Manufacturing Instructions for the ROCK Card --------------------------------------======-------- Circuit board name: "ROCK" Rev. A Quantity to be Manufactured: 5 boards Circuit Board Material: G10 (FR4) Overall Circuit Board Thickness: This circuit board should have a nominal thickness of 0.062 inch. Overall Circuit Board Size: 3.800" x 2.200" rectangular board. This board has an internal rectangular cutout that is 0.650" x 0.650" in size. The walls of this hole need to be plated. The board outline, as indicated by the center of the line drawn in the Test Plot, indicates the real finished board size. Plating of the board edge: We would like the edges of this board plated to make an electrical connection between the ground plane on the component side and the ground plane on the solder side. Layers: 6: 2 external pad and ground plane layers 3 internal power/ground planes 1 internal signal trace layer Copper thickness: 1 oz copper to be used on all layers Solder Mask: NO solder mask is used on this card. Solder plating: This board should be solder plated. The component side silk screen is put on over the component side solder plating. There is no solder mask. Silk Screen: Component side only Holes: There are 3 different hole sizes. FINISHED Hole Size Count --------- ----- 0.013" 91 0.035 122 0.090 10 Delivery Schedule: 5 days after approval of photo-plots Gerber File vs Baord Layer ---------------------------------------------- File Name Contents Location in Board Stack Data ---------- ----------------------------- ----------------------- ---- Art_01.Grb Test plot of board outline - Pos Art_02.Grb Comp side Traces Pads & Plane Layer 1 Component Side Neg Art_03.Grb Power Plane, +5V Anl & Dig Layer 2 Neg Art_04.Grb Ground Plane #1 Layer 3 Neg Art_05.Grb Signal Traces Layer 4 Pos Art_06.Grb Ground Plane #2 Layer 5 Neg Art_07.Grb Solder side Pads & Plane Layer 6 Solder Side Neg Art_08.Grb Component side Silkscreen On the Component Side Pos 5 of the 6 layers in this board are planes of copper that cover almost the entire area of the board. The component side layer (Artwork_02) is a ground plane with embedded pads and short traces that run from SMD pads to via's. Layer #2 (Artwork_03) is a split analog digital power plane. Layer #3 (Artwork_04) is a ground plane. Layer #4 (Artwork_05) is the signal traces layer. Layer #5 (Artwork_06) is a ground plane. Layer #6 (Artwork_07) is a ground plane with embedded pads. The planes layers, i.e. files Artwork: 2, 3, 4, 6, and 7 are all supplied as negative data. These layers are mostly planes of copper that cover almost the entire area of the board. The test plot (file Artwork_1), the trace layer (layer #4 file Artwork_5), and the silkscreen (file Artwork_8) are supplied as positive data. Rock Card Aperture Table ----------------------------- Please refer to the APERTURE.TXT file on the disk Note that when ploting files Artwork_2 and Artwork_7 the definition of apertures D16 and D18 changes from that needed for plotting the other 6 files. Rock Card Drill Table ----------------------------- Please refer to the DRILL.TXT file on the disk If there are any questions please contact: Dan Edmunds Physics Department, Rm 211 Michigan State University East Lansing, MI 48824-1116 Phone: (517) 355-8525 Email Edmunds@pa.msu.edu FAX: (517) 355-6661 The check copies of the photoplots and finished cards should be SHIPPED to: Daniel Edmunds 211 Physics/Astronomy Building Michigan State University East Lansing, MI 48824-1116 This order should be BILLED to: Accounts Payable 366 Administration Building Michigan State University East Lansing, MI 48824 This is Michigan State University Purchase Order Number: The PO should be issued by Sept 17th.