//
//   file:  qfn_28_pin_hub_geom.txt
//
//   date:   4-Feb-2012   Originally written for the CB_FAN card
//
//          15-Aug-2012   Copied from CB_FAN to CMX and make comsetic changes
//
//          22-Dec-2015   Bring over to the Hub design for the 320 MHz Clock Fanout
//
//          24-Jul-2016   Move to the new one file format for QFN files.
//
//          13-Sep-2016   Move the backside metal for the center thermal/gnd
//                        pad from  Breakout_2  to  Sheet_Dielectric_1.
//                        Handling of the backside metal is described in
//                        the Hub trace routing details file.
//
//          10-Dec-2016   To the Pin/Pad Stack for the Center Thermal Pad Via
//                        geometry add a 0.28 mm diameter flash on PREPREG_5
//                        to indicate the location of a Via that needs to be
//                        Plugged from the Top.   This works because in the Hub
//                        design the QFN-32 package is only instanced on the
//                        top side of the card.
//
//          13-Mar-2017   Change the  Thermal/Ground  via/pins  so that
//                        the SolderMask  is relieved on the Bottom side
//                        of the card.  Recall that this Thermal via/pins
//                        are Plugged from the Top side of the card.
//
//          21-Aug-2023   Bring this geometry from the Hub design to the
//                        Disco design.  Recall that this geometry makes
//                        significant use of special layers.  This use of
//                        special layers is described in the  "Hub trace
//                        routing details file".   Bring these notes over
//                        to the Disco design.  On Disco this geometry is
//                        used for the Emergency Rescue uProcessor
//                        LPC845M301JHI33   in the   HVQFN33  package
//                        which is  5 x 5  and has  32 (33) pins.
//
//          19-Mar-2024   Bring the  qfn_32_pin_hvqfn_geom.txt  geometry to
//                        qfn_28_pin_hub_geom.txt  for use for the Hub Controller
//                        on the Disco-Kraken board.
//
//
//
//   Disco-Kraken Module   QFN 28 pin package  with a  3.10 mm x 3.10 mm Thermal Pad.
//   This is for the Hub Controller   USB2412-DZK  on the Disco-Kraken board.
//
//   Basic Design to fit the recommendations shown in the  USB2412-DZK  datasheet.
//
//
//
//   From  USB2412-DZK  datasheet the basic dimentions are:
//   ------------------------------------------------------
//
//     The external dimensions of the IC Package are:
//        4.9 mm square minimum
//        5.0 mm square nominal
//        5.1 mm square maximum
//
//     Pad pitch is 0.5 mm
//
//     PCB Pad Land recommendataion  0.28 mm max x 0.89 mm max
//
//        I will make the PCB Pads   0.28 mm  x  0.88 mm
//
//     On the IC Package the Inner Edge of its pads are  3.9 mm  apart minimum
//     On the IC Package the Inner Edge of its pads are  4.2 mm  apart nominal
//     On the IC Package the Inner Edge of its pads are  4.5 mm  apart maximum
//
//     Inner Edge to Inner Edge the PCB pads are  3.53 mm  apart minimum
//
//        I will make the Inner Edge of the pads  4.00 mm  apart
//
//        This will make the Outer Edge to Outer Edge the pads  5.76 mm  apart
//
//        ----> pad center to pad center is   4.88 mm
//
//
//     The IC Package Center pad aka Thermal pad is:
//        3.00 mm square minimum
//        3.10 mm square nominal
//        3.20 mm square maximum
//
//     The PCB Center pad aka Thermal pad is  3.10 mm square nominal
//
//
//
//
//
//   Thermal Pad Design in this Geometry:
//   ------------------------------------
//
//     The PCB Thermal Pad is   3.10 mm x 3.10 mm
//
//        This is the nominal PCB Thermal Pad size that the USB2412 recommends.
//        This is also the size of the Thermal Pad on the IC Device itself.
//
//     There are 4 Thermal Vias spaced  0.70 mm in X and Y from 0,0
//
//     These 4 Thermal Vias are component pins:  29:32
//
//     The Solder Mask will be  3.20 mm x 3.20 mm  centered on 0,0
//        i.e. the Solder Mask is 0.05 mm bigger on all edges than the pad.
//
//     All of the  Copper Breakout,  Solder Mask,  and  Solder Stencil
//        (aka Paste Mask)  information for the Thermal Pad is just
//        carried in the body of the geometry,  i.e. it is not
//        associated with a given pin.
//
//     The solder paste stencil has 9 windows:
//
//        The Thermal Pad is  3.10 mm x 3.10 mm    --->  9.610 mm sq
//          60% of this is about                   --->  5.766 mm sq
//          so we need each window to be about     --->  0.641 mm sq
//          on a side each window should br about  --->  0.800 mm
//
//
//        Thus the area of the window opening is  59.94%  of the pcb pad area.
//
//        The edge of the windows is relieved back 0.15 mm
//        from the edges of the pcb thermal pad.
//
//        The solid bar between windows is  0.20 mm  wide.
//
//
//
//   Signal Pad Design in this Geometry:
//   -----------------------------------
//
//     The pcb signal pads are         0.28 mm x 0.88 mm
//
//     The pad center to pad center spacing is   4.88 mm
//
//     The Solder Mask opening is      0.38 mm x 0.98 mm  centered on the pad
//     i.e. 0.05mm greater on all edges
//
//     The Solder Stencil opening is   0.24 mm x 0.84 mm  centered on the pad
//     -->  82% of the area of the pcb pad land
//
//
//   This  QFN_28_Hub  Geometry has Pin #1 in the top lefthand corner.
//
//
//
//   ---------------------------------------------------
//
//     Special Considerations for Using this Geometry:
//   ---------------------------------------------------
//
//     This geometry is only for use on the Top side of the pcb.  <=======
//
//     This geometry uses a number of special layers:
//
//                 PrePreg_5   uses a 0.28 mm  flash to indicate a Via
//                             that is plugged from the Top side of the pcb.
//
//                BREAKOUT_1   is used for the metal on the Top side
//                             of the center Thermal pad.
//
//        SHEET_DIELECTRIC_1   is used for the metal on the Bottom
//                             side of the center Thermal pad.
//
//              Solder_Masks   separate solder_masks are used on the Top
//                             and Bottom sides of the center Thermal pad.
//
//
//
//
//----------------------------------------------------------------------------
//


$abort_enable = @false;
$$lock_windows(@on) ;
$$snap_diagonal(@off) ;
$$snap_orthogonal(@off) ;


//
//----------------------------------------------------------------------------
//


//  Pads with a long Vertical axis.

$$lock_windows(@on);

$$create_pin("QFN_28_Vert_Pad", @replace);

$$page(0.0,0.0,0.0, @mm, 0.0, 0.0, [0.0, 0.0, 'PI$QFN_28_Vert_Pad']);

$$point_mode(@vertex);

$$polygon( "PAD_1", ,         [ 0.14, 0.44,    -0.14, 0.44,    -0.14,  -0.44,    0.14, -0.44 ] );

$$polygon( "SOLDER_MASK_1", , [ 0.19, 0.49,    -0.19, 0.49,    -0.19,  -0.49,    0.19, -0.49 ] );

$$polygon( "PASTE_MASK_1", ,  [ 0.12, 0.42,    -0.12, 0.42,    -0.12,  -0.42,    0.12, -0.42 ] );

$$attribute( "TERMINAL_SURFACE_DEFINITION", "");


//----------------------------------------------------------------------------


//  Pads with a long Horizontal axis.

$$lock_windows(@on);

$$create_pin("QFN_28_Horz_Pad", @replace);

$$page(0.0,0.0,0.0, @mm, 0.0, 0.0, [0.0, 0.0, 'PI$QFN_28_Horz_Pad']);

$$point_mode(@vertex);

$$polygon( "PAD_1", ,         [ 0.44, 0.14,    -0.44, 0.14,    -0.44,  -0.14,    0.44, -0.14 ] );

$$polygon( "SOLDER_MASK_1", , [ 0.49, 0.19,    -0.49, 0.19,    -0.49,  -0.19,    0.49, -0.19 ] );

$$polygon( "PASTE_MASK_1", ,  [ 0.42, 0.12,    -0.42, 0.12,    -0.42,  -0.12,    0.42, -0.12 ] );

$$attribute( "TERMINAL_SURFACE_DEFINITION", "");


//----------------------------------------------------------------------------
//----------------------------------------------------------------------------

//   Through Hole Pin/Pad Stack for the 4 "Thermal Vias"
//   These are component pins 33 through 36.
//
//       0.30 mm  finished hole diameter
//       0.60 mm  land pad
//       0.85 mm  plane relief
//       0.28 mm  PrePreg_5 flash to indicate a
//                via that is plugged from the Top
//       0.55 mm  SolderMask Relief on Side 2
//                (the whole area where these via/pins
//                 are used is relieved on Side 1)
//
//                --> 0.275 mm clearance from edge of drill hole to Planes
//
//                --> for 1.40 mm spacing there is a  0.55 mm wide neck
//                                        in the Ground web between drills
//

$$lock_windows(@on);

$$create_pin( "qfn_28_thd_pin" );

$$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [ 0.0, 0.0, 'PI$qfn_28_thd_pin' ] );

$$point_mode(@vertex); 

$$attribute( "TERMINAL_THRUHOLE_DEFINITION", "");

$$attribute( "TERMINAL_DRILL_SIZE", "", , @scale , , [ 0.30,  0.0 ]);

$$circle( "SIGNAL",                         0.0, 0.0,  0.60,  0.0 );

$$circle( "POWER",                          0.0, 0.0,  0.85,  0.0 );

$$circle( "SOLDER_MASK_2",                  0.0, 0.0,  0.55,  0.0 );

$$circle( "PREPREG_5",                      0.0, 0.0,  0.28,  0.0 );


//----------------------------------------------------------------------------
//----------------------------------------------------------------------------




$$lock_windows(@on) ;

$$create_component("QFN_28_Hub", @replace);

$$page( 0.0, 0.0, 0.0, @mm, 0.0, 0.0, [ 0.0, 0.0, 'CO$QFN_28_Hub' ]);

$$point_mode(@vertex);

$$attribute( "COMPONENT_LAYOUT_SURFACE", "both");

$$attribute( "COMPONENT_HEIGHT", "1.20", , @scale , , [0.0, 0.0] );



//
//  Component Placement Outline for the  QFN-28-Hub
//

$$initial([  -3.00,  -3.00 ], , @nosnap );
$$terminal([ -3.00,   3.00 ] );
$$terminal([  3.00,   3.00 ] );
$$terminal([  3.00,  -3.00 ] );

$$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale );




//  Silkscreen:  Horz Bot,  Vert Right,  Horz Top,  Diag,  Vert Left

$$path( "SILKSCREEN", 0.20 , , [ -3.25, -3.25,    3.25, -3.25 ] );
$$path( "SILKSCREEN", 0.20 , , [ -3.25,  3.25,    3.25,  3.25 ] );
$$path( "SILKSCREEN", 0.20 , , [ -3.25, -3.25,   -3.25,  3.25 ] );
$$path( "SILKSCREEN", 0.20 , , [  3.25, -3.25,    3.25,  3.25 ] );



//  Pin #1 Indicator:

$$circle( "SILKSCREEN_1",    -3.8,   3.8,   0.5,  0.20 );
$$circle( "SILKSCREEN_1",    -3.8,   3.8,   1.0,  0.20 );

//
//   End of Silkscreen
//




//  Reference Designator

$$text( "SILKSCREEN", "^$ref", 0.0, 5.0, 2.0, @CC, 0, 0.7, 0.20, "std", "None", 0.0, 0.0 );




//  Setup the Local Fiducial Marks

//$$circle( "PAD_1",             0.00,    4.50,   1.0,  0.0);
//$$circle( "SOLDER_MASK_1",     0.00,    4.50,   1.3,  0.0);

//$$circle( "PAD_1",             0.00,   -4.50,   1.0,  0.0);
//$$circle( "SOLDER_MASK_1",     0.00,   -4.50,   1.3,  0.0);





//
//   Now place the center  Thermal Pad
//
//     - Copper on      Breakout 1      on the Top Side
//
//     - Copper on  SHEET_DIELECTRIC_1  on the Bottom Side
//
//     - Solder Mask Relief for this Thermal Pad
//       is used only on the Top Side
//
//     - Paste Mask openings
//

$$polygon( "BREAKOUT_1", ,    [ -1.55, -1.55,    1.55, -1.55,     1.55, 1.55,    -1.55, 1.55 ] );

$$polygon( "SOLDER_MASK_1", , [ -1.60, -1.60,    1.60, -1.60,     1.60, 1.60,    -1.60, 1.60 ] );


$$polygon( "PASTE_MASK_1", ,  [ -1.40,  0.60,   -0.60,  0.60,    -0.60,  1.40,    -1.40,  1.40 ] );
$$polygon( "PASTE_MASK_1", ,  [ -0.40,  0.60,    0.40,  0.60,     0.40,  1.40,    -0.40,  1.40 ] );
$$polygon( "PASTE_MASK_1", ,  [  0.60,  0.60,    1.40,  0.60,     1.40,  1.40,     0.60,  1.40 ] );

$$polygon( "PASTE_MASK_1", ,  [ -1.40, -0.40,   -0.60, -0.40,    -0.60,  0.40,    -1.40,  0.40 ] );
$$polygon( "PASTE_MASK_1", ,  [ -0.40, -0.40,    0.40, -0.40,     0.40,  0.40,    -0.40,  0.40 ] );
$$polygon( "PASTE_MASK_1", ,  [  0.60, -0.40,    1.40, -0.40,     1.40,  0.40,     0.60,  0.40 ] );

$$polygon( "PASTE_MASK_1", ,  [ -1.40, -1.40,   -0.60, -1.40,    -0.60, -0.60,    -1.40, -0.60 ] );
$$polygon( "PASTE_MASK_1", ,  [ -0.40, -1.40,    0.40, -1.40,     0.40, -0.60,    -0.40, -0.60 ] );
$$polygon( "PASTE_MASK_1", ,  [  0.60, -1.40,    1.40, -1.40,     1.40, -0.60,     0.60, -0.60 ] );


$$polygon( "SHEET_DIELECTRIC_1", , [ -1.10, -1.10,    1.10, -1.10,     1.10, 1.10,    -1.10, 1.10 ] );





//  Define the pins

//  Pads Along the Left-Hand Edge

$$attribute( "COMPONENT_PIN_DEFINITION",     "1", , @scale , , [ -2.440,  1.50 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "1,  QFN_28_Horz_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",     "2", , @scale , , [ -2.440,  1.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "2,  QFN_28_Horz_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",     "3", , @scale , , [ -2.440,  0.50 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "3,  QFN_28_Horz_Pad");


$$attribute( "COMPONENT_PIN_DEFINITION",     "4", , @scale , , [ -2.440,  0.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "4,  QFN_28_Horz_Pad");


$$attribute( "COMPONENT_PIN_DEFINITION",     "5", , @scale , , [ -2.440, -0.50 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "5,  QFN_28_Horz_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",     "6", , @scale , , [ -2.440, -1.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "6,  QFN_28_Horz_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",     "7", , @scale , , [ -2.440, -1.50 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "7,  QFN_28_Horz_Pad");



//  Pads Along the Bottom Edge

$$attribute( "COMPONENT_PIN_DEFINITION",     "8", , @scale , , [ -1.50, -2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "8,  QFN_28_Vert_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",     "9", , @scale , , [ -1.00, -2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE",  "9,  QFN_28_Vert_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "10", , @scale , , [ -0.50, -2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "10,  QFN_28_Vert_Pad");


$$attribute( "COMPONENT_PIN_DEFINITION",    "11", , @scale , , [ -0.00, -2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "11,  QFN_28_Vert_Pad");


$$attribute( "COMPONENT_PIN_DEFINITION",    "12", , @scale , , [  0.50, -2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "12,  QFN_28_Vert_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "13", , @scale , , [  1.00, -2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "13,  QFN_28_Vert_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "14", , @scale , , [  1.50, -2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "14,  QFN_28_Vert_Pad");



//  Pads Along the Right-Hand Edge

$$attribute( "COMPONENT_PIN_DEFINITION",    "15", , @scale , , [  2.440, -1.50 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "15,  QFN_28_Horz_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "16", , @scale , , [  2.440, -1.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "16,  QFN_28_Horz_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "17", , @scale , , [  2.440, -0.50 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "17,  QFN_28_Horz_Pad");


$$attribute( "COMPONENT_PIN_DEFINITION",    "18", , @scale , , [  2.440,  0.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "18,  QFN_28_Horz_Pad");


$$attribute( "COMPONENT_PIN_DEFINITION",    "19", , @scale , , [  2.440,  0.50 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "19,  QFN_28_Horz_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "20", , @scale , , [  2.440,  1.00 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "20,  QFN_28_Horz_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "21", , @scale , , [  2.440,  1.50 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "21,  QFN_28_Horz_Pad");



//  Pads Along the Top Edge

$$attribute( "COMPONENT_PIN_DEFINITION",    "22", , @scale , , [  1.50,  2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "22,  QFN_28_Vert_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "23", , @scale , , [  1.00,  2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "23,  QFN_28_Vert_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "24", , @scale , , [  0.50,  2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "24,  QFN_28_Vert_Pad");


$$attribute( "COMPONENT_PIN_DEFINITION",    "25", , @scale , , [  0.00,  2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "25,  QFN_28_Vert_Pad");


$$attribute( "COMPONENT_PIN_DEFINITION",    "26", , @scale , , [ -0.50,  2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "26,  QFN_28_Vert_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "27", , @scale , , [ -1.00,  2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "27,  QFN_28_Vert_Pad");

$$attribute( "COMPONENT_PIN_DEFINITION",    "28", , @scale , , [ -1.50,  2.440 ]);
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "28,  QFN_28_Vert_Pad");



//  Center  Pad Array    Thermal Pad    Ground Connection

$$attribute( "COMPONENT_PIN_DEFINITION",    "29", , @scale , , [ -0.70,  0.70 ]);
$$attribute( "COMPONENT_PIN_DEFINITION",    "30", , @scale , , [ -0.70, -0.70 ]);
$$attribute( "COMPONENT_PIN_DEFINITION",    "31", , @scale , , [  0.70, -0.70 ]);
$$attribute( "COMPONENT_PIN_DEFINITION",    "32", , @scale , , [  0.70,  0.70 ]);

$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "29,  qfn_28_thd_pin" );
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "30,  qfn_28_thd_pin" );
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "31,  qfn_28_thd_pin" );
$$attribute( "COMPONENT_PADSTACK_OVERRIDE", "32,  qfn_28_thd_pin" );


//----------------------------------------------------------------------------