is low (96 Ohms) and the resistance between VCCINT and VDD_ANALOG is low (169 Ohms). SN #1 passed a 30M loop random register test. It works after changing the oscillator (temporary with the real oscillator), removing the flag wires, changing the front panel and LEDs and adding the missing resistors and capacitors. 02-Mar-2005 SN #1 passed step 4 (ohm meter test) of adf-2 circuit board check in checklist. Addition tests deferred until it has been determined how to test a maestro card. 04-Mar-2005 Place SN #1 in slot 8, SN #8 in slot 20 and move SCLD cable from slot 20 to slot 8. SN #1 passed steps 5-12 of adf-2 circuit board check in check list. Moved SN#1 and SCLD cable back to slot 20 after testing and confirmed that the PLL still locked onto the signal from the SCLD. 08-Mar-2005 Add front panel labels for SN, gain species, and maestro. Add label on P0 connector for SN. 15-Mar-2005 Changed serial number from 01 to C1. 25-Mar-2005 The resistance between VCCINT and Ground, VDD_LOGIC and VDD_ANALOG is lower than other 8 cards. SN#C10 is similar. 12-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 31-May-2005 Changed front panel label to match the size and style of other boards. =============================================================================== S/N: C2 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 31-May-2005 Mechanical Inspection: 12-Jan-2005 by DE Final Assembly: 12-JAN-2005 by DE Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 02-Mar-2005 by JDB Program Board Control PAL: 22-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 22-Mar-2005 by JAB Geographic Address Lines: 22-Mar-2005 by JAB Random Register: 22-Mar-2005 by JAB DAC/ADC Ratio: 22-Mar-2005 by JAB Find DAC: 22-Mar-2005 by JAB Frequency Response: 22-Mar-2005 by JAB FFT Analysis 22-Mar-2005 by JAB Channel Link: 16-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 18-JAN-2005 On card SN #2 Ch 15 HD had its ADC data bit of value 128 stuck high. That was caused by an open solder connection on resistor array N723 pin 3. Re-solder this connection. 21-JAN-2005 On SN #2 install the components that were missing from the initial build: VCXO, R129, C905, C906, C907. 18-FEB-2005 SN #2 was not tracking the SCLD BX_Clock. Find an open solder connection on pin #1 of the VCXO. Properly solder the VCXO pin. 25-FEB-2005 Removed flag wires. Notes: 12-JAN-2005 Install the substitute type front panel LED's. SN #2 has a plane aluminum front panel. 22-FEB-2005 Programmed BCP_16-FEB-2005.jed into the PAL. Both FPGAs configured properly over VME. 25-FEB-2005 SN #2 passed a 30M loop random register test. It works after removing the flag wires. 02-Mar-2005 SN #2 passed tests 4-12 circuit board check-in checklist. 08-Mar-2005 Add front panel labels for SN, and gain species. Add label on P0 connector for SN. 15-Mar-2005 Changed serial number from 02 to C2. 22-MAR-2005 Card has been tested using the new GUI (V. 3.2A), all the tests passed successfully. (channel link test was not included, this one passed on 16-Mar-2005)JAB 12-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 31-May-2005 Changed front panel label to match the size and style of other boards. =============================================================================== S/N: C3 Maestro ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 19-May-2005 Mechanical Inspection: __-Jan-2005 by DE Final Assembly: 21-Jan-2005 by DE Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 02-Mar-2005 by JDB Program Board Control PAL: 22-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 02-Mar-2005 by JDB Geographic Address Lines: 02-Mar-2005 by JDB Random Register: 02-Mar-2005 by JDB DAC/ADC Ratio: 02-Mar-2005 by JDB Find DAC: 02-Mar-2005 by JDB Frequency Response: 02-Mar-2005 by JDB FFT Analysis __-___-____ by ___ Channel Link: __-___-2005 by ___ Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 07-Mar-2005 Add jumpers W1021-W1027 to change SN#3 into a Maestro ADF-2 card. Confirm that PLL tracks with SCLD input into SN#3. Notes: 22-FEB-2005 Programmed BCP_16-FEB-2005.jed into the PAL. Both FPGAs configured properly over VME. 02-Mar-2005 SN #3 passed tests 4-12 circuit board check-in checklist. 08-Mar-2005 Add front panel labels for SN, and gain species. Add label on P0 connector for SN. 08-Mar-2005 Moved C3 to Fermilab for use in the sidewalk test area. 19-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE =============================================================================== S/N: C4 One time DEMO CARD ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 31-May-2005 Mechanical Inspection: __-Jan-2005 by DE Final Assembly: 22-Jan-2005 by DE Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 02-Mar-2005 by JDB Program Board Control PAL: 22-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 06-Apr-2005 by JAB Geographic Address Lines: 06-Apr-2005 by JAB Random Register: 06-Apr-2005 by JAB DAC/ADC Ratio: 06-Apr-2005 by JAB Find DAC: 06-Apr-2005 by JAB Frequency Response: 06-Apr-2005 by JAB FFT Analysis 06-Apr-2005 by JAB Channel Link: 16-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 31-Mar-2005 Glue the plastic housing on U1331 to the metal brace. 06-Apr-2005 Pins 6 and 7 of N22 were not soldered. This was corrected. Pins 6,7, and 8 of N322 and pins 6 and 7 of N302 were not soldered. This was corrected. Notes: 27-JAN-2005 SN #4 becomes a DEMO Only card. It is running just fine but we need a DEMO Only card for the Directors Review. It is shipped to Paul Padley at Rice University. 22-FEB-2005 SN #4 is back. It does not look physically damaged but it clearly has not been handled with correct static protection. Officially remove its DEMO Only status and try to bring it back in the flock. 22-FEB-2005 Programmed BCP_16-FEB-2005.jed into the PAL. Both FPGAs configured properly over VME. The front and back of the card did not feel hot after running for a couple of minutes. 23-FEB-2005 Configured FPGAs successfully. Passed Random Register Test for 8 registers at base address 512 in each FPGA for a 1M cycle loop. Passed DAC to ADC ratio test. 02-Mar-2005 SN #4 passed tests 4-10 circuit board check-in checklist. Test 11 (Find DAC) failed for channel 6 (TT_EM(1,2)). It could not find a DAC value that corresponded to an ADC output of 490. Test 11 returned an out of range value for TT_HD(1,0). It returned 241 when the acceptable values are 50-200. 08-Mar-2005 Add front panel labels for SN, and gain species. Add label on P0 connector for SN. 15-Mar-2005 Changed serial number from 04 to C4. On U1331 (3.3V DC/DC convertor), the plastic housing is not connected to the mechanical support that holds one end to the circuit board. There is a metal clip that is soldered to the circuit board of the DC/DC convertor and that metal clip is glued to the black plastic housing of the inductor. This is the joint that has failed. 22-MAR-2005 Card has been tested using the new GUI (V. 3.2A). Find DAC test failed, for the channel EM(1,2) the information provided by the FFTTOOL can gives us a clue about the possible error, for the channel EM(1,2) the bits D2, D3, and D4 are set to '1', and the bit D9 is always set to '0'. Frequency response is good except for the EM(1,2) channel. JAB. 06-Apr-2005 The card has been repaired, tests were rerun on the card and all of them passed (channel link test was not included, this one alredy passed on 16-Mar-2005) 18-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 31-May-2005 Changed front panel label to match the size and style of other boards. =============================================================================== S/N: C5 Maestro ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 30-June-2005 Mechanical Inspection: 1-Feb-2005 by DE Final Assembly: 1-Feb-2005 by DE Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 02-Mar-2005 by JDB Program Board Control PAL: 22-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 02-Mar-2005 by JDB Geographic Address Lines: 02-Mar-2005 by JDB Random Register: 02-Mar-2005 by JDB DAC/ADC Ratio: 02-Mar-2005 by JDB Find DAC: 02-Mar-2005 by JDB Frequency Response: 02-Mar-2005 by JDB FFT Analysis __-___-____ by ___ Channel Link: 16-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: Notes: 22-FEB-2005 Programmed BCP_16-FEB-2005.jed into the PAL. Both FPGAs configured properly over VME. 02-Mar-2005 SN #5 passed tests 4-12 circuit board check-in checklist. Step 11 (Find DAC) reported that TT_HD(3,3) value of 201 is out of the acceptable range of 50-200. 08-Mar-2005 Add front panel labels for SN, and gain species. Add label on P0 connector for SN. 15-Mar-2005 Changed serial number from 05 to C5. 22-Mar-2005 Moved C5 to Fermilab for use in the sidewalk test area. 19-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 30-June-2005 Changed C5 to a Maestro ADF-2 card so we could run two crates at Fermi with one card in each. =============================================================================== S/N: C6 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 1-Feb-2005 by DE Final Assembly: 1-Feb-2005 by DE Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 02-Mar-2005 by JDB Program Board Control PAL: 22-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 06-Apr-2005 by JAB Geographic Address Lines: 06-Apr-2005 by JAB Random Register: 06-Apr-2005 by JAB DAC/ADC Ratio: 06-Apr-2005 by JAB Find DAC: 06-Apr-2005 by JAB Frequency Response: 06-Apr-2005 by JAB FFT Analysis 06-Apr-2005 by JAB Channel Link: 16-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 06-Apr-2005 Pins 6 and 7 of N22 were not soldered. This was corrected. Notes: 22-FEB-2005 Programmed BCP_16-FEB-2005.jed into the PAL. Both FPGAs configured properly over VME. 02-Mar-2005 SN #6 passed tests 4-10 circuit board check-in checklist. Test 11 (Find DAC) failed for channel 0 (TT_EM(0,0)). It could not find a DAC value that corresponded to an ADC output of 490. 08-Mar-2005 Add front panel labels for SN, and gain species. Add label on P0 connector for SN. 15-Mar-2005 Changed serial number from 06 to C6. 22-MAR-2005 Card has been tested using the new GUI (V. 3.2A). Find DAC test failed, for the channel EM(0,0). Information provided by the FFTTOOL: Channel EM(0,0) bit D4 is always set to '1' and D9 to '0' Frequency response is good except for the EM(0,0) channel. JAB. 06-Apr-2005 The card has been repaired, tests were rerun on the card and all of them passed (channel link test was not included, this one alredy passed on 16-Mar-2005) 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C7 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: __-___-2005 by ___ Final Assembly: 17-FEB-2005 by JDB Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 02-Mar-2005 by JDB Program Board Control PAL: 23-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 22-Mar-2005 by JDB Geographic Address Lines: 22-Mar-2005 by JDB Random Register: 22-Mar-2005 by JDB DAC/ADC Ratio: 22-Mar-2005 by JDB Find DAC: 22-Mar-2005 by JDB Frequency Response: 22-Mar-2005 by JDB FFT Analysis 22-Mar-2005 by JAB Channel Link: 02-Mar-2005 by JDB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 17-FEB-2005 On SN #7 install the components that were missing from the initial build: VCXO, R129, C905, C906, C907. 31-Mar-2005 Remove white residue from around LED pads. Notes: 18-FEB-2005 On SN #7 install the front panel and solder the LED leads to the circuit board. 21,22-FEB-2005 SN #7 passed DC resistance checks. 23-FEB-2005 Programmed PAL successfully. Configured FPGAs successfully. Passed Random Register Test for 8 registers at base address 512 in each FPGA for a 1M cycle loop. Passed DAC to ADC ratio test. 02-Mar-2005 SN #7 passed tests 4-12 circuit board check-in checklist. 08-Mar-2005 Add front panel labels for SN, and gain species. Add label on P0 connector for SN. 15-Mar-2005 Changed serial number from 07 to C7. 22-MAR-2005 Card has been tested using the new GUI (V. 3.2A), all the tests passed successfully (channel link test was not included, this one passed on 02-Mar-2005). JAB 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C8 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: __-___-2005 by ___ Final Assembly: 17-FEB-2005 by JDB Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 02-Mar-2005 by JDB Program Board Control PAL: 23-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 22-Mar-2005 by JDB Geographic Address Lines: 22-Mar-2005 by JDB Random Register: 22-Mar-2005 by JDB DAC/ADC Ratio: 22-Mar-2005 by JDB Find DAC: 22-Mar-2005 by JDB Frequency Response: 22-Mar-2005 by JDB FFT Analysis 22-Mar-2005 by JAB Channel Link: 21-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 17-FEB-2005 On SN #8 install the components that were missing from the initial build: VCXO, R129, C905, C906, C907. 23-FEB-2005 On SN #8 the short between VDD_LOGIC and GROUND was found to be a solder bridge across bypass capacitor C1205. C1205 is on the back side of the pcb under the upper Channel Link chip. Removed the solder bridge. SN #8 is ready to Resistance Check again. 24-FEB-2005 Replaced the fuse for VDD_ANALOG. There was 200 ohms of resistance across the fuse. Notes: 18-FEB-2005 On SN #8 install the front panel and solder the LED leads to the circuit board. 21,22-FEB-2005 SN #8 failed DC resistance checks. There is a short between GROUND and VDD_LOGIC. 24-FEB-2005 Passed DC resistance test after the short on C1205 was fixed. 24-FEB-2005 Programmed PAL successfully. Configured FPGAs successfully. Passed Random Register Test for 8 registers at base address 512 in each FPGA for a 100M cycle loop. Passed DAC to ADC ratio test. 02-Mar-2005 SN #8 passed tests 4-12 circuit board check-in checklist. Step 10 (DAC to ADC ratio) reports errors for channels TT_EM(3,3) and TT_HD(3,3) because their ratio is outside the accepted range of 6.9-7.3. EM(3,3)'s ratio is 7.34 and HD(3,3)'s ratio is 7.31. Step 11 (Find DAC) reported that TT_EM(3,0) value of 201 is out of the acceptable range of 50-200. 08-Mar-2005 Add front panel labels for SN, and gain species. Add label on P0 connector for SN. 15-Mar-2005 Changed serial number from 08 to C8. 22-MAR-2005 Card has been tested using the new GUI (V. 3.2A), all the tests passed successfully (channel link test was not included, this one passed on 21-Mar-2005). JAB 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C9 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 05-May-2005 Mechanical Inspection: __-___-2005 by ___ Final Assembly: 17-FEB-2005 by JDB Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 02-Mar-2005 by JDB Program Board Control PAL: 23-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 05-May-2005 by JDB Geographic Address Lines: 22-Mar-2005 by JAB Random Register: 22-Mar-2005 by JAB DAC/ADC Ratio: 05-May-2005 by JDB Find DAC: 05-May-2005 by JDB Frequency Response: 05-May-2005 by JDB FFT Analysis 05-May-2005 by JDB Channel Link: 29-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 17-FEB-2005 On SN #9 install the components that were missing from the initial build: VCXO, R129, C905, C906, C907. 31-Mar-2005 Remove white residue from around LED pads. 05-May-2005 C276 has an unsoldered lead. Fixed. Notes: 18-FEB-2005 On SN #9 install the front panel and solder the LED leads to the circuit board. 21,22-FEB-2005 SN #9 passed DC resistance checks. 23-FEB-2005 Programmed PAL successfully. Configured FPGAs successfully. Passed Random Register Test for 8 registers at base address 512 in each FPGA for a 1M cycle loop. Passed DAC to ADC ratio test. 02-Mar-2005 SN #9 passed tests 4-11 circuit board check-in checklist. Step 12 (Frequency Response) fails because there is high feed-through for channel 22 at 20MHz. 08-Mar-2005 Add front panel labels for SN, and gain species. Add label on P0 connector for SN. 15-Mar-2005 Changed serial number from 09 to C9. 22-MAR-2005 Card has been tested using the new GUI (V. 3.2A), all the tests passed successfully. For channel 22 on the frequency response test the value for the 20 MHz is around 140 counts which is above the other channels level ~100 . JAB 12-Apr-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 05-May-2005 Reran analog tests after fixing C276. This fixed the high frequency feedthrough in channel 22 (HD(11,)). =============================================================================== S/N: C10 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: __-___-2005 by ___ Final Assembly: 17-FEB-2005 by JDB Testing: Ohm Meter: 02-Mar-2005 by JDB Initial Power Up: 02-Mar-2005 by JDB Program Board Control PAL: 23-FEB-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 22-Mar-2005 by JAB Geographic Address Lines: 22-Mar-2005 by JAB Random Register: 22-Mar-2005 by JAB DAC/ADC Ratio: 22-Mar-2005 by JAB Find DAC: 22-Mar-2005 by JAB Frequency Response: 22-Mar-2005 by JAB FFT Analysis 22-Mar-2005 by JAB Channel Link: 29-Mar-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 17-FEB-2005 On SN #10 install the components that were missing from the initial build: VCXO, R129, C905, C906, C907. 31-Mar-2005 Remove white residue from around LED pads. Notes: 18-FEB-2005 On SN #10 install the front panel and solder the LED leads to the circuit board. 21,22-FEB-2005 SN #10 passed DC resistance checks. The resistance between VCCINT and VDD_ANALOG, VDD_LOGIC and GROUND is lower than SN #7 and #9. 23-FEB-2005 Programmed PAL successfully. Configured FPGAs successfully. Passed Random Register Test for 8 registers at base address 512 in each FPGA for a 1M cycle loop. Passed DAC to ADC ratio test. 02-Mar-2005 SN #10 passed tests 4-12 circuit board check-in checklist. 08-Mar-2005 Add front panel labels for SN, and gain species. Add label on P0 connector for SN. 15-Mar-2005 Changed serial number from 10 to C10. 22-MAR-2005 Card has been tested using the new GUI (V. 3.2A), all the test passed, except the DAC/ADC Ratio test: for the channels EM(0,2), EM(1,2), EM(2,2), EM(3,2), HD(0,2), HD(1,2), HD(2,2), HD(3,2) the value was out of the range But close to the accepted values. Notice that all the failed channels have a 2 as second index. JAB 25-Mar-2005 The resistance between VCCINT and Ground, VDD_LOGIC and VDD_ANALOG is lower than other 8 cards. SN#C1 is similar. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C11 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 12-Apr-2005 by JDB Final Assembly: 12-Apr-2005 by JAB Testing: Ohm Meter: 12-Apr-2005 by JAB Initial Power Up: 13-Apr-2005 by JDB Program Board Control PAL: 13-Apr-2005 by JDB BC_PAL Firmware Version: 16-FEB-2005 VME IO to PAL and FPGAs 13-Apr-2005 by JDB Geographic Address Lines: 13-Apr-2005 by JAB Random Register: 13-Apr-2005 by JAB DAC/ADC Ratio: 13-Apr-2005 by JAB Find DAC: 13-Apr-2005 by JAB Frequency Response: 13-Apr-2005 by JAB FFT Analysis 13-Apr-2005 by JAB Channel Link: 13-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 12-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in the analog section on the top and bottom of the board. Notes: 12-Apr-2005 There is corrosion on the P3 connector shielding. There is stray solder on the P3 pads on the back side near P2. There are scratches in the board near P2 on the back side. There is white residue around P2 on the back side. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C12 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 12-Apr-2005 by JDB Final Assembly: 12-Apr-2005 by JAB Testing: Ohm Meter: 28-Apr-2005 by JDB Initial Power Up: 28-Apr-2005 by JDB Program Board Control PAL: 28-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 28-Apr-2005 by JAB Geographic Address Lines: 28-Apr-2005 by JAB Random Register: 28-Apr-2005 by JAB DAC/ADC Ratio: 28-Apr-2005 by JAB Find DAC: 28-Apr-2005 by JAB Frequency Response: 28-Apr-2005 by JAB FFT Analysis 28-Apr-2005 by JAB Channel Link: 28-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 12-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in the FPGA and analog sections on the top side and across the whole board on the back side. 28-Apr-2005 Solder the VCC_LOGIC pin on U1321 to the board. Notes: 12-Apr-2005 There is corrosion on the P3 connector shielding. There is stray solder on the P3 pads on the back side near P2. There are scratches in the board near P2 on the back side. There is white residue around P1 and P2 on the back side. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. The top of U1410 is nicked. There is stray solder on the board near P1 on the backside. There is stray solder between U1052 and U1021. 13-Apr-2005 The powerup tests failed because VCCINT was at 0V. 28-Apr-2005 The pin connecting U1321 to VCC_LOGIC is not soldered. There is a gap between the pin and the pad. Fixed. 28-Apr-2005 The card has been tested after the repair work done. All the test passed successfully 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C13 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 12-Apr-2005 by JDB Final Assembly: 12-Apr-2005 by JAB Testing: Ohm Meter: 12-Apr-2005 by JAB Initial Power Up: 13-Apr-2005 by JDB Program Board Control PAL: 13-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 14-Apr-2005 by JAB Geographic Address Lines: 14-Apr-2005 by JAB Random Register: 14-Apr-2005 by JAB DAC/ADC Ratio: 14-Apr-2005 by JAB Find DAC: 14-Apr-2005 by JAB Frequency Response: 14-Apr-2005 by JAB FFT Analysis 14-Apr-2005 by JAB Channel Link: 14-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 12-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in the analog section on the top side and across the whole board on the back side. Notes: 12-Apr-2005 There is corrosion and some adhesive on the P3 connector shielding. There is white residue around P1 on the back side. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is something glossy on the PAL that wipes away with alcohol. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C14 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 10-May-2005 Mechanical Inspection: 12-Apr-2005 by JDB Final Assembly: 12-Apr-2005 by JAB Testing: Ohm Meter: 12-Apr-2005 by JAB Initial Power Up: 13-Apr-2005 by JDB Program Board Control PAL: 13-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 14-Apr-2005 by JAB Geographic Address Lines: 14-Apr-2005 by JAB Random Register: 14-Apr-2005 by JAB DAC/ADC Ratio: 14-Apr-2005 by JAB Find DAC: 14-Apr-2005 by JAB Frequency Response: 14-Apr-2005 by JAB FFT Analysis 14-Apr-2005 by JAB Channel Link: 14-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 12-Apr-2005 Clean out the plastic from A19 on P3 with an exacto blade. Notes: 12-Apr-2005 There is a scratch in the board between P2 and P3 on the back side. Recepticle A19 is damaged on P3. There is plastic obstructing the opening. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C15 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 11-May-2005 Mechanical Inspection: 13-Apr-2005 by JDB Final Assembly: 13-Apr-2005 by JAB Testing: Ohm Meter: 13-Apr-2005 by JAB Initial Power Up: 14-Apr-2005 by JDB Program Board Control PAL: 14-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 14-Apr-2005 by JAB Geographic Address Lines: 14-Apr-2005 by JAB Random Register: 14-Apr-2005 by JAB DAC/ADC Ratio: 14-Apr-2005 by JAB Find DAC: 14-Apr-2005 by JAB Frequency Response: 14-Apr-2005 by JAB FFT Analysis 14-Apr-2005 by JAB Channel Link: 14-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 13-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in the top and bottom across the whole board. Notes: 13-Apr-2005 There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. 11-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C16 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 11-May-2005 Mechanical Inspection: 13-Apr-2005 by JDB Final Assembly: 13-Apr-2005 by JAB Testing: Ohm Meter: 13-Apr-2005 by JAB Initial Power Up: 14-Apr-2005 by JDB Program Board Control PAL: 14-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 28-Apr-2005 by JDB Geographic Address Lines: 28-Apr-2005 by JDB Random Register: 28-Apr-2005 by JDB DAC/ADC Ratio: 28-Apr-2005 by JDB Find DAC: 28-Apr-2005 by JDB Frequency Response: 28-Apr-2005 by JDB FFT Analysis 28-Apr-2005 by JDB Channel Link: 28-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 13-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in the bottom in the Channel Link and Analog sections. Glue housing for LED1392 back on with superglue. 28-Apr-2005 Fix short on N453 between pins 7 and 8. 05-May-2005 Removed front panel to have silkscreen reworked. Notes: 13-Apr-2005 There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is something glossy on the PAL that wipes off with alcohol. Some of the vias under the -12V input section of the board are not completely covered with soldermask. The housing of LED 1392 fell off. There is a scratch in the board on the bottom between P2 and P3. 15-Apr-2005 DAC/ADC test failed for channel EM(1,1). The results of running the frequency response test show that the average RMS value for all channels is about 145 which is very low compared to the expected values, for the channel EM(1,1) this value is particularly low (~138). The FFT analysis shows that all channels are being saturated on the lower limit, (there are some data points being '0') for all channels the bit D9 is set to cero '0' at all times. The card has been send to repair. 28-Apr-2005 There is a solder bridge on N453 between pins 7 and 8. Fixed. 28-Apr-2005 The card has been tested after the repair work done. All the test passed successfully 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE 11-May-2005 Added front panel from B10. Front panel relabelled to C16. =============================================================================== S/N: C17 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 11-May-2005 Mechanical Inspection: 13-Apr-2005 by JDB Final Assembly: 13-Apr-2005 by JAB Testing: Ohm Meter: 13-Apr-2005 by JAB Initial Power Up: 14-Apr-2005 by JDB Program Board Control PAL: 14-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 15-Apr-2005 by JAB Geographic Address Lines: 15-Apr-2005 by JAB Random Register: 15-Apr-2005 by JAB DAC/ADC Ratio: 15-Apr-2005 by JAB Find DAC: 15-Apr-2005 by JAB Frequency Response: 15-Apr-2005 by JAB FFT Analysis 15-Apr-2005 by JAB Channel Link: 15-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 13-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in across the whole board on both sides. Notes: 13-Apr-2005 There are black marks on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a scratch in the board on the bottom between P2 and P3. 11-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C18 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 11-May-2005 Mechanical Inspection: 13-Apr-2005 by JDB Final Assembly: 13-Apr-2005 by JAB Testing: Ohm Meter: 13-Apr-2005 by JAB Initial Power Up: 14-Apr-2005 by JDB Program Board Control PAL: 14-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 15-Apr-2005 by JAB Geographic Address Lines: 15-Apr-2005 by JAB Random Register: 15-Apr-2005 by JAB DAC/ADC Ratio: 15-Apr-2005 by JAB Find DAC: 15-Apr-2005 by JAB Frequency Response: 15-Apr-2005 by JAB FFT Analysis 15-Apr-2005 by JAB Channel Link: 15-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 13-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in the analog section on both sides. Notes: 13-Apr-2005 There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a scratch in the board on the bottom between P2 and P3. A mounting screw for P2 fell off when the card was removed from its anistatic bag. 11-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C19 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 11-May-2005 Mechanical Inspection: 13-Apr-2005 by JDB Final Assembly: 13-Apr-2005 by JAB Testing: Ohm Meter: 13-Apr-2005 by JAB Initial Power Up: 14-Apr-2005 by JDB Program Board Control PAL: 14-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 17-Apr-2005 by JAB Geographic Address Lines: 17-Apr-2005 by JAB Random Register: 17-Apr-2005 by JAB DAC/ADC Ratio: 17-Apr-2005 by JAB Find DAC: 17-Apr-2005 by JAB Frequency Response: 17-Apr-2005 by JAB FFT Analysis 17-Apr-2005 by JAB Channel Link: 17-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 13-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in the FPGA and analog sections on the top side and in the DC/DC convertors, FPGA and analog secions on the bottom side. Notes: 13-Apr-2005 There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a scratch in the board on the bottom between P2 and P3. There is stray solder on the backside near P1. 11-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C20 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 11-May-2005 Mechanical Inspection: 13-Apr-2005 by JDB Final Assembly: 13-Apr-2005 by JAB Testing: Ohm Meter: 13-Apr-2005 by JAB Initial Power Up: 14-Apr-2005 by JDB Program Board Control PAL: 14-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 17-Apr-2005 by JAB Geographic Address Lines: 17-Apr-2005 by JAB Random Register: 17-Apr-2005 by JAB DAC/ADC Ratio: 17-Apr-2005 by JAB Find DAC: 17-Apr-2005 by JAB Frequency Response: 17-Apr-2005 by JAB FFT Analysis 17-Apr-2005 by JAB Channel Link: 17-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: Notes: 13-Apr-2005 There is corrosion on the P3 shielding. There are scratches in the board on the back side around P3. There is not solder mask over some of the power trace and via between U1321 and the LEDs on the back side. The via and part of the trace are gold plated. 11-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: C21 ADF-2 Gain Species: 4.0 EM 4.0 HD Date of the latest entry in this card's Trailer Sheet: 11-May-2005 Mechanical Inspection: 13-Apr-2005 by JDB Final Assembly: 13-Apr-2005 by JAB Testing: Ohm Meter: 13-Apr-2005 by JAB Initial Power Up: 14-Apr-2005 by JDB Program Board Control PAL: 14-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 18-Apr-2005 by JAB Geographic Address Lines: 18-Apr-2005 by JAB Random Register: 18-Apr-2005 by JAB DAC/ADC Ratio: 18-Apr-2005 by JAB Find DAC: 18-Apr-2005 by JAB Frequency Response: 18-Apr-2005 by JAB FFT Analysis 18-Apr-2005 by JAB Channel Link: 18-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 13-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in the analog section on the top side and in the FPGA and analog section on the bottom side. Repair recepticle A1 on P3 by removing plastic with an exacto blade. Removed solder on board on back side near P1. 18-Apr-2005 N702 was rotated by 90 degrees. It has been removed and replaced. Notes: 13-Apr-2005 Recepticle A1 on P3 is crushed closed. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a scratch in the board on the bottom between P2 and P3. There is stray solder on the backside near P1. 17-Apr-2005 The card has failed the find DAC test on the channel EM(3,1), the FFT analysis found that the bits D0 and D1 are set to '1' at all times the card has been set apart for further inspection. 18-Apr-2005 The card has been tested obtaining satisfactory results after repairs were done. 11-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D1 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 31-Mar-2005 by JDB Final Assembly: 04-Apr-2005 by JAB Testing: Ohm Meter: 04-Apr-2005 by JAB Initial Power Up: 04-Apr-2005 by JDB Program Board Control PAL: 04-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 04-Apr-2005 by JDB Geographic Address Lines: 04-Apr-2005 by JAB Random Register: 04-Apr-2005 by JAB DAC/ADC Ratio: 04-Apr-2005 by JAB Find DAC: 04-Apr-2005 by JAB Frequency Response: 04-Apr-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 04-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 31-Mar-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board top and bottom. Notes: 31-Mar-2005 There is white residue on the top side of the board near P3. There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: D2 Maestro ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 31-Mar-2005 by JDB Final Assembly: 04-Apr-2005 by JAB Testing: Ohm Meter: 04-Apr-2005 by JAB Initial Power Up: 04-Apr-2005 by JDB Program Board Control PAL: 04-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 06-Apr-2005 by JAB Geographic Address Lines: 06-Apr-2005 by JAB Random Register: 06-Apr-2005 by JAB DAC/ADC Ratio: 06-Apr-2005 by JAB Find DAC: 06-Apr-2005 by JAB Frequency Response: 06-Apr-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 04-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 31-Mar-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board top and bottom. 04-Apr-2005 Remove solder bridge between pins 44 and 45 of U503 Notes: 31-Mar-2005 There is a sticky piece of what looks like kapton on U303. It peels off easily. There is a scratch near P2 on the bottom of the board. There is a scratch near P3 on the bottom of the board. There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. 04-Apr-2005 The RMS value for the channel EM(3,0) is low 143 counts, by using the FFTTOOL, I found that the bit D9 is always set to zero. Further inspection for this card is required, find error for this channel EM(3,0). 06-Apr-2005 The card has been repaired, all the test passed (the channel link test was not included, this has been performed alredy on 04-Apr-2005) 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 11-May-2005 Add jumpers W1021-W1027 in order to turn D2 into a Maestro ADF-2 card. 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: D3 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 31-Mar-2005 by JDB Final Assembly: 04-Apr-2005 by JAB Testing: Ohm Meter: 04-Apr-2005 by JAB Initial Power Up: 04-Apr-2005 by JDB Program Board Control PAL: 04-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 04-Apr-2005 by JDB Geographic Address Lines: 04-Apr-2005 by JAB Random Register: 04-Apr-2005 by JAB DAC/ADC Ratio: 04-Apr-2005 by JAB Find DAC: 04-Apr-2005 by JAB Frequency Response: 04-Apr-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 04-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 31-Mar-2005 Glued the plastic housing of U1331 to its metal clip. 31-Mar-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board top and bottom. Notes: 31-Mar-2005 The plastic housing on U1331 is loose. There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: D4 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 31-Mar-2005 by JDB Final Assembly: 04-Apr-2005 by JAB Testing: Ohm Meter: 04-Apr-2005 by JAB Initial Power Up: 04-Apr-2005 by JDB Program Board Control PAL: 04-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 04-Apr-2005 by JDB Geographic Address Lines: 04-Apr-2005 by JAB Random Register: 04-Apr-2005 by JAB DAC/ADC Ratio: 04-Apr-2005 by JAB Find DAC: 04-Apr-2005 by JAB Frequency Response: 04-Apr-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 04-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 31-Mar-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board top and bottom. Notes: 31-Mar-2005 There is something shiny on the PAL. It looks like super glue. It does not come off with alcohol. There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: D5 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 01-Apr-2005 by JDB Final Assembly: 05-Apr-2005 by JAB Testing: Ohm Meter: 04-Apr-2005 by JAB Initial Power Up: 05-Apr-2005 by JDB Program Board Control PAL: 05-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 06-Apr-2005 by JAB Geographic Address Lines: 06-Apr-2005 by JAB Random Register: 06-Apr-2005 by JAB DAC/ADC Ratio: 06-Apr-2005 by JAB Find DAC: 06-Apr-2005 by JAB Frequency Response: 06-Apr-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 06-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 31-Mar-2005 Glued the plastic housing of U1331 to its metal clip. 01-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board top and bottom. Notes: 01-Apr-2005 The VCXO top is dull and scratched. There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: D6 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 01-Apr-2005 by JDB Final Assembly: 05-Apr-2005 by JAB Testing: Ohm Meter: 05-Apr-2005 by JAB Initial Power Up: 06-Apr-2005 by JDB Program Board Control PAL: 06-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 06-Apr-2005 by JDB Geographic Address Lines: 06-Apr-2005 by JAB Random Register: 06-Apr-2005 by JAB DAC/ADC Ratio: 06-Apr-2005 by JAB Find DAC: 06-Apr-2005 by JAB Frequency Response: 06-Apr-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 06-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 04-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board top and bottom. Notes: 04-Apr-2005 There is corrosion on the P3 shielding. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: D7 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 12-May-2005 Mechanical Inspection: 04-Apr-2005 by JDB Final Assembly: 05-Apr-2005 by JAB Testing: Ohm Meter: 05-Apr-2005 by JAB Initial Power Up: 06-Apr-2005 by JDB Program Board Control PAL: 06-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 06-Apr-2005 by JDB Geographic Address Lines: 06-Apr-2005 by JAB Random Register: 06-Apr-2005 by JAB DAC/ADC Ratio: 06-Apr-2005 by JAB Find DAC: 06-Apr-2005 by JAB Frequency Response: 06-Apr-2005 by JAB FFT Analysis 12-May-2005 by JAB Channel Link: 06-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 04-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board top and bottom. Notes: 04-Apr-2005 There is corrosion on the P3 shielding. There is a scratch in the circuit board on the bottom near the P3 connector. There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 12-May-2005 The FFTTOOL Analysis has been run using FFTTOOL version 2.0, it passed. =============================================================================== S/N: D8 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 10-May-2005 Mechanical Inspection: 04-Apr-2005 by JDB Final Assembly: 06-Apr-2005 by MN Testing: Ohm Meter: 06-Apr-2005 by JAB Initial Power Up: 07-Apr-2005 by JDB Program Board Control PAL: 07-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 07-Apr-2005 by JDB Geographic Address Lines: 07-Apr-2005 by JAB Random Register: 07-Apr-2005 by JAB DAC/ADC Ratio: 07-Apr-2005 by JAB Find DAC: 07-Apr-2005 by JAB Frequency Response: 07-Apr-2005 by JAB FFT Analysis 07-Apr-2005 by JAB Channel Link: 07-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 04-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top side in the analog and FPGA secitons of the board. 07-Apr-2005 The plastic around the socket for C1 on the P3(connects to VME64X P0) was deformed covering up the socket hole. The plastic covering the socket hole was removed. This connection affect Channel Link 0. SN#D8 passed the Channel Link Test for Channel Link 0 after the repair was made. Notes: 04-Mar-2005 There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There are dull spots on the P3 shielding. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D9 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 10-May-2005 Mechanical Inspection: 05-Apr-2005 by JDB Final Assembly: 06-Apr-2005 by MN Testing: Ohm Meter: 06-Apr-2005 by JAB Initial Power Up: 07-Apr-2005 by JDB Program Board Control PAL: 07-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 07-Apr-2005 by JDB Geographic Address Lines: 07-Apr-2005 by JAB Random Register: 07-Apr-2005 by JAB DAC/ADC Ratio: 07-Apr-2005 by JAB Find DAC: 07-Apr-2005 by JAB Frequency Response: 07-Apr-2005 by JAB FFT Analysis 07-Apr-2005 by JAB Channel Link: 07-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 05-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top side in the analog seciton and on the bottom under the FPGAs and in the analog section. 07-Apr-2005 The plastic around the socket for C1 on the P3(connects to VME64X P0) was deformed covering up the socket hole. The plastic covering the socket hole was removed. This connection affect Channel Link 0. SN#D9 passed the Channel Link Test for Channel Link 0 after the repair was made. Notes: 05-Apr-2005 There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. The casing for I1410 is deformed. There is a v-groove towards one end on the top of the case. There is also a shiny circular depresion. There is a scratch in the circuit board near the P3 connector on the back side. There is some corrosion on the metal casing of the P3 connector. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D10 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 10-May-2005 Mechanical Inspection: 05-Apr-2005 by JDB Final Assembly: 06-Apr-2005 by MN Testing: Ohm Meter: 06-Apr-2005 by JAB Initial Power Up: 07-Apr-2005 by JDB Program Board Control PAL: 07-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 07-Apr-2005 by JDB Geographic Address Lines: 07-Apr-2005 by JAB Random Register: 07-Apr-2005 by JAB DAC/ADC Ratio: 07-Apr-2005 by JAB Find DAC: 07-Apr-2005 by JAB Frequency Response: 07-Apr-2005 by JAB FFT Analysis 07-Apr-2005 by JAB Channel Link: 07-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 05-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top side in the analog and FPGA secitons and on the bottom under the VME interface and in the analog sections. Glued the plastic housing of U1331 to its metal clip. Remove waxy substance on U1031. 07-Apr-2005 The plastic around the socket for C1 on the P3(connects to VME64X P0) was deformed covering up the socket hole. The plastic covering the socket hole was removed. This connection affect Channel Link 0. SN#D9 passed the Channel Link Test for Channel Link 0 after the repair was made. Notes: 05-Apr-2005 There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is waxy substance on U1031. There is white residue on the P3 connector. There is some corrosion on the metal casing of the P3 connector. The plastic casing on U1331 is loose. The label on the inductor is melted. There is a solder ball on pin 42 of U503. It came off easily. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D11 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 10-May-2005 Mechanical Inspection: 05-Apr-2005 by JDB Final Assembly: 06-Apr-2005 by MN Testing: Ohm Meter: 06-Apr-2005 by JAB Initial Power Up: 07-Apr-2005 by JDB Program Board Control PAL: 07-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 10-Apr-2005 by JAB Geographic Address Lines: 10-Apr-2005 by JAB Random Register: 10-Apr-2005 by JAB DAC/ADC Ratio: 10-Apr-2005 by JAB Find DAC: 10-Apr-2005 by JAB Frequency Response: 10-Apr-2005 by JAB FFT Analysis 10-Apr-2005 by JAB Channel Link: 10-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 05-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top side in the FPGA and analog secitons and on the bottom under the FPGA, channel link and in the analog sections. 07-Apr-2005 The plastic around the socket for C1 on the P3(connects to VME64X P0) was deformed covering up the socket hole. The plastic covering the socket hole was removed. This connection affect Channel Link 0. SN#D9 passed the Channel Link Test for Channel Link 0 after the repair was made. Notes: 05-Apr-2005 There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D12 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 10-May-2005 Mechanical Inspection: 05-Apr-2005 by JDB Final Assembly: 06-Apr-2005 by MN Testing: Ohm Meter: 06-Apr-2005 by JAB Initial Power Up: 07-Apr-2005 by JDB Program Board Control PAL: 07-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 10-Apr-2005 by JAB Geographic Address Lines: 10-Apr-2005 by JAB Random Register: 10-Apr-2005 by JAB DAC/ADC Ratio: 10-Apr-2005 by JAB Find DAC: 10-Apr-2005 by JAB Frequency Response: 10-Apr-2005 by JAB FFT Analysis 10-Apr-2005 by JAB Channel Link: 10-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 05-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top side in the analog and FPGA secitons and on the bottom under the VME interface and in the analog sections. 07-Apr-2005 The plastic around the socket for C1 on the P3(connects to VME64X P0) was deformed covering up the socket hole. The plastic covering the socket hole was removed. This connection affect Channel Link 0. SN#D9 passed the Channel Link Test for Channel Link 0 after the repair was made. Notes: 05-Apr-2005 There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. There is a glossy substance on the PAL that wipes off with alcohol. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D13 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 05-Apr-2005 by JDB Final Assembly: 06-Apr-2005 by MN Testing: Ohm Meter: 06-Apr-2005 by JAB Initial Power Up: 07-Apr-2005 by JDB Program Board Control PAL: 07-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 10-Apr-2005 by JAB Geographic Address Lines: 10-Apr-2005 by JAB Random Register: 10-Apr-2005 by JAB DAC/ADC Ratio: 10-Apr-2005 by JAB Find DAC: 10-Apr-2005 by JAB Frequency Response: 10-Apr-2005 by JAB FFT Analysis 10-Apr-2005 by JAB Channel Link: 10-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 05-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole top of the board and in the analog section on the bottom. Notes: 05-Apr-2005 There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. There is a glossy substance on the PAL that wipes off with alcohol. There is a scratch in the board on the bottom near the P3 connector. There is stray solder on a pin pad for the P3 connector near the P2 connector on the bottom. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D14 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 05-Apr-2005 by JDB Final Assembly: 06-Apr-2005 by MN Testing: Ohm Meter: 06-Apr-2005 by JAB Initial Power Up: 07-Apr-2005 by JDB Program Board Control PAL: 07-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 10-Apr-2005 by JAB Geographic Address Lines: 10-Apr-2005 by JAB Random Register: 10-Apr-2005 by JAB DAC/ADC Ratio: 10-Apr-2005 by JAB Find DAC: 10-Apr-2005 by JAB Frequency Response: 10-Apr-2005 by JAB FFT Analysis 10-Apr-2005 by JAB Channel Link: 10-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 05-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. There was one solder ball in the analog section on the top of the board and one in the analog section on the bottom of the board. Notes: 05-Apr-2005 There are two solder balls on the 0603 capacitors where capacitor and circuit board meet. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D15 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 05-Apr-2005 by JDB Final Assembly: 06-Apr-2005 by MN Testing: Ohm Meter: 06-Apr-2005 by JAB Initial Power Up: 07-Apr-2005 by JDB Program Board Control PAL: 07-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 10-Apr-2005 by JAB Geographic Address Lines: 10-Apr-2005 by JAB Random Register: 10-Apr-2005 by JAB DAC/ADC Ratio: 10-Apr-2005 by JAB Find DAC: 10-Apr-2005 by JAB Frequency Response: 10-Apr-2005 by JAB FFT Analysis 10-Apr-2005 by JAB Channel Link: 10-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 05-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured in the analog and FPGA section on the top of the board and in the analog sections on the bottom. There is solder on pin Z21 on the P1 connector (a side swipe). Notes: 05-Apr-2005 There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There are black marks on the metal casing of the P3 connector. There is a glossy substance on the PAL that wipes off with alcohol. There is stray solder on a pin pad for the P3 connector near the P2 connector on the bottom. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D16 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 07-Apr-2005 by JDB Final Assembly: 07-Apr-2005 by JAB Testing: Ohm Meter: 07-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 10-Apr-2005 by JAB Geographic Address Lines: 10-Apr-2005 by JAB Random Register: 10-Apr-2005 by JAB DAC/ADC Ratio: 10-Apr-2005 by JAB Find DAC: 10-Apr-2005 by JAB Frequency Response: 10-Apr-2005 by JAB FFT Analysis 10-Apr-2005 by JAB Channel Link: 10-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 07-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole bottom of the board and in the analog section on top. Removed milky coating over components around U1451. Notes: 07-Apr-2005 There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion and black marks on the metal casing of the P3 connector. There is a glossy substance on the PAL that wipes off with alcohol. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D17 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 07-Apr-2005 by JDB Final Assembly: 07-Apr-2005 by JAB Testing: Ohm Meter: 07-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 10-Apr-2005 by JAB Geographic Address Lines: 10-Apr-2005 by JAB Random Register: 10-Apr-2005 by JAB DAC/ADC Ratio: 10-Apr-2005 by JAB Find DAC: 10-Apr-2005 by JAB Frequency Response: 10-Apr-2005 by JAB FFT Analysis 10-Apr-2005 by JAB Channel Link: 10-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 07-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the the top in the analog and FPGA section and on the bottom in the analog, FPGA, VME, and power sections. Removed milky coating over components around U1451. Glue the plastic housing on U1331 to its metal clip with super glue. Notes: 07-Apr-2005 There are many solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. There is a glossy substance on the PAL that wipes off with alcohol. The plastic housing on U1331 is loose. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D18 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 07-Apr-2005 by JDB Final Assembly: 07-Apr-2005 by JAB Testing: Ohm Meter: 07-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 10-Apr-2005 by JAB Geographic Address Lines: 10-Apr-2005 by JAB Random Register: 10-Apr-2005 by JAB DAC/ADC Ratio: 10-Apr-2005 by JAB Find DAC: 10-Apr-2005 by JAB Frequency Response: 10-Apr-2005 by JAB FFT Analysis 10-Apr-2005 by JAB Channel Link: 10-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 07-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the bottom of the board in the FPGA and analog sections. Notes: 07-Apr-2005 There are few solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion and black marks on the metal casing of the P3 connector. There is a bubble in the board lamination around the mounting hole near coordinates (0,0). The mounting bracket for the front panel flattens this bouble down easily so it is not an issue. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D19 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 07-Apr-2005 by JDB Final Assembly: 07-Apr-2005 by JAB Testing: Ohm Meter: 07-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs __-___-____ by ___ Geographic Address Lines: 10-Apr-2005 by JAB Random Register: 10-Apr-2005 by JAB DAC/ADC Ratio: 10-Apr-2005 by JAB Find DAC: 10-Apr-2005 by JAB Frequency Response: 10-Apr-2005 by JAB FFT Analysis 10-Apr-2005 by JAB Channel Link: 10-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 07-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top of the board in the FPGA and analog sections and on the whole bottom side of the board. Notes: 07-Apr-2005 There are few solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. 08-Apr-2005 The LED test failed because the register controlled PAL LED does not work. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D20 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 07-Apr-2005 by JDB Final Assembly: 07-Apr-2005 by JAB Testing: Ohm Meter: 07-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 11-Apr-2005 by JAB Geographic Address Lines: 11-Apr-2005 by JAB Random Register: 11-Apr-2005 by JAB DAC/ADC Ratio: 11-Apr-2005 by JAB Find DAC: 11-Apr-2005 by JAB Frequency Response: 11-Apr-2005 by JAB FFT Analysis 11-Apr-2005 by JAB Channel Link: 11-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 07-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board on both the top and bottom sides. Add C692. Notes: 07-Apr-2005 There are few solder balls on the 0603 capacitors where capacitor and circuit board meet. C692 appears to have broken off. There is some corrosion on the metal casing of the P3 connector. There is something glossy on the PAL that wipes off with alcohol. 11-Apr-2005 DAC/ADC Ratio failed for channels EM(3,1) -> 7.34, HD(3,1) -> 7.32 the values are just outside the acceptable maximum value 7.32, since the difference is not too big this can be consider to be a passed test, but it could be a spot to look for errors in the future. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D21 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 08-Apr-2005 by JDB Final Assembly: 08-Apr-2005 by JAB Testing: Ohm Meter: 08-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs __-___-____ by ___ Geographic Address Lines: 13-Apr-2005 by JAB Random Register: 13-Apr-2005 by JAB DAC/ADC Ratio: 13-Apr-2005 by JAB Find DAC: 13-Apr-2005 by JAB Frequency Response: 13-Apr-2005 by JAB FFT Analysis 13-Apr-2005 by JAB Channel Link: 13-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 08-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top in the analog and FPGA sections and on the bottom over the whole board. 13-Apr-2005 Fix solder bridge between pins 5 and 6 on N722. Resolder pins 6 and 7 on N752. There was very little solder and it looked as if they may not be connected. Notes: 08-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. There is copper on a power input trace eposed on the bottom of the board near the P3 connector and C1216. There is a potential solder bridge under U353. There is solder visible under pins 41 and 42. 11-Apr-2005 LED for fpga does not work. Channel HD(3,3) has the D9 bit set to zero at all times, Find Dac test failed. The card has been send for further inspection. 13-Apr-2005 The card has been repaired, all the test were executed and all of them successfully passed 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D22 Maestro ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 08-Apr-2005 by JDB Final Assembly: 08-Apr-2005 by JAB Testing: Ohm Meter: 08-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 11-Apr-2005 by JAB Geographic Address Lines: 11-Apr-2005 by JAB Random Register: 11-Apr-2005 by JAB DAC/ADC Ratio: 11-Apr-2005 by JAB Find DAC: 11-Apr-2005 by JAB Frequency Response: 11-Apr-2005 by JAB FFT Analysis 11-Apr-2005 by JAB Channel Link: 11-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 08-Apr-2005 Removed one solderball in the analog section on the top side. Notes: 08-Apr-2005 There was one solder ball in the analog section on the top side. There is some corrosion and black mards on the metal casing of the P3 connector. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 16-May-2005 Add jumpers W1021-W1027 to change SN#D22 into a Maestro ADF-2 card. Confirm that PLL tracks with SCLD input into SN#D22. =============================================================================== S/N: D23 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 10-May-2005 Mechanical Inspection: 08-Apr-2005 by JDB Final Assembly: 08-Apr-2005 by JAB Testing: Ohm Meter: 08-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 11-Apr-2005 by JAB Geographic Address Lines: 11-Apr-2005 by JAB Random Register: 11-Apr-2005 by JAB DAC/ADC Ratio: 11-Apr-2005 by JAB Find DAC: 11-Apr-2005 by JAB Frequency Response: 11-Apr-2005 by JAB FFT Analysis 11-Apr-2005 by JAB Channel Link: 11-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 08-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top in the analog and FPGA sections and on the bottom over the whole board. Notes: 08-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. 05-May-2005 Removed front panel to have silkscreen reworked. 11-May-2005 Added front panel from B12. Front panel relabelled to D23. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE =============================================================================== S/N: D24 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 08-Apr-2005 by JDB Final Assembly: 08-Apr-2005 by JAB Testing: Ohm Meter: 08-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 13-Apr-2005 by JAB Geographic Address Lines: 13-Apr-2005 by JAB Random Register: 13-Apr-2005 by JAB DAC/ADC Ratio: 13-Apr-2005 by JAB Find DAC: 13-Apr-2005 by JAB Frequency Response: 13-Apr-2005 by JAB FFT Analysis 13-Apr-2005 by JAB Channel Link: 13-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 08-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board. 13-Apr-2005 Fix solder bridge between pins 7 and 8 on N53. Notes: 08-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. The top of I1410 is dented. 11-Apr-2005 Channel EM(0,1) has the D8 and D9 bits having the same values at all times all times, DAC/ADC test failed. The card has been send for further inspection. 13-Apr-2005 The card has been repaired, all the test were executed and all of them successfully passed 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D25 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 08-Apr-2005 by JDB Final Assembly: 08-Apr-2005 by JAB Testing: Ohm Meter: 08-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 12-Apr-2005 by JAB Geographic Address Lines: 12-Apr-2005 by JAB Random Register: 12-Apr-2005 by JAB DAC/ADC Ratio: 12-Apr-2005 by JAB Find DAC: 12-Apr-2005 by JAB Frequency Response: 12-Apr-2005 by JAB FFT Analysis 12-Apr-2005 by JAB Channel Link: 12-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 08-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board. Notes: 08-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D26 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 08-Apr-2005 by JDB Final Assembly: 08-Apr-2005 by JAB Testing: Ohm Meter: 08-Apr-2005 by JAB Initial Power Up: 08-Apr-2005 by JDB Program Board Control PAL: 08-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 12-Apr-2005 by JAB Geographic Address Lines: 12-Apr-2005 by JAB Random Register: 12-Apr-2005 by JAB DAC/ADC Ratio: 12-Apr-2005 by JAB Find DAC: 12-Apr-2005 by JAB Frequency Response: 12-Apr-2005 by JAB FFT Analysis 12-Apr-2005 by JAB Channel Link: 12-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 08-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured over the whole board. Notes: 08-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is some corrosion on the metal casing of the P3 connector. The top of I1410 is damaged. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D27 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 21-Apr-2005 by JDB Final Assembly: 22-Apr-2005 by JAB Testing: Ohm Meter: 22-Apr-2005 by JAB Initial Power Up: 22-Apr-2005 by JDB Program Board Control PAL: 22-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 22-Apr-2005 by JDB Geographic Address Lines: 25-Apr-2005 by JAB Random Register: 25-Apr-2005 by JAB DAC/ADC Ratio: 25-Apr-2005 by JAB Find DAC: 25-Apr-2005 by JAB Frequency Response: 25-Apr-2005 by JAB FFT Analysis 25-Apr-2005 by JAB Channel Link: 25-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 21-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the DC/DC convertor, FPGA and analog sections. There were solder balls attached to the board near P2 on the back side. These were removed. They came off easily with very little pressure. Notes: 21-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is something glossy on the PAL that wipes off with alcohol. There is a scratch in the board between P2 and P3. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D28 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 21-Apr-2005 by JDB Final Assembly: 22-Apr-2005 by JAB Testing: Ohm Meter: 22-Apr-2005 by JAB Initial Power Up: 22-Apr-2005 by JDB Program Board Control PAL: 22-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 22-Apr-2005 by JDB Geographic Address Lines: 25-Apr-2005 by JAB Random Register: 25-Apr-2005 by JAB DAC/ADC Ratio: 25-Apr-2005 by JAB Find DAC: 25-Apr-2005 by JAB Frequency Response: 25-Apr-2005 by JAB FFT Analysis 25-Apr-2005 by JAB Channel Link: 25-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 21-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top and bottom in the analog section. There were solder balls attached to the board in the analog section on the back side. These were removed. They came off easily with very little pressure. Notes: 21-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is something glossy on the PAL that wipes off with alcohol. There is a scratch in the board between P2 and P3. The solder mask around the mounting hole near the LEDs is bubbling up a little. There is a scratch in the board near U1454. The sticker on top of U1331 is deformed as if it had been heated up too much. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D29 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 21-Apr-2005 by JDB Final Assembly: 22-Apr-2005 by JAB Testing: Ohm Meter: 22-Apr-2005 by JAB Initial Power Up: 22-Apr-2005 by JDB Program Board Control PAL: 22-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 22-Apr-2005 by JDB Geographic Address Lines: 25-Apr-2005 by JAB Random Register: 25-Apr-2005 by JAB DAC/ADC Ratio: 25-Apr-2005 by JAB Find DAC: 25-Apr-2005 by JAB Frequency Response: 25-Apr-2005 by JAB FFT Analysis 25-Apr-2005 by JAB Channel Link: 25-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 21-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the top in the analog section and on the bottom in the channel link, DC/DC converter, FPGA and analog sections. There is something white on a solder joint of C914. It does not come off with alcohol but comes off easily with a dental tool. Removed excess solder on board near P3 connector on back side. Notes: 21-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a scratch in the board between P2 and P3. The solder mask near C542 is open. There is a scratch in the board near C1202. 22-Apr-2005 Both PAL LEDs appear dim compared to the other LEDs on the board. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D30 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 21-Apr-2005 by JDB Final Assembly: 22-Apr-2005 by JAB Testing: Ohm Meter: 22-Apr-2005 by JAB Initial Power Up: 22-Apr-2005 by JDB Program Board Control PAL: 22-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 22-Apr-2005 by JDB Geographic Address Lines: 25-Apr-2005 by JAB Random Register: 25-Apr-2005 by JAB DAC/ADC Ratio: 25-Apr-2005 by JAB Find DAC: 25-Apr-2005 by JAB Frequency Response: 25-Apr-2005 by JAB FFT Analysis 25-Apr-2005 by JAB Channel Link: 25-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 21-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the FPGA and analog sections Notes: 21-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is something glossy on the PAL that wipes off with alcohol. There is a scratch in the board between P2 and P3. There is a scratch in the board near C809. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D31 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 20-May-2005 Mechanical Inspection: 21-Apr-2005 by JDB Final Assembly: 22-Apr-2005 by JAB Testing: Ohm Meter: 20-May-2005 by JDB Initial Power Up: 22-Apr-2005 by JDB Program Board Control PAL: 22-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 22-Apr-2005 by JDB Geographic Address Lines: 25-Apr-2005 by JAB Random Register: 25-Apr-2005 by JAB DAC/ADC Ratio: 25-Apr-2005 by JAB Find DAC: 25-Apr-2005 by JAB Frequency Response: 25-Apr-2005 by JAB FFT Analysis 25-Apr-2005 by JAB Channel Link: 25-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 21-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the analog section. The plastic case on U1331 is loose. It has been glued to its metal mounting clip with super glue. Notes: 21-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a scratch in the board between P2 and P3. A mounting screw for P1 fell out when the board was removed from the anti-static bag. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: B32 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 26-Apr-2005 by JDB Final Assembly: 26-Apr-2005 by JAB Testing: Ohm Meter: 26-Apr-2005 by JAB Initial Power Up: 27-Apr-2005 by JDB Program Board Control PAL: 27-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 27-Apr-2005 by JAB Geographic Address Lines: 27-Apr-2005 by JAB Random Register: 27-Apr-2005 by JAB DAC/ADC Ratio: 27-Apr-2005 by JAB Find DAC: 27-Apr-2005 by JAB Frequency Response: 27-Apr-2005 by JAB FFT Analysis 27-Apr-2005 by JAB Channel Link: 27-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 26-Apr-2005 Cleaned top of PAL with alcohol and Kim whipe to remove glossy residue. Notes: 26-Apr-2005 The top of I1410 is damaged. There is some glossy substance on the top of the PAL. Cleaned. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D33 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 26-Apr-2005 by JDB Final Assembly: 26-Apr-2005 by JAB Testing: Ohm Meter: 26-Apr-2005 by JAB Initial Power Up: 27-Apr-2005 by JDB Program Board Control PAL: 27-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 27-Apr-2005 by JAB Geographic Address Lines: 27-Apr-2005 by JAB Random Register: 27-Apr-2005 by JAB DAC/ADC Ratio: 27-Apr-2005 by JAB Find DAC: 27-Apr-2005 by JAB Frequency Response: 27-Apr-2005 by JAB FFT Analysis 27-Apr-2005 by JAB Channel Link: 27-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 26-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the Channel Link, PAL, FPGA and analog sections. Notes: 26-Apr-2005 The top of I1410 is damaged. There is corrosion on the P3 shielding. There were solder balls across the board that were removed. See Repair notes. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D34 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 26-Apr-2005 by JDB Final Assembly: 26-Apr-2005 by JAB Testing: Ohm Meter: 26-Apr-2005 by JAB Initial Power Up: 27-Apr-2005 by JDB Program Board Control PAL: 27-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 28-Apr-2005 by JAB Geographic Address Lines: 28-Apr-2005 by JAB Random Register: 28-Apr-2005 by JAB DAC/ADC Ratio: 28-Apr-2005 by JAB Find DAC: 28-Apr-2005 by JAB Frequency Response: 28-Apr-2005 by JAB FFT Analysis 28-Apr-2005 by JAB Channel Link: 28-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 26-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the DC/DC convertor and anaolog sections. Removed solder flakes on back side near P2 and P3. Notes: 26-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is a scratch in the board between P2 and P3. There are solder flakes on the boack of the board near P2 and P3. Removed. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D35 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 26-Apr-2005 by JDB Final Assembly: 26-Apr-2005 by JAB Testing: Ohm Meter: 26-Apr-2005 by JAB Initial Power Up: 27-Apr-2005 by JDB Program Board Control PAL: 27-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 28-Apr-2005 by JAB Geographic Address Lines: 28-Apr-2005 by JAB Random Register: 28-Apr-2005 by JAB DAC/ADC Ratio: 29-Apr-2005 by JDB Find DAC: 29-Apr-2005 by JDB Frequency Response: 29-Apr-2005 by JDB FFT Analysis 29-Apr-2005 by JDB Channel Link: 29-Apr-2005 by JDB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 26-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the analog section. Cleaned the glossy substance off the PAL with alcohol and a Kim wipe. Cleaned white residue from around U355. 29-Apr-2005 Removed solder bridge on N552 between pins 7 and 8. Notes: 26-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There is corrosion on the P3 shielding. There is a glossy substance on the PAL. Cleaned. There is a scratch in the board on the back side between P2 and P3. There are solder flakes on the back side near P2. 28-Apr-2005 DAC/ADC test failed for the channel EM(2,3) noise > 0.5. After running the FFTTOOL it was found that for that channel the bit D9 is set to '0' at all times. The card has been set appart for further inspection. 29-Apr-2005 There is a solder bridge between pins 7 and 8 on N552. Fixed. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D36 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 16-May-2005 Mechanical Inspection: 26-Apr-2005 by JDB Final Assembly: 26-Apr-2005 by JAB Testing: Ohm Meter: 26-Apr-2005 by JAB Initial Power Up: 27-Apr-2005 by JDB Program Board Control PAL: 27-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 28-Apr-2005 by JAB Geographic Address Lines: 28-Apr-2005 by JAB Random Register: 28-Apr-2005 by JAB DAC/ADC Ratio: 28-Apr-2005 by JAB Find DAC: 28-Apr-2005 by JAB Frequency Response: 28-Apr-2005 by JAB FFT Analysis 28-Apr-2005 by JAB Channel Link: 28-Apr-2005 by JAB_ Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 26-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the FPGA and anaolog sections. Removed solder flakes on the back side near P2. Notes: 26-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. There are solder flakes on the back side near P2. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB =============================================================================== S/N: D37 ADF-2 Gain Species: EM: 5.5 HD: 5.5 Date of the latest entry in this card's Trailer Sheet: 31-May-2005 Mechanical Inspection: 26-Apr-2005 by JDB Final Assembly: 26-Apr-2005 by JAB Testing: Ohm Meter: 26-Apr-2005 by JAB Initial Power Up: 27-Apr-2005 by JDB Program Board Control PAL: 27-Apr-2005 by JDB BC_PAL Firmware Version: 16-Feb-2005 VME IO to PAL and FPGAs 28-Apr-2005 by JAB Geographic Address Lines: 28-Apr-2005 by JAB Random Register: 28-Apr-2005 by JAB DAC/ADC Ratio: 28-Apr-2005 by JAB Find DAC: 28-Apr-2005 by JAB Frequency Response: 28-Apr-2005 by JAB FFT Analysis 28-Apr-2005 by JAB Channel Link: 28-Apr-2005 by JAB Pass Final ADF-2 Tests: __-___-2005 by ___ Repairs: 26-Apr-2005 Removed sodler balls over whole board. They were at the joint between the 0603 capacitors and the circuit board. These occured on the bottom in the DC/DC convertor, VME bus drivers/latches and anaolog sections. Notes: 26-Apr-2005 There are solder balls on the 0603 capacitors where capacitor and circuit board meet. The top of I1410 is damaged. There is excess solder on swipe Z20 of P2. 16-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. JDB 31-Apr-2005 Add jumpers W1021-W1027 to change SN#D37 into a Maestro ADF-2 card. Confirm that PLL tracks with SCLD input into SN#D37. 05-May-2005 Removed front panel to have silkscreen reworked. 11-May-2005 Added front panel from B12. Front panel relabelled to D23. 10-May-2005 Install ADF-2 ECO #1 BG_1_IN capacitor C1354. DE