DATE: 22-NOV-2004 TO: Vendor FROM: Dan Edmunds Physics Department Michigan State University RE: Manufacture the raw ADF-2 printed circuit board ------------------------------- --- Good for Production --- ------------------------------- ADF-2 Circuit Board Rev A Manufacturing -------------------------------------------- This bid request is for the manufacture of the raw ADF-2 printed circuit board. This circuit board is in the final stage of design and we hope to be able to provide all of the design data by the first week of November. At this time we would like to purchase 10 good cards plus 2 good or bad cards which would only be used for temperature profile tests by the assembly vendor. We would like to obtain these first 12 cards on a "fast turn around". Later in early January we would like to purchase an additional 90 cards on a standard turn around. A drawing showing the general layout of the ADF-2 card is available on the web as either a pdf or ps file. The top side traces, pads, and silk screen can be seen in the file: www.pa.msu.edu/hep/d0/ftp/run2b/l1cal/hardware/adf_2/drawings/ adf_2_circuit_board_1.pdf adf_2_circuit_board_1.ps Data for Assembly of the ADF-2 Printed Circuit Boards ----------------------------------------------------------- Circuit board name: ADF-2 Quantity: now: 12 cards 10 good cards plus 2 (good or bad for solder tests) early Jan 2005: 90 more good cards Circuit Board Material: G10 (FR4) Overall Circuit Board Thickness: This card should be built to result in a finished board with an thickness in the range 0.090" to 0.115". The intent is to use a standard process for making 12 layer cards so the finished thickness may be adjusted to fit that process. The Top and Bottom edges must be milled to 0.062" thickness by removing material from the SOLDER side of the card. Along the Top and Bottom edges, material is to be removed from the Solder side in a strip 2.0 mm high running the whole way from the front (left side) of the card to the back (right side) of the card. This is to allow the card to fit in standard card guides. See the drawing on the web for an overall view of this card. Copper thickness: 1 oz copper to be used on all 12 layers Overall Circuit Board Size: 160 mm by 233.35 mm 160 mm wide from left to right X dimension 233.35 mm tall Y dimension Layers: 12 total 2 external signal trace layers 5 internal signal trace layers 1 internal mixed signal trace - power plane layer 4 internal power/ground planes Surface Finish: Gold finish on SMD pads to facilitate the best possible chance of proper mounting of the BGA components Solder Mask: There is a Solder Mask on both sides of this card. A different solder mask is used on the component and solder side of the card. The accuracy of the Solder Mask must be compatible with proper assembly of 456 pin BGA with pads on 1.0 mm centers. Silk Screen: On both sides. Holes: There are 6 different hole sizes. Diameter about 0.3 mm. Finished size does not matter. These plated holes are for via connectivity and their drill diameter may be set to maximize manufacturing yield. There are 3533 of these holes. Finished size 0.60 mm +- 0.05 mm. These plated holes are for mounting the press in connector "P3" and for some larger via's. There are 310 of these holes. Finished size 1.00 mm +- 0.1 mm. These plated holes are for mounting the through hole solder in connectors "P1" and "P2". There are 320 of these holes. Finished size 1.00 mm +- 0.05 mm. These Un-Plated holes are for mechanical mounting of the SMD connectors "P4" and "P5". There are 4 of these holes Finished size 1.09 mm +- 0.05 mm. These Un-Plated holes are for mechanical mounting of the SMD LED displays along the front edge of the card. There are 12 of these holes. Finished size 2.7 mm +- 0.1 mm. These Un-Plated holes are for mechanical mounting of connectors "P1" and "P2" and also run along the front edge of the card for mechanical mounting of the front panel. There are 9 of these holes. Manufacturing Tolerances: The tightest tolerances on this card are those required by the 456 pin BGA pad pattern. This involves running a trace between via pads that are spaced 1.0 mm apart. For the BGA design layout in this card I have specified: 0.61 mm diameter via pads 0.30 mm drill hole in the pads 0.13 mm wide trace between via pads With pads on 1.0 mm centers this gives a theoretical clearance of 0.13 mm between the trace and the pad. I'm happy to adjust: pad diameter, drill hole, or trace width to maximize the production yield of this card. In any case I would like you to tell me how I should specify these tight tolerance items in the final draft of this manufacturing data. All other sections of this board have wider traces and wider clearance gaps. Check Plots: I would like to receive "Check Plots" for all layers of this card and be given time to review them before giving the "OK" to begin manufacture of the cards. Testing of the raw PCB's Connectivity testing of the raw pcb's is requested as part of the manufacturing process. Thieving Pattern If a Thieving pattern is required for the proper manufacture of these cards then it is requested that Vendor add that pattern to the design. Assembly of the Board Stack-up Order of the Layers: ------------------------------------------------------- Component Side Silk Screen File Number 13 Component Side Solder Mask File Number 15 Layer 1: Component Side Traces 1 File Number 1 Layer 2: Internal Traces 2 and VEE Plane File Number 2 Layer 3: Ground Plane File Number 3 Layer 4: VCC Planes File Number 4 Layer 5: Internal Traces 3 File Number 5 Layer 6: Internal Traces 4 File Number 6 Layer 7: Internal Traces 5 File Number 7 Layer 8: Internal Traces 6 File Number 8 Layer 9: VDD Planes File Number 9 Layer 10: Ground Plane File Number 3 Layer 11: Internal Traces 7 File Number 11 Layer 12: Solder Side Traces 8 File Number 12 Solder Side Solder Mask File Number 16 Solder Side Silk Screen File Number 14 Note there is no File Number 10. The data for the Layer 10 Ground Plane is the same as for the Layer 3 Ground Plane. Contact and Shipping Information: Daniel Edmunds Physics Department Rm 2150 Bio-Medical Physical Sciences Bldg. Michigan State University East Lansing, MI 48824-2320 Phone: (517) 355-9200 ext 2521 Email: edmunds@pa.msu.edu FAX: (517) 355-6661 Backup Contact: Jason Biel Phone: (517) 355-9200 ext 2520 Email: biel@pa.msu.edu