DATE: 17-Mar-2020 TO: Hughes Electronics FROM: Dan Edmunds Physics Department Michigan State University RE: Manufacture the bare "Inst" circuit board Inst Circuit Board Manufacturing ----------------------------------- This note is the details for the manufacture the bare "Inst" printed circuit board. A dimensioned layout drawing of the Inst pcb is available in the Gerber file: artwork_5_inst This instruction file, the Gerber files, and the drill file for the Inst circuit board are available on the web: https://web.pa.msu.edu/people/edmunds/SET/Inst/ Data for Manufacture of the Inst PCB ------------------------------------------------- Circuit board name: Inst All design data is in mm Quantity Ordered: 5 cards Layer Count: 4 Circuit Board Material: normal FR-4 Overall Circuit Board Size: 31 mm x 19 mm 31 mm wide X dimension 19 mm tall Y dimension The 0,0 origin is the card's lower left hand corner. Overall Circuit Board Thickness: nominal 1.6 mm (62 mils) Copper weight: 1 oz or 2 oz copper on all 4 layers Surface Finish: Leveled solder finish appropriate for surface mount component assembly Solder Mask: There is a Solder Mask on both sides Silk Screen: There is a Silk Screen on both sides Holes: There are 3 different hole sizes Drill #1 Plated Nominal Dia. 0.50 mm Count 22 These holes are for vias with 1.00 mm pads. These holes may close in during plating. Drill #2 Plated Nominal Dia. 1.00 mm Count 9 These holes for THD components with typical lead diameter of 0.6 mm. Pads are 1.8 mm dia. Drill #3 Non-Plated Nominal Dia. 2.30 mm Count 1 This non-plated hole is for a 2-56 mounting screw. Board Layers and Files: Assembly of the Board Stack-up Order of the Layers: ------------------------------------------------------------ Top Side Silk Screen File Number 8 Top Side Solder Mask File Number 6 Layer 1: Top Side Traces & SMD Pads File Number 1 Layer 2: Ground Plane Negative data File Number 2 Layer 3: Power Fill Planes File Number 3 Layer 2: Bottom Side Traces & SMD Pads File Number 4 Bottom Side Solder Mask File Number 7 Bottom Side Silk Screen File Number 9 Design File-Names Delivered to the PCB Manufacturer ------------------------------------------------------------ artwork_1_inst Top side Traces & SMD Pads L1 artwork_2_inst Ground Plane Negative Data L2 artwork_3_inst Power Fill Planes L3 artwork_4_inst Bottom side Traces & SMD Pads L4 artwork_5_inst Dimensioned Drawing (shows top side) artwork_6_inst Top side Solder Mask artwork_7_inst Bottom side Solder Mask artwork_8_inst Top side Silkscreen artwork_9_inst Bottom side Silkscreen drill_inst Drill data plated & un-plated Contact and Shipping Information: Daniel Edmunds Physics Department Rm 2150 Bio-Medical Physical Sciences Bldg. Michigan State University East Lansing, MI 48824-2320 Phone: (517) 884-5521 Email: edmunds@pa.msu.edu FAX: (517) 355-6661 Backup Contact: Philippe Laurens Phone: (517) 884-5522