//   file:  ddr4_96_pin_basic_structure.txt
//
//   date:   24-Dec-2022   Original bga pad only draft
//   date:    2-Mar-2023   Moved to a common set of 0mm8 BGA Pin-Pad Stacks
//                         and move to hand entry of all 96 pins.
//   date:    3-Mar-2023   Expand the component outline to just outside Via Pads.
//   date:   9-Sept-2024   Adjust the Silkscreen outline to fit
//                         the part's  13.0 mm x 7.5 mm size
//   date:  22-Sept-2024   Add on  Sheet_Dielectric_9  lines that separate
//                         the CA, Data L, and Data H  buses so it is easier to see
//
//
//
//   Geometry of the  DDR4 96 Pin  package for the Micron  MT40A1G16.
//
//
//   This is the geometry for the Micron  MT40A1G16  DDR4 SDRAM
//   which is a  16 Gbit part,  i.e.  1 Gig addresses by 16 bits wide.
//   This package has  96 SMD pads,  i.e. 6 Rows of 16 Pins
//
//   This geometry has the long axis of this component on the X axis.
//
//   The overall orientation of this geometry is pin A1 in the
//   North East corner.
//
//
//         T1   R1   .....   B1   A1   <--- pin #1 corner
//         T2   R2   .....   B2   A2
//         T3   R3   .....   B3   A3
//          .    .            .    .         Top-View
//          .    .            .    .         --------
//         T7   R7   .....   B7   A7
//         T8   R8   .....   B8   A8
//         T9   R9   .....   B9   A9
//
//
//   NOTE:  the drawings of this package from Micron are
//          Bottom-View  -  everything here is Top-View
//          and rotated 90 deg CW compared to the drawings
//          in the Micron data sheet.   This rotation is to
//          make it easier to hand enter the 96 pins.
//
//   NOTE:  the ball pitch of this package is  0.80 mm  -  not 1.0 mm.
//
//   As written in this geometry:
//
//      The pin Rows are numbered:  1, 2, 3,  7, 8, 9
//
//      Pin Rows  4, 5, 6  do not exist.
//
//      The pin Columns are designated:   A, B, C, D, E, F, G, H,
//                                        J, K, L, M, N, P, R, T
//
//
//    The Pin Pad Stacks for this Geometry  come from the file:
//
//       bga_0mm8_stack_definitions.txt
//
//


//----------------------------------------------------------------------------
//     Introduction

$abort_enable = @false;
$$lock_windows(@on) ;
$$snap_diagonal(@off) ;
$$snap_orthogonal(@off) ;


//----------------------------------------------------------------------------


//   Now start the actual description of the  DDR4_96_Pin  Rev 1


$$create_component("DDR4_96_Pin", @replace);

$$page(0.0,0.0,0.0, @mm, 0.0, 0.0, [0.0, 0.0, 'CO$DDR4_96_Pin']);

$$point_mode(@vertex);

$$attribute( "COMPONENT_HEIGHT", "3.00", , @scale , , [0.0, 0.0] );


//
//  Component Outline
//
//     The actual  DDR4_96_Pin  package is  13 mm in X
//     by  10 mm in Y.   I will make the Placement Outline
//     only about 0.5 mm bigger than the actual array of pads.
//

$$initial([    6.8,   4.0 ], , @nosnap );
$$terminal([  -6.8,   4.0 ]);
$$terminal([  -6.8,  -4.0 ]);
$$terminal([   6.8,  -4.0 ]);
$$terminal([   6.8,   4.0 ]);

$$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale );



//
//  Silkscreen Content
//


//  Horizontal Lines

$$path( "SILKSCREEN_1", 0.20 , , [ -7.00,  4.20,    6.50,  4.20 ]);
$$path( "SILKSCREEN_1", 0.20 , , [ -7.00, -4.20,    7.00, -4.20 ]);

//  Vertical Lines

$$path( "SILKSCREEN_1", 0.20 , , [ -7.00,  4.20,   -7.00, -4.20 ]);
$$path( "SILKSCREEN_1", 0.20 , , [  7.00,  3.70,    7.00, -4.20 ]);

//  Diagonal Line

$$path( "SILKSCREEN_1", 0.20 , , [  6.50,  4.20,    7.00,  3.70 ]);


$$circle( "SILKSCREEN_1",           7.40,    4.60,   1.0,  0.0);


$$text( "SILKSCREEN_1", "^$ref",  0.0, 5.5, 2.5, @BC, 0, 0.7, 0.20, "std", "None", 0.0, 0.0 );




//  Setup the Local Fiducial Marks
//
//  Place Local Fiducial Marks at:
//    +- 10 mm at the center line of the chip

$$circle( "PAD_1",           10.00,    0.00,   1.0,  0.0);
$$circle( "SOLDER_MASK_1",   10.00,    0.00,   1.3,  0.0);

$$circle( "PAD_1",          -10.00,    0.00,   1.0,  0.0);
$$circle( "SOLDER_MASK_1",  -10.00,    0.00,   1.3,  0.0);




//
//   Add lines on the  Sheet_Dielectric_9  layer so that
//   it is easy to see the boundaries between the:
//   CA, Data L, and Data_H  buses.
//

$$path( "SHEET_DIELECTRIC_9", 0.10 , , [ -0.80,  4.10,   -0.80, -4.10 ]);

$$path( "SHEET_DIELECTRIC_9", 0.10 , , [  2.80,  4.10,    2.80,  0.40 ]);
$$path( "SHEET_DIELECTRIC_9", 0.10 , , [  2.80,  0.40,    3.60, -0.40 ]);
$$path( "SHEET_DIELECTRIC_9", 0.10 , , [  3.60, -0.40,    3.60, -4.10 ]);




//
//  Define the 96  Pin-Pad Stack  locations  aka  the pin list:
//