Manufacturing Instructions for the A-Card --------------------------------------========--- Circuit board name: A_Card Rev A Quantity to be Manufactured: 20 boards Circuit Board Material: G10 (FR4) Overall Circuit Board Thickness: This circuit board should have a nominal thickness of 0.062 inch. Overall Circuit Board Size: 3.500" x 9.000" rectangular board. There are no cutouts or special shapes. The board outline, as indicated by the center of the line drawn in the Test Plot, indicates the real finished board size. Layers: 6: 2 external signal trace layers 4 internal power/ground planes Copper thickness: 1 oz copper to be used on both layers Solder Mask: BOTH SIDES Different solder masks are used on the component and solder sides. Use a Liquid Photo Imagable solder mask. Solder plating: Only the area of copper NOT covered by the solder mask should be solder plated. (i.e. Solder Mask over Bare Copper). Silk Screen: BOTH SIDES Different silk screens are used on the component and solder sides. Holes: There are 3 different hole sizes. FINISHED Hole Size Count --------- ----- 0.013" 173 0.040 417 0.113 8 Delivery Schedule: 5 days after approval of photo-plots Gerber File vs Baord Layer ---------------------------------------------- File Name Contents Location in Board Stack -------------- ---------------------------- --------------------------- ArtWork_01.Grb Test plot of board outline ArtWork_02.Grb Component side Traces & Pads Component Side ArtWork_03.Grb GND Plane #1 Comp Side GND Next to Component Side ArtWork_04.Grb VCC, +5V, and +6V Planes Next to Next to Comp Side ArtWork_05.Grb VTT, VEE, and -5V Planes Next to Next to Solder Side ArtWork_06.Grb GND Plane #2 Solder Side GND Next to Solder Side ArtWork_07.Grb Solder side Traces & Pads Solder Side ArtWork_08.Grb Component side Silkscreen On the Component Side ArtWork_09.Grb Solder side Silkscreen On the Solder Side ArtWork_10.Grb Solder Mask Component Side On the Component Side ArtWork_11.Grb Solder Mask Solder Side On the Solder Side The planes layers, i.e. files 3, 4, 5, and 6 are supplied as negative data. These layers are mostly planes of copper that cover the entire area of the board. The Solder Mask, i.e. file 10, and 11 are is also supplied as negative data. All of the 33 mil via's are completely covered by solder mask. All other files are positive data. A-Card Aperture Table ------------------------- Please refer to the APERTURE.TXT file on the disk A-Card Drill Table -------------------------- Please refer to the DRILL.TXT file on the disk If there are any questions please contact: Dan Edmunds Physics Department Michigan State University East Lansing, MI 48824-1116 Phone: (517) 355-8525 Email Edmunds@pa.msu.edu FAX: (517) 355-6661 The check copies of the photoplots and finished cards should be SHIPPED to: Daniel Edmunds 211 Physics/Astronomy Building Michigan State University East Lansing, MI 48824-1116 This order should be BILLED to: Accounts Payable 366 Administration Building Michigan State University East Lansing, MI 48824 This is Michigan State University Purchase Order Number: 39572