DATE:  22-Nov-2011

TO:    Assembly Vendor

FROM:  Dan Edmunds
       Physics Department
       Michigan State University
       East Lansing, MI   48824-2320
       Phone: (517) 884-5521
       Email  Edmunds@pa.msu.edu

RE:    Assemble quantity 25 of the
       MEZ-456  Printed Circuit Boards


                  --------------------------------
                  --          Good for          --
                  --                            --
                  --   Circuit Board Assembly   --
                  --------------------------------


     Data for Assembling the   MEZ-456   Circuit Board
   -----------------------------------------------------

  Circuit board name:  MEZ-456

  Number of circuit boards to be assembled:  25

  All components on the MEZ-456 circuit boards mount on the
  top surface.   All components are SMD type.

  The total number of components placed on each MEZ=456 card
  by the assembly vendor is  81   they are:

      1  FPGA Integrated Circuit  BGA 456 pin 1mm array
      1  PROM Integrated Circuit  TSSOP-20 package
      2  Power Regulator ICs  TO-263 package
      4  Tantalum Capacitors D Case
      4  Tantalum Capacitors B Case
     44  Ceramic Capacitors  0603 size  of 3 different values
      2  Diodes  SOT-23-3 package
      1  Connector 2x20 2mm header with alignment pins
      2  LEDs smd package
     20  Resistors  0603 size  of 4 different values


  The Bottom side of the MEZ-456 card has 400 gold contact
  pads that must remain clean and free of solder during the
  assembly process.

  Overall Circuit Board Size:  95 mm  by  95 mm

  There is only one versions of the MEZ-456 card to be built.

  There are no other assembly steps or testing that we expect
  the assembly vendor to perform.

  MSU will provide a kit of all of the components that are
  required for the assembly of the MEZ-456 cards.

  We anticipate that all components will be supplied to the
  assembly vendor on Tape and Real.  We understand that there
  may be an additional "taping charge" for any components that
  we do not supply on tape and real.

  First Article:  We do not require a "first article" card for
  this build but we are prepared to immediately examine and test
  a first article card if you prefer to make one.

  Design data that we can provide:

      Bill of materials for all components that the assembly
      vendor will install.

      Assembly drawings showing all components with reference
      designators for the top side of the card.

      Component placement location file giving the orientation
      and the x,y location of the center of each SMD component.
      This is filename:   mez_456_component_placement_data.txt

      All design data is in mm.   The 0,0 origin of the card is
      in its lower left hand corner which is marked with a "BL".

      Solder paste gerber file.  Currently the window openings
      in the solder paste mask are set to be the same size as
      the pads that they cover.  I'm happy to adjust the window
      opening size in the paste mask to whatever specification
      the assembly vendor recommends.  There is only a top
      side paste mask.

      Please specify any other design data that you would like
      and we will work to get the information together.

  Anticipated Schedule:

      We will deliver the parts kit to assembly vendor by mid
      December 2011.

      Delivery of the 25 assembled cards should be scheduled
      for mid January 2012.


Contact and Shipping Information:

      Daniel Edmunds
      Physics Department   Rm 2150
      Bio-Medical Physical Sciences Bldg.
      Michigan State University
      East Lansing, MI  48824-2320

      Phone: (517) 884-5521
      Email: edmunds@pa.msu.edu
      FAX:   (517) 355-6661

Backup Contact:

      Philippe Laurens
      Phone: (517) 884-5522