DATE: 4-Mar-2020 TO: Hughes Electronics FROM: Dan Edmunds Physics Department Michigan State University RE: Manufacture the bare "Signal Filter" circuit board Signal Filter Circuit Board Manufacturing -------------------------------------------- This note is the details for the manufacture the bare "Signal Filter" printed circuit board. A dimensioned layout drawing of the Signal Filter pcb is available in the Gerber file: artwork_3_sig_fltr This instruction file, the Gerber files, and the drill file for the Signal Filter circuit board are available on the web: https://web.pa.msu.edu/people/edmunds/SET/Signal_Filter/ Data for Manufacture of the Signal Filter PCB --------------------------------------------------- Circuit board name: Signal Filter All design data is in mm Quantity Ordered: 4 cards Layer Count: 2 Circuit Board Material: normal "G-10" FR-4 Overall Circuit Board Size: 180 mm x 100 mm 180 mm wide X dimension 100 mm tall Y dimension The 0,0 origin is the card's lower left hand corner. Overall Circuit Board Thickness: nominal 1.6 mm (62 mils) Copper weight: 1 oz or 2 oz copper on both layers Surface Finish: Leveled solder finish appropriate for surface mount component assembly Solder Mask: There is a Solder Mask on both sides Silk Screen: There is a Silk Screen on both sides Holes: There are 5 different hole sizes Drill #1 Plated Nominal Dia. 0.60 mm Count 32 These holes are for vias into the top side Ground Plane. Drill #2 Plated Nominal Dia. 1.00 mm Count 38 These holes are for THD components with typical lead diameters of 0.5 mm. Drill #3 Plated Nominal Dia. 1.10 mm Count 41 These holes are for THD components with typical lead diameters of 0.6 mm. Drill #4 Plated Nominal Dia. 1.30 mm Count 24 These holes are for THD components with typical lead diameters of 0.8 mm. Drill #5 Non-Plated Nominal Dia. 3.00 mm Count 6 These non-plated holes are for 4-40 mounting screws. Board Layers and Files: Assembly of the Board Stack-up Order of the Layers: ------------------------------------------------------------ Top Side Silk Screen File Number 6 Top Side Solder Mask File Number 4 Layer 1: Top Side Plane & few Traces File Number 1 Layer 2: Bottom Side Traces & SMD Pads File Number 2 Bottom Side Solder Mask File Number 5 Bottom Side Silk Screen File Number 7 Design File-Names Delivered to the PCB Manufacturer ------------------------------------------------------------ artwork_1_sig_fltr Top side Plane & few Traces L1 artwork_2_sig_fltr Bottom side Traces & SMD Pads L2 artwork_3_sig_fltr Dimensioned Drawing (shows top side) artwork_4_sig_fltr Top side Solder Mask artwork_5_sig_fltr Bottom side Solder Mask artwork_6_sig_fltr Top side Silkscreen artwork_7_sig_fltr Bottom side Silkscreen drill_sig_fltr Drill data plated & un-plated Contact and Shipping Information: Daniel Edmunds Physics Department Rm 2150 Bio-Medical Physical Sciences Bldg. Michigan State University East Lansing, MI 48824-2320 Phone: (517) 884-5521 Email: edmunds@pa.msu.edu FAX: (517) 355-6661 Backup Contact: Philippe Laurens Phone: (517) 884-5522