DATE: 22-Nov-2011 TO: PCB Vendor FROM: Dan Edmunds Physics Department Michigan State University East Lansing, MI 48824-2320 Phone: (517) 884-5521 Email Edmunds@pa.msu.edu RE: Manufacture quantity 25 of the MEZ-456 Printed Circuit Boards -------------------------------- -- Good for -- -- -- -- Bare PCB Manufacture -- -------------------------------- Data for Manufacturing the Bare MEZ-456 Circuit Board ------------------------------------------------------------- Circuit board name: MEZ-456 Quantity: 25 cards Circuit Board Material: FR4 All design data is in mm. Overall Circuit Board Thickness: nominal 1.6 mm ( 0.0625 inch ) This card may be made thicker if that makes the manufacturing process easier. Copper thickness: 1 oz copper on all 8 layers Circuit Board Size: This board is rectangular 95 mm x 95 mm Layers: There are a total of 8 layers: 4 Trace and 4 Planes Plating: The bottom side of this card needs gold plating on the 400 pads that are exposed through the solder mask. These pads are contacts for a Samtec type FSI connectors. The Samtec specification says the the gold plating is to be: 0.000030 inches i.e. 30 micro-inches with a hardness of 120-200 Knoop per ASTM B 488 Type 2 Grade C. The top side of this card has a 456 pin BGA part. If gold plating the pads on the top side of this card would help insure proper soldering of this BGA part then I would like to consider gold plating both surfaces. In any case, the top side of the card needs the proper surface treatment to ensure the good soldering of all the SMD parts including the 456 pin BGA. Solder Mask: Both Sides Silk Screen: Both Sides Paste Mask: There is a Paste Mask for the Top Side only. Holes: There are 5 different hole sizes. Diameter Drill Finished Position Size mm Count Function -------- -------- ----- -------------------- 1 0.30 923 small via with 0.65 mm land and BGA array via with 0.61 mm land Plated 2 0.60 21 larger via with 1.1mm land Plated 3 1.00 2 2x20 connector alignment holes Not Plated 4 1.19 8 Samtec FSI Connector alignment Not Plated 5 2.54 12 Samtec FSI Connector Screws Not Plated The size of the 0.30mm and 0.60mm holes (drill positions 1 and 2) may be adjusted by the pcb vendor to maximize the yield from manufacturing these cards. These 2 holes sizes are for electrical connectivity only. Gerber Files: PCB File Name Layer Description Data Type --------- ----- ----------- --------- artwork_1 1 Top Side traces and pads Positive artwork_2 2 layer 2 traces Positive artwork_3 3 Ground Plane NEGATIVE artwork_4 4 Power Plane Fill Vdd Positive artwork_5 5 layer 5 traces Positive artwork_6 6 layer 6 traces Positive artwork_7 7 Power Plane Fill Vint Positive artwork_8 8 Bottom Side Ground Plane and Positive the J1, J2, J3, J4 gold pads artwork_9 Solder Mask Top Side NEGATIVE artwork_10 Solder Mask Bottom Side NEGATIVE artwork_11 Silkscreen Top Side Positive artwork_12 Silkscreen Bottom Side Positive artwork_13 Paste Mask Top Side Positive artwork_14 Test Plot - Board Outline with Positive Dimensions, Top Silkscreen, and Pads MEZ-456 PCB Stack-up: ASSEMBLY OF THE BOARD Order of the Layers: --------------------------------------------- Top Side Silk Screen File Number 11 Top Side Solder Mask File Number 9 Layer 1: Top Side traces and pads File Number 1 Layer 2: Layer 2 traces File Number 2 Layer 3: Ground Plane File Number 3 Layer 4: Power Plane Fill Vdd File Number 4 Layer 5: Layer 5 traces File Number 5 Layer 6: Layer 6 traces File Number 6 Layer 7: Power Plane Fill Vint File Number 7 Layer 8: Ground Plane and gold pads File Number 8 Bottom Side Solder Mask File Number 10 Bottom Side Silk Screen File Number 12 Contact and Shipping Information: Daniel Edmunds Physics Department Rm 2150 Bio-Medical Physical Sciences Bldg. Michigan State University East Lansing, MI 48824-2320 Phone: (517) 884-5521 Email: edmunds@pa.msu.edu FAX: (517) 355-6661 Backup Contact: Philippe Laurens Phone: (517) 884-5522