// // file: ti_hvssop_10_pin_geom.txt // // date: 21-Apr-2012 Original version for the SN6507 for the DK Board. // // // // This geometry comes from the TI SN6507DGQRQ1 data sheet // // Basic Design: // // This layout will have the long axis of the pads along the // horizontal axis. // // This layout uses a Solder Mask Defined center thermal pad. // // Pin #1 is in the upper lefthand corner NW and the pins // are numbered in the normal CCW direction. // // For now this layout is specific for device placement on the // TOP side of the pcb. For placement on the BOTTOM side one // needs to edit the Via Plugs and to get the Center Thermal Pad // metal correct on the device side and on the oposite side. // // // The SMD Package itself is between 4.74 mm and 5.05 mm in X // (this includes the pins) and between 2.90 mm and 3.10 mm in Y. // // // Pin Pitch is 0.50 mm // // Pad lands are 1.45 mm in X by 0.30 mm in Y // // The centers of Pad Lands are 4.40 mm apart in X. // // Solder Mask is back by 0.05 mm on all edges // // Paste Stencil opening matches the pad land size. // // // // The Center Thermal Pad is Solder Mask Defined. // // The copper for the Thermal Pad is 2.20 mm in X by 3.10 mm in Y // // The Solder Mask Opening for the Thermal Pad is 1.75 mm in X by 2.22 mm in Y // // There are 6 Vias in the Thermal Pad all 0.30 mm diameter (or is it 0.20 mm dia) // // The Thermal Pad Vias are spaced 1.30 mm center to center in X and Y // // The Thermal Pad Paste Stencil is currently set to have just 1 opening // This opening is set to have 90% of the area of the Solder Mask Opening // This Paste Stencil opening is: // // The Solder Mask opening is: 1.75 mm by 2.22 mm 3.885 sq mm // The Paste Stencil opening is: 1.65 mm by 2.12 mm 3.498 sq mm // // // The interior tip of the signal pad land is 0.375 mm from // the thermal pad land, i.e. the air gap between the signal // pad land and the thermal pad land is 0.375 mm. // // // // Lay this out with the Pin #1 in the top left-hand corner, NW corner. // // Label the 6 "Thermal Vias" as component pins: 11:16 // // //---------------------------------------------------------------------------- $abort_enable = @false; $$lock_windows(@on) ; $$snap_diagonal(@off) ; $$snap_orthogonal(@off) ; //---------------------------------------------------------------------------- // Signal Pads with their long axis horizontal $$lock_windows(@on); $$create_pin("HVSSOP_Horz_Pad", @replace); $$page(0.0,0.0,0.0, @mm, 0.0, 0.0, [0.0, 0.0, 'PI$HVSSOP_Horz_Pad']); $$point_mode(@vertex); $$polygon( "PAD_1", , [ 0.43, 0.14, -0.43, 0.14, -0.43, -0.14, 0.43, -0.14 ] ); $$polygon( "SOLDER_MASK_1", , [ 0.48, 0.19, -0.48, 0.19, -0.48, -0.19, 0.48, -0.19 ] ); $$polygon( "PASTE_MASK_1", , [ 0.40, 0.12, -0.40, 0.12, -0.40, -0.12, 0.40, -0.12 ] ); $$attribute( "TERMINAL_SURFACE_DEFINITION", ""); //---------------------------------------------------------------------------- //---------------------------------------------------------------------------- // Through Hole Pin/Pad Stack for the 6 "Thermal Vias" // These are component pins 11 through 16. // // 0.30 mm finished hole diameter // 0.60 mm land pad // 0.85 mm plane relief // 0.28 mm PrePreg_5 flash to indicate a // via that is plugged from the top // // --> 0.275 mm clearance from edge of drill hole to Planes // // --> for 1.00 mm spacing there is a 0.15 mm wide neck // in the Ground web between drills // $$lock_windows(@on); $$create_pin( "HVSSOP_thd_pin" ); $$page(0.0, 0.0, 0.0, @mm, 0.0, 0.0, [ 0.0, 0.0, 'PI$HVSSOP_thd_pin' ] ); $$point_mode(@vertex); $$attribute( "TERMINAL_THRUHOLE_DEFINITION", ""); $$attribute( "TERMINAL_DRILL_SIZE", "", , @scale , , [ 0.30, 0.0 ]); $$circle( "SIGNAL", 0.0, 0.0, 0.60, 0.0 ); $$circle( "POWER", 0.0, 0.0, 0.85, 0.0 ); $$circle( "PREPREG_5", 0.0, 0.0, 0.28, 0.0 ); //---------------------------------------------------------------------------- $$lock_windows(@on) ; $$create_component("HVSSOP_10_Pin", @replace); $$page( 0.0, 0.0, 0.0, @mm, 0.0, 0.0, [ 0.0, 0.0, 'CO$HVSSOP_10_Pin' ]); $$point_mode(@vertex); $$attribute( "COMPONENT_LAYOUT_SURFACE", "both"); $$attribute( "COMPONENT_HEIGHT", "1.20", , @scale , , [0.0, 0.0] ); // // Component Placement Outline for the HVSSOP 10 pin // $$initial([ -2.80, -1.80 ], , @nosnap ); $$terminal([ -2.80, 1.80 ] ); $$terminal([ 2.80, 1.80 ] ); $$terminal([ 2.80, -1.80 ] ); $$attribute( "COMPONENT_PLACEMENT_OUTLINE", "", @mark, @scale ); // // Silkscreen // $$template_line_style( @Solid ); $$initial([ -3.00, -2.00 ], , @nosnap ); $$terminal([ -3.00, 2.00 ] ); $$terminal([ 3.00, 2.00 ] ); $$terminal([ 3.00, -2.00 ] ); $$terminal([ -3.00, -2.00 ] ); $$path( "SILKSCREEN_1", 0.20 ); // Pin #1 Designator $$circle( "SILKSCREEN_1", -3.9, 1.8, 0.5, 0.20 ); $$circle( "SILKSCREEN_1", -3.9, 1.8, 1.0, 0.20 ); // // End of Silkscreen // // Reference Designator $$text( "SILKSCREEN", "^$ref", 0.0, 3.9, 2.0, @CC, 0, 0.7, 0.20, "std", "None", 0.0, 0.0 ); // Setup the Local Fiducial Marks //$$circle( "PAD_1", 0.00, 4.50, 1.0, 0.0); //$$circle( "SOLDER_MASK_1", 0.00, 4.50, 1.3, 0.0); //$$circle( "PAD_1", 0.00, -4.50, 1.0, 0.0); //$$circle( "SOLDER_MASK_1", 0.00, -4.50, 1.3, 0.0); // // Now place the center Thermal Pad // // - Copper on Breakout 1 on the Top Side // // - Copper on SHEET_DIELECTRIC_1 on the Bottom Side // // - Solder Mask Relief for this Thermal Pad // is used only on the Top Side // // - Paste Mask openings // $$polygon( "BREAKOUT_1", , [ -1.10, -1.70, 1.10, -1.70, 1.10, 1.70, -1.10, 1.70 ] ); $$polygon( "SOLDER_MASK_1", , [ -0.88, -1.11, 0.88, -1.11, 0.88, 1.11, -0.88, 1.11 ] ); $$polygon( "PASTE_MASK_1", , [ -0.83, -1.06, 0.83, -1.06, 0.83, 1.06, -0.83, 1.06 ] ); $$polygon( "SHEET_DIELECTRIC_1", , [ -1.10, -1.70, 1.10, -1.70, 1.10, 1.70, -1.10, 1.70 ] ); // Define the pins // Pads Along the Left-Hand Edge $$attribute( "COMPONENT_PIN_DEFINITION", "1", , @scale , , [ -2.20, 1.00 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "2", , @scale , , [ -2.20, 0.50 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "3", , @scale , , [ -2.20, 0.00 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "4", , @scale , , [ -2.20, -0.50 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "5", , @scale , , [ -2.20, -1.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "1, HVSSOP_Horz_Pad"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "2, HVSSOP_Horz_Pad"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "3, HVSSOP_Horz_Pad"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "4, HVSSOP_Horz_Pad"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "5, HVSSOP_Horz_Pad"); // Pads Along the Right-Hand Edge $$attribute( "COMPONENT_PIN_DEFINITION", "6", , @scale , , [ 2.20, -1.00 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "7", , @scale , , [ 2.20, -0.50 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "8", , @scale , , [ 2.20, 0.00 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "9", , @scale , , [ 2.20, 0.50 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "10", , @scale , , [ 2.20, 1.00 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "6, HVSSOP_Horz_Pad"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "7, HVSSOP_Horz_Pad"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "8, HVSSOP_Horz_Pad"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "9, HVSSOP_Horz_Pad"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "10, HVSSOP_Horz_Pad"); // // Now the 6 Thermal Vias in the center for the Thermal Pad // $$attribute( "COMPONENT_PIN_DEFINITION", "11", , @scale , , [ -0.65, 1.30 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "12", , @scale , , [ 0.65, 1.30 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "13", , @scale , , [ -0.65, 0.00 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "14", , @scale , , [ 0.65, 0.00 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "15", , @scale , , [ -0.65, -1.30 ]); $$attribute( "COMPONENT_PIN_DEFINITION", "16", , @scale , , [ 0.65, -1.30 ]); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "11, HVSSOP_thd_pin"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "12, HVSSOP_thd_pin"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "13, HVSSOP_thd_pin"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "14, HVSSOP_thd_pin"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "15, HVSSOP_thd_pin"); $$attribute( "COMPONENT_PADSTACK_OVERRIDE", "16, HVSSOP_thd_pin"); //----------------------------------------------------------------------------