DATE: 14-June-2010 TO: Hughes Electronics FROM: Dan Edmunds Physics Department Michigan State University RE: Manufacture the raw WRP-16 printed circuit board WRP-16 Circuit Board Manufacturing -------------------------------------- This note is the instructions for the manufacture of the WRP-16 circuit boards. A general assembly drawing showing the layout of the WRP-16 card is available in the Gerber file: wrp_16_art_11 This instruction file, the Gerber files, and the drill file for the WRP-16 circuit board are available on the web at: http://www.pa.msu.edu/~edmunds/LArTPC/Bo_Cold_DAQ/WRP_16_Release_1/ Data for Manufacture of the WRP-16 Printed Circuit Boards --------------------------------------------------------------- Circuit board name: WRP-16 All design data is in mm. Quantity Ordered: 12 good cards Circuit Board Material: normal "G-10" FR-4 Overall Circuit Board Size: 160 mm by 233 mm 160 mm wide from left to right X dimension 233 mm tall Y dimension The 0,0 origin of the card is in its lower left hand corner. Overall Circuit Board Thickness: A nominal final thickness of 1.6 mm (0.062") is fine for this board. Layers: 4 Copper thickness: 1 oz copper on all 4 layers Dielectric thickness: I would like approximately the same thickness for all 3 dielectric layers, about 0.5 mm or 20 mils for each layer. Surface Finish: Leveled solder finish appropriate for surface mount component assembly Solder Mask: There is a Solder Mask on both sides of this card. Silk Screen: There is a Silk Screen on both sides. Holes: There are 8 different hole sizes. ALL holes are plated. Diameter 0.30 mm. Finished size is not critical. These plated holes are for via connectivity and their drill diameter may be set to maximize the board manufacturing yield. The pad diameter of the vias that use this drill size is 0.65 mm. There are 112 of these holes. Diameter 0.60 mm. Finished size is not critical. These plated holes are for via connectivity and their drill diameter may be set to maximize the board manufacturing yield. The pad diameter of the vias that use this drill size is 1.10 mm. There are 248 of these holes. Finished size 0.64 mm. These plated holes are for the pins of a 50 pin 3M connector. There are 50 of these holes. Finished size 0.70 mm. These plated holes are for the pins of a 36 pin 3M connector. There are 36 of these holes. Finished size 1.00 mm. These plated holes are for various through hole components and connectors. There are 24 of these holes. Finished size 2.77 mm. These plated holes are for mounting the 50 pin 3M connector reference designator J1. All ground planes flood these holes. There are 2 of these holes. Finished size 3.20 mm. These plated holes are for mounting the 36 pin 3M connector reference designator J2. All ground planes flood these holes. There are 2 of these holes. Finished size 3.50 mm These plated holes are for the mechanical mounting of the circuit board. All ground planes flood these holes. There are 12 of these holes. Assembly of the Board Stack-up Order of the Layers: -------------------------------------------------------------- Top Side Silk Screen File Number 7 Top Side Solder Mask File Number 5 Layer 1: Top Side Traces and plane File Number 1 Layer 2: Internal ground plane File Number 2 Layer 3: Internal traces and plane File Number 3 Layer 4: Bottom Side Traces and plane File Number 4 Bottom Side Solder Mask File Number 6 Bottom Side Silk Screen File Number 8 Design Files Delivered to the PCB Manufacturer ------------------------------------------------------------------ wrp_16_art_1 Top side traces, pads, and plane Layer 1 wrp_16_art_2 Ground plane - negative data Layer 2 wrp_16_art_3 Traces and plane Layer 3 wrp_16_art_4 Bottom side traces, pads, and plane Layer 4 wrp_16_art_5 Top side Solder Mask wrp_16_art_6 Bottom side Solder Mask wrp_16_art_7 Top side Silkscreen wrp_16_art_8 Bottom side Silkscreen wrp_16_art_9 Top side Paste Mask (not used for raw pcb) wrp_16_art_10 Bottom side Paste Mask (not used for raw pcb) wrp_16_art_11 Dimensioned Assembly Drawing (shows top side) wrp_16_drill Drill data Contact and Shipping Information: Daniel Edmunds Physics Department Rm 2150 Bio-Medical Physical Sciences Bldg. Michigan State University East Lansing, MI 48824-2320 Phone: (517) 884-5521 Email: edmunds@pa.msu.edu FAX: (517) 355-6661 Backup Contact: Philippe Laurens Phone: (517) 884-5522